DE69302006D1 - Athermalisierte Lichtquelle mit Kollimatoranordnung - Google Patents
Athermalisierte Lichtquelle mit KollimatoranordnungInfo
- Publication number
- DE69302006D1 DE69302006D1 DE69302006T DE69302006T DE69302006D1 DE 69302006 D1 DE69302006 D1 DE 69302006D1 DE 69302006 T DE69302006 T DE 69302006T DE 69302006 T DE69302006 T DE 69302006T DE 69302006 D1 DE69302006 D1 DE 69302006D1
- Authority
- DE
- Germany
- Prior art keywords
- athermalized
- light source
- collimator arrangement
- collimator
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Head (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/996,225 US5270870A (en) | 1992-12-23 | 1992-12-23 | Athermalized beam source and collimator lens assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69302006D1 true DE69302006D1 (de) | 1996-05-02 |
DE69302006T2 DE69302006T2 (de) | 1996-10-24 |
Family
ID=25542642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69302006T Expired - Fee Related DE69302006T2 (de) | 1992-12-23 | 1993-12-21 | Athermalisierte Lichtquelle mit Kollimatoranordnung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5270870A (de) |
EP (1) | EP0604335B1 (de) |
JP (1) | JPH06215398A (de) |
DE (1) | DE69302006T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06132613A (ja) * | 1992-10-14 | 1994-05-13 | Fujitsu Ltd | 半導体レーザ装置 |
US5515391A (en) * | 1994-03-07 | 1996-05-07 | Sdl, Inc. | Thermally balanced diode laser package |
US5655189A (en) * | 1994-05-27 | 1997-08-05 | Kyocera Corporation | Image device having thermally stable light emitting/receiving arrays and opposing lenses |
US5993934A (en) * | 1997-08-06 | 1999-11-30 | Eastman Kodak Company | Near zero CTE carbon fiber hybrid laminate |
US6108145A (en) * | 1999-05-21 | 2000-08-22 | Lockheed Martin Corporation | Thermal loading retainer |
US6525802B1 (en) | 1999-11-05 | 2003-02-25 | Nikon Corporation | Kinematic mounted reference mirror with provision for stable mounting of alignment optics |
US6381387B1 (en) | 2000-08-02 | 2002-04-30 | Networks Photonics, Inc. | Athermalization of a wavelength routing element |
US6717159B2 (en) | 2000-10-18 | 2004-04-06 | Nikon Corporation | Low distortion kinematic reticle support |
JP2005197659A (ja) * | 2003-12-08 | 2005-07-21 | Sony Corp | 光学装置及び画像生成装置 |
DE102005037631A1 (de) * | 2005-08-09 | 2007-02-15 | Hilti Corporation | Justierbare optische Baugruppe |
CN101657750B (zh) * | 2007-02-28 | 2011-06-08 | 康宁股份有限公司 | 整体式光学安装件 |
JP5588358B2 (ja) * | 2008-02-29 | 2014-09-10 | コーニング インコーポレイテッド | キネマティック光学マウント |
US8490678B2 (en) * | 2008-06-02 | 2013-07-23 | Gerald Ho Kim | Silicon-based thermal energy transfer device and apparatus |
DE102008027721A1 (de) * | 2008-06-11 | 2009-12-17 | Hella Kgaa Hueck & Co. | Optisches System mit einer Einrichtung zur Kompensation thermischer Einflüsse |
US8238401B2 (en) * | 2008-08-25 | 2012-08-07 | Gerald Ho Kim | Silicon-based lens support structure for diode laser |
US8742385B2 (en) | 2011-01-26 | 2014-06-03 | Honeywell Asca Inc. | Beam distortion control system using fluid channels |
JP6076151B2 (ja) * | 2012-12-06 | 2017-02-08 | 三菱電機株式会社 | 光モジュール及び光伝送方法 |
US10473304B1 (en) | 2016-10-04 | 2019-11-12 | Lumileds Llc | Reducing thermal sensitivity of a lighting arrangement |
DE102017117135A1 (de) | 2017-07-28 | 2019-01-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Mehrzahl von Laserdioden und Laserdiode |
DE102017223149B3 (de) | 2017-12-19 | 2018-09-13 | Robert Bosch Gmbh | Kameragehäuse, Kameramodul und Kamera |
CN110634279B (zh) * | 2019-09-09 | 2020-10-09 | 浙江永贵电器股份有限公司 | 基于avr单片机的非接触式自学习恶劣环境温度采集器 |
CN113534575A (zh) * | 2020-04-21 | 2021-10-22 | 晋城三赢精密电子有限公司 | 镜头模组及电子装置 |
CN112099175B (zh) * | 2020-08-31 | 2022-07-29 | 西安空间无线电技术研究所 | 一种光学天线离焦弓形双金属热补偿装置 |
DE102021108441A1 (de) | 2021-04-01 | 2022-10-06 | Schott Ag | Befestigungsvorrichtung für ein temperaturstabiles, transparentes Element, sowie Partikelsensor, umfassend die Befestigungsvorrichtung |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB127800A (en) * | 1918-10-09 | 1919-06-12 | Optique & De Mecanique De Haut | Improved Apparatus for Rendering the True or Apparent Focal Length of Objectives Independent of Changes of Temperature. |
ZA711015B (en) * | 1970-03-10 | 1971-12-29 | Parkson Corp | Process for preparing superphosphoric acid |
JPS5419757A (en) * | 1977-07-14 | 1979-02-14 | Olympus Optical Co Ltd | Lens prevented from being out of focus due to temperature change |
JPS58203405A (ja) * | 1982-05-22 | 1983-11-26 | Minolta Camera Co Ltd | レンズ系の温度補償機構 |
JPS5915206A (ja) * | 1982-07-17 | 1984-01-26 | Canon Inc | レ−ザユニツト |
US4525745A (en) * | 1982-10-22 | 1985-06-25 | General Electric Company | Temperature compensation for TV projection lens and CRT assembly |
JPS5994891A (ja) * | 1982-11-24 | 1984-05-31 | Hitachi Ltd | 半導体レ−ザ装置 |
DE3413748A1 (de) * | 1984-04-12 | 1985-10-17 | Telefunken electronic GmbH, 7100 Heilbronn | Optisches system |
JPS61116306A (ja) * | 1984-10-19 | 1986-06-03 | Fuji Photo Film Co Ltd | 結像レンズの保持装置 |
US4656635A (en) * | 1985-05-01 | 1987-04-07 | Spectra-Physics, Inc. | Laser diode pumped solid state laser |
US4730335A (en) * | 1986-06-26 | 1988-03-08 | Amoco Corporation | Solid state laser and method of making |
DD250784A1 (de) * | 1986-07-01 | 1987-10-21 | Zeiss Jena Veb Carl | Optische anordnung mit radialer und axialer temperaturkompensation |
JPS63155012A (ja) * | 1986-12-19 | 1988-06-28 | Toshiba Corp | 非球面レンズの取付方法 |
SE458072B (sv) * | 1987-07-03 | 1989-02-20 | Ericsson Telefon Ab L M | Anordning foer att vid varierande temperatur haalla en optisk lins i oenskat laege i en linsfattning |
US4948221A (en) * | 1988-08-30 | 1990-08-14 | Eastman Kodak Company | Athermalized optical head |
US4993801A (en) * | 1989-12-27 | 1991-02-19 | Eastman Kodak Company | Optical head |
US5210650A (en) * | 1992-03-31 | 1993-05-11 | Eastman Kodak Company | Compact, passively athermalized optical assembly |
-
1992
- 1992-12-23 US US07/996,225 patent/US5270870A/en not_active Expired - Fee Related
-
1993
- 1993-11-05 JP JP5276923A patent/JPH06215398A/ja active Pending
- 1993-12-21 DE DE69302006T patent/DE69302006T2/de not_active Expired - Fee Related
- 1993-12-21 EP EP93420505A patent/EP0604335B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0604335B1 (de) | 1996-03-27 |
EP0604335A1 (de) | 1994-06-29 |
DE69302006T2 (de) | 1996-10-24 |
JPH06215398A (ja) | 1994-08-05 |
US5270870A (en) | 1993-12-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |