DE69222109D1 - Polyhydrisches Phenol und damit hergestellter Epoxydharz - Google Patents

Polyhydrisches Phenol und damit hergestellter Epoxydharz

Info

Publication number
DE69222109D1
DE69222109D1 DE69222109T DE69222109T DE69222109D1 DE 69222109 D1 DE69222109 D1 DE 69222109D1 DE 69222109 T DE69222109 T DE 69222109T DE 69222109 T DE69222109 T DE 69222109T DE 69222109 D1 DE69222109 D1 DE 69222109D1
Authority
DE
Germany
Prior art keywords
epoxy resin
resin made
polyhydric phenol
polyhydric
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69222109T
Other languages
English (en)
Other versions
DE69222109T2 (de
Inventor
Kazuo Takebe
Takashi Morimoto
Yutaka Shiomi
Yasuhide Sugiyama
Shigeki Naitoh
Noriaki Saito
Shuichi Kanagawa
Kunimasa Kamio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP26365891A external-priority patent/JPH0597946A/ja
Priority claimed from JP13060092A external-priority patent/JPH05320320A/ja
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of DE69222109D1 publication Critical patent/DE69222109D1/de
Application granted granted Critical
Publication of DE69222109T2 publication Critical patent/DE69222109T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
DE69222109T 1991-10-11 1992-10-08 Polyhydrisches Phenol und damit hergestellter Epoxydharz Expired - Fee Related DE69222109T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26365891A JPH0597946A (ja) 1991-10-11 1991-10-11 フエノール類とナフトアルデヒド類との縮合物、そのグリシジルエーテル化物及びエポキシ樹脂組成物
JP13060092A JPH05320320A (ja) 1992-05-22 1992-05-22 エポキシ樹脂組成物及び樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
DE69222109D1 true DE69222109D1 (de) 1997-10-16
DE69222109T2 DE69222109T2 (de) 1998-01-29

Family

ID=26465691

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69222109T Expired - Fee Related DE69222109T2 (de) 1991-10-11 1992-10-08 Polyhydrisches Phenol und damit hergestellter Epoxydharz

Country Status (8)

Country Link
US (1) US5478871A (de)
EP (1) EP0536748B1 (de)
KR (1) KR100225166B1 (de)
CA (1) CA2079821A1 (de)
DE (1) DE69222109T2 (de)
MY (1) MY108461A (de)
SG (1) SG50417A1 (de)
TW (1) TW206247B (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG87725A1 (en) * 1992-09-21 2002-04-16 Sumitomo Bakelite Co Epoxy resin composition
DE4310525A1 (de) * 1993-03-31 1994-10-06 Basf Lacke & Farben Dreilagiges Metallrohrbeschichtungsmittel sowie Verfahren zur Außenbeschichtung von Metallrohren im Dreilagenverfahren
TW475926B (en) * 1996-06-06 2002-02-11 Sumitomo Chemical Co Novel ester compound and thermosetting resin composition using the same
US6201094B1 (en) * 1998-09-22 2001-03-13 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
US6239248B1 (en) * 1998-09-22 2001-05-29 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
US6001950A (en) 1998-09-22 1999-12-14 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
JP3707043B2 (ja) * 1999-03-18 2005-10-19 三菱瓦斯化学株式会社 プリント配線板用プリプレグ及び積層板
US6379800B1 (en) 2000-06-05 2002-04-30 Borden Chemical, Inc. Glyoxal-phenolic condensates with enhanced fluorescence
CN100434449C (zh) * 2000-06-05 2008-11-19 禾逊专业化学公司 荧光性提高的乙二醛-酚缩合物
JP2002037859A (ja) * 2000-07-19 2002-02-06 Sumitomo Chem Co Ltd 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
US6660811B2 (en) * 2001-01-30 2003-12-09 Dainippon Ink And Chemicals, Inc. Epoxy resin composition and curing product thereof
US7569260B2 (en) * 2003-08-21 2009-08-04 Asahi Kasei Chemicals Corporation Photosensitive composition and cured products thereof
US7348100B2 (en) * 2003-10-21 2008-03-25 Valence Technology, Inc. Product and method for the processing of precursors for lithium phosphate active materials
CN102741315B (zh) * 2010-01-29 2014-12-03 日本化药株式会社 酚化合物、环氧树脂、环氧树脂组合物、预浸料及它们的固化物
CN103282396B (zh) * 2010-12-28 2015-03-18 三菱瓦斯化学株式会社 芳烃树脂、光刻法用底层膜形成组合物以及形成多层抗蚀图案的方法
EP2716671B1 (de) * 2011-06-03 2018-10-10 Mitsubishi Gas Chemical Company, Inc. Phenolharz und material zur bildung eines unterschichtfilms für die lithographie
EP2826777B1 (de) 2012-03-14 2020-08-05 Korea Institute of Industrial Technology Epoxidverbindung mit alkoxysilylgruppe, diese enthaltende zusammensetzung, gehärtetes produkt, dessen verwendung sowie verfahren zur herstellung einer epoxyverbindung mit einer alkoxysilylgruppe
WO2015141427A1 (ja) * 2014-03-20 2015-09-24 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂、その製造方法、硬化性組成物、レジスト用組成物及びカラーレジスト
JP6992932B2 (ja) * 2019-10-25 2022-02-03 Dic株式会社 多官能フェノール樹脂、多官能エポキシ樹脂、それらを含む硬化性樹脂組成物及びその硬化物
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1187232A (en) * 1980-04-17 1985-05-14 John R. Blickensderfer Phenolic friction particles
JPS62167318A (ja) * 1986-01-20 1987-07-23 Teijin Ltd エポキシ樹脂の硬化方法
JPS6225116A (ja) * 1986-07-17 1987-02-03 Agency Of Ind Science & Technol 新規ポリグリシジルエ−テルから得られる樹脂
JPH01271415A (ja) * 1988-04-22 1989-10-30 Dainippon Ink & Chem Inc 熱硬化性エポキシ樹脂組成物
JP2628099B2 (ja) * 1989-08-18 1997-07-09 武田薬品工業株式会社 軟質ウレタンフォームの製造法
JP2679010B2 (ja) * 1989-08-23 1997-11-19 工業技術院長 有機強磁性体及びその製造方法
US4960634A (en) * 1990-03-14 1990-10-02 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof

Also Published As

Publication number Publication date
US5478871A (en) 1995-12-26
KR930007997A (ko) 1993-05-20
EP0536748B1 (de) 1997-09-10
TW206247B (de) 1993-05-21
EP0536748A1 (de) 1993-04-14
CA2079821A1 (en) 1993-04-12
SG50417A1 (en) 1998-07-20
DE69222109T2 (de) 1998-01-29
KR100225166B1 (ko) 1999-10-15
MY108461A (en) 1996-09-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SUMITOMO CHEMICAL CO. LTD., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee