DE69318487D1 - Halbleiterlaservorrichtung, optische Vorrichtung und Herstellungsverfahren - Google Patents
Halbleiterlaservorrichtung, optische Vorrichtung und HerstellungsverfahrenInfo
- Publication number
- DE69318487D1 DE69318487D1 DE69318487T DE69318487T DE69318487D1 DE 69318487 D1 DE69318487 D1 DE 69318487D1 DE 69318487 T DE69318487 T DE 69318487T DE 69318487 T DE69318487 T DE 69318487T DE 69318487 D1 DE69318487 D1 DE 69318487D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- semiconductor laser
- optical device
- laser device
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1861—Reflection gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
- G02B5/188—Plurality of such optical elements formed in or on a supporting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
- H01S3/0811—Construction or shape of optical resonators or components thereof comprising three or more reflectors incorporating a dispersive element, e.g. a prism for wavelength selection
- H01S3/0812—Construction or shape of optical resonators or components thereof comprising three or more reflectors incorporating a dispersive element, e.g. a prism for wavelength selection using a diffraction grating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/065—Mode locking; Mode suppression; Mode selection ; Self pulsating
- H01S5/0651—Mode control
- H01S5/0653—Mode suppression, e.g. specific multimode
- H01S5/0654—Single longitudinal mode emission
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
- Optical Head (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4211069A JP2871320B2 (ja) | 1992-08-07 | 1992-08-07 | 半導体レーザデバイス |
JP4211070A JP2768154B2 (ja) | 1992-08-07 | 1992-08-07 | 光学デバイスとその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69318487D1 true DE69318487D1 (de) | 1998-06-18 |
DE69318487T2 DE69318487T2 (de) | 1998-12-24 |
Family
ID=26518414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69318487T Expired - Fee Related DE69318487T2 (de) | 1992-08-07 | 1993-08-04 | Halbleiterlaservorrichtung, optische Vorrichtung und Herstellungsverfahren |
Country Status (3)
Country | Link |
---|---|
US (1) | US5373519A (de) |
EP (1) | EP0582958B1 (de) |
DE (1) | DE69318487T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0709938B1 (de) * | 1994-10-31 | 2002-01-16 | Matsushita Electric Industrial Co., Ltd | Vorrichtung zur Wellenleiterkopplung, Vorrichtung zur Strahlbündelung, und Gerät für optische Platten |
EP0766115B1 (de) * | 1995-09-26 | 1999-11-24 | C.R.F. Società Consortile per Azioni | Beleuchtungssystem mit integriertem Mikroteleskop in einer durchsichtigen Platte |
IT1281360B1 (it) * | 1995-09-26 | 1998-02-18 | Fiat Ricerche | Sistema di illuminazione a microtelescopio integrato in una lastra trasparente |
US6324149B1 (en) * | 1997-05-27 | 2001-11-27 | Ricoh Company, Ltd. | Optical-pick-up device achieving accurate positioning of objective lens and solid-immersion lens and method of forming same |
JP3248526B2 (ja) * | 1998-09-11 | 2002-01-21 | キヤノン株式会社 | 回折光学素子及びそれを有した光学系 |
US6674709B1 (en) * | 1999-04-23 | 2004-01-06 | Matsushita Electric Industrial Co., Ltd. | Optical head apparatus |
US6483635B1 (en) * | 2000-06-07 | 2002-11-19 | Cirrex Corp. | Apparatus for light amplification |
US20020050519A1 (en) | 2000-10-26 | 2002-05-02 | Oliva Guido M. | Laser module for reading optical codes |
DE60021580T2 (de) * | 2000-10-26 | 2006-05-24 | Datalogic S.P.A., Lippo Di Calderara Di Reno | Optische Vorrichtung zum Aussenden/Detektieren eines Lichtsignals und Schutz-/Isolationsgehäuse für eine Lichtquelle |
KR100438701B1 (ko) * | 2001-09-17 | 2004-07-05 | 삼성전자주식회사 | 호환형 광픽업 및 그 광축을 맞추기 위한 조정방법 |
US7061949B1 (en) * | 2002-08-16 | 2006-06-13 | Jds Uniphase Corporation | Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth |
JP2004288674A (ja) * | 2003-03-19 | 2004-10-14 | Fuji Xerox Co Ltd | 面発光型半導体レーザおよびそれを用いた光通信システム |
US20050190811A1 (en) * | 2004-02-26 | 2005-09-01 | Gruhlke Russell W. | External cavity laser and method for selectively emitting light based on wavelength using aberration-corrected focusing diffractive optical element |
US7901870B1 (en) | 2004-05-12 | 2011-03-08 | Cirrex Systems Llc | Adjusting optical properties of optical thin films |
EP1622205A3 (de) * | 2004-07-29 | 2006-02-08 | Schott AG | Gehäuse für elektronische Bauteile, die kodierte optische Signale senden und/oder empfangen. |
US7565084B1 (en) | 2004-09-15 | 2009-07-21 | Wach Michael L | Robustly stabilizing laser systems |
US7450623B2 (en) * | 2005-04-12 | 2008-11-11 | Eric G. Johnson | Wavelength locked laser including integrated wavelength selecting total internal reflection (TIR) structure |
HUE051418T2 (hu) * | 2011-06-10 | 2021-03-01 | Schott Ag | Átvezetés |
CN102570248B (zh) * | 2011-09-28 | 2014-05-07 | 北京国科世纪激光技术有限公司 | 光路调节模块及激光器 |
CN103368069A (zh) * | 2012-03-30 | 2013-10-23 | 福州高意通讯有限公司 | 一种降低高阶模的激光器结构 |
US9390926B2 (en) * | 2013-03-11 | 2016-07-12 | Applied Materials, Inc. | Process sheet resistance uniformity improvement using multiple melt laser exposures |
US10054720B2 (en) * | 2015-02-02 | 2018-08-21 | Apple Inc. | Fresnel lens barrier rings |
JP2019160859A (ja) * | 2018-03-08 | 2019-09-19 | 豊田合成株式会社 | 発光装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5861692A (ja) * | 1981-10-07 | 1983-04-12 | Kokusai Denshin Denwa Co Ltd <Kdd> | 半導体レ−ザ装置 |
JPS60185922A (ja) * | 1984-03-06 | 1985-09-21 | Asahi Optical Co Ltd | 半導体レ−ザ用光学系 |
US4763334A (en) * | 1985-01-30 | 1988-08-09 | Ricoh Company, Ltd. | Laser beam emitting apparatus |
CA1258906A (en) * | 1985-04-22 | 1989-08-29 | Hiroshi Oinoue | Semiconductor laser apparatus for optical head |
JPS6338272A (ja) * | 1986-08-04 | 1988-02-18 | Omron Tateisi Electronics Co | 光半導体装置 |
US4873697A (en) * | 1986-09-29 | 1989-10-10 | Siemens Aktiengesellschaft | Narrowband laser transmitter having an external resonator from which the output power can be taken |
JPS63164033A (ja) * | 1986-12-26 | 1988-07-07 | Matsushita Electric Ind Co Ltd | 光ピツクアツプ装置 |
JPH01157585A (ja) * | 1987-12-15 | 1989-06-20 | Omron Tateisi Electron Co | 半導体レーザ装置 |
US4934784A (en) * | 1989-03-20 | 1990-06-19 | Kaptron, Inc. | Hybrid active devices coupled to fiber via spherical reflectors |
JPH03116992A (ja) * | 1989-09-29 | 1991-05-17 | Toshiba Corp | 半導体レーザ装置 |
US5138495A (en) * | 1990-07-27 | 1992-08-11 | Matsushita Electric Industrial Co., Ltd. | Diffractive optical lens |
GB2256500A (en) * | 1991-05-03 | 1992-12-09 | Minnesota Mining & Mfg | Diffractive mirror having diffractive zones seperated by optical steps |
-
1993
- 1993-08-04 EP EP93112488A patent/EP0582958B1/de not_active Expired - Lifetime
- 1993-08-04 DE DE69318487T patent/DE69318487T2/de not_active Expired - Fee Related
- 1993-08-05 US US08/102,622 patent/US5373519A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69318487T2 (de) | 1998-12-24 |
EP0582958A2 (de) | 1994-02-16 |
US5373519A (en) | 1994-12-13 |
EP0582958B1 (de) | 1998-05-13 |
EP0582958A3 (en) | 1994-07-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |