DE69128370D1 - Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens - Google Patents
Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des VerfahrensInfo
- Publication number
- DE69128370D1 DE69128370D1 DE69128370T DE69128370T DE69128370D1 DE 69128370 D1 DE69128370 D1 DE 69128370D1 DE 69128370 T DE69128370 T DE 69128370T DE 69128370 T DE69128370 T DE 69128370T DE 69128370 D1 DE69128370 D1 DE 69128370D1
- Authority
- DE
- Germany
- Prior art keywords
- splitting
- carrying
- brittle plate
- brittle
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- General Physics & Mathematics (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9000655 | 1990-03-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69128370D1 true DE69128370D1 (de) | 1998-01-22 |
DE69128370T2 DE69128370T2 (de) | 1998-06-04 |
Family
ID=19856782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69128370T Expired - Fee Related DE69128370T2 (de) | 1990-03-21 | 1991-03-18 | Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens |
Country Status (4)
Country | Link |
---|---|
US (1) | US5132505A (de) |
EP (1) | EP0448168B1 (de) |
JP (1) | JPH04224091A (de) |
DE (1) | DE69128370T2 (de) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0639572A (ja) * | 1991-01-11 | 1994-02-15 | Souei Tsusho Kk | ウェハ割断装置 |
RU2024441C1 (ru) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
DE4214159C1 (de) * | 1992-04-30 | 1993-11-18 | Schott Glaswerke | Verfahren zum Erzeugen von Bruchspannungen in Glas |
DE4305107C2 (de) * | 1993-02-19 | 1995-02-23 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Schneiden eines spröden Körpers mit Laserstrahlung |
DE4305106C2 (de) * | 1993-02-19 | 1995-02-02 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Schneiden eines spröden Körpers mit Laserstrahlung |
EP0738241B1 (de) * | 1993-04-02 | 1998-08-26 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Verfahren zum schneiden von hohlglas |
US5387776A (en) * | 1993-05-11 | 1995-02-07 | General Electric Company | Method of separation of pieces from super hard material by partial laser cut and pressure cleavage |
US5581971A (en) * | 1994-09-16 | 1996-12-10 | Alumet Manufacturing, Inc. | Glass spacer bar for use in multipane window construction and method of making the same |
DE4434648A1 (de) * | 1994-09-28 | 1996-04-04 | Glaswerke H U Kl Ritzenhoff Gm | Verfahren zum Absprengen einer Glaskuppe von einem dünnwandigen geblasenen Glas |
IT1284082B1 (it) * | 1996-06-27 | 1998-05-08 | Calp Spa | Metodo e dispositivo per il taglio mediante un raggio laser di articoli cavi in vetro |
KR100218580B1 (ko) * | 1996-07-09 | 1999-09-01 | 구자홍 | 고 밀도 대형 액정 표시 장치 제조 방법 |
MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
KR100267711B1 (ko) * | 1998-04-06 | 2000-10-16 | 노건일 | 피라미드 미러를 이용한 광폭 레이저 빔 가공장치 |
US6259058B1 (en) | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
US6420678B1 (en) | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
US6252197B1 (en) | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
KR100553119B1 (ko) * | 1999-01-15 | 2006-02-22 | 삼성전자주식회사 | 레이저를 이용한 절단장치 |
US6327875B1 (en) * | 1999-03-09 | 2001-12-11 | Corning Incorporated | Control of median crack depth in laser scoring |
US6795274B1 (en) | 1999-09-07 | 2004-09-21 | Asahi Glass Company, Ltd. | Method for manufacturing a substantially circular substrate by utilizing scribing |
US6664503B1 (en) | 1999-09-07 | 2003-12-16 | Asahi Glass Company, Ltd. | Method for manufacturing a magnetic disk |
CN1413136A (zh) | 1999-11-24 | 2003-04-23 | 应用光子学公司 | 非金属材料的分离方法和装置 |
DE19963939B4 (de) * | 1999-12-31 | 2004-11-04 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
DE10014788A1 (de) * | 2000-03-24 | 2001-10-11 | Schott Spezialglas Gmbh | Verfahren zum Herstellen von Displays |
US20020006765A1 (en) * | 2000-05-11 | 2002-01-17 | Thomas Michel | System for cutting brittle materials |
JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
JP2004515366A (ja) * | 2000-12-15 | 2004-05-27 | エルツェットハー レーザーツェントルム ハノーファー エー ファウ | ガラス、セラミック、ガラスセラミック等製の各構成部品を、切断領域で前記構成部品に熱応力による引きつれ割れを生じることによって切断する方法 |
KR100845391B1 (ko) | 2001-07-25 | 2008-07-09 | 블라디미르 스테파노비치 콘드라텐코 | 깨어지기 쉬운 비금속 물질의 절단방법(두가지의 변형) |
CN100485902C (zh) | 2002-03-12 | 2009-05-06 | 浜松光子学株式会社 | 基板的分割方法 |
ATE493226T1 (de) | 2002-03-12 | 2011-01-15 | Hamamatsu Photonics Kk | Verfahren zum schneiden eines bearbeiteten objekts |
TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
KR100948914B1 (ko) * | 2002-11-15 | 2010-03-24 | 주식회사 포스코 | 레이져 용접기의 반사장치 |
TWI520269B (zh) | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
FR2852250B1 (fr) * | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
WO2004080643A1 (ja) * | 2003-03-12 | 2004-09-23 | Hamamatsu Photonics K.K. | レーザ加工方法 |
DE10330179A1 (de) * | 2003-07-02 | 2005-01-20 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zum Trennen flacher Werkstücke aus Keramik |
DE102004014276A1 (de) * | 2004-03-22 | 2005-10-13 | Grenzebach Maschinenbau Gmbh | Verfahren zum Laserschneiden von Flachglas |
DE102004014277A1 (de) * | 2004-03-22 | 2005-10-20 | Fraunhofer Ges Forschung | Verfahren zum laserthermischen Trennen von Flachgläsern |
DE102004024475A1 (de) * | 2004-05-14 | 2005-12-01 | Lzh Laserzentrum Hannover E.V. | Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien |
SG156607A1 (en) * | 2004-07-30 | 2009-11-26 | Mitsuboshi Diamond Ind Co Ltd | Method for forming median crack in substrate and apparatus for forming median crack in substrate |
US7820941B2 (en) * | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
US20060021977A1 (en) * | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
WO2006025994A2 (en) * | 2004-08-31 | 2006-03-09 | Gyrotron Technology, Inc. | A method of separating non-metallic material using microwave radiation |
US20080236199A1 (en) * | 2005-07-28 | 2008-10-02 | Vladislav Sklyarevich | Method of Separating Non-Metallic Material Using Microwave Radiation |
DE102006018622B3 (de) * | 2005-12-29 | 2007-08-09 | H2B Photonics Gmbh | Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material |
CA2560238A1 (en) * | 2006-09-20 | 2008-03-20 | Institut National D'optique | Laser-based ablation method and optical system |
EP1990168B1 (de) * | 2007-05-10 | 2012-06-27 | Grenzebach Maschinenbau GmbH | Verfahren zum laserthermischen Trennen von keramischem oder anderem spröden Plattenmaterial |
DE102008007632A1 (de) * | 2008-02-04 | 2009-08-06 | Limo Patentverwaltung Gmbh & Co. Kg | Verfahren zum Laserschneiden eines nichtmetallischen Werkstücks |
JP5345334B2 (ja) * | 2008-04-08 | 2013-11-20 | 株式会社レミ | 脆性材料の熱応力割断方法 |
US8245540B2 (en) * | 2009-02-24 | 2012-08-21 | Corning Incorporated | Method for scoring a sheet of brittle material |
US8269138B2 (en) | 2009-05-21 | 2012-09-18 | Corning Incorporated | Method for separating a sheet of brittle material |
US8932510B2 (en) * | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
US8426767B2 (en) * | 2009-08-31 | 2013-04-23 | Corning Incorporated | Methods for laser scribing and breaking thin glass |
US8946590B2 (en) * | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
TW201134596A (en) * | 2010-04-15 | 2011-10-16 | Epileds Technologies Inc | Laser processing method |
TWI513670B (zh) * | 2010-08-31 | 2015-12-21 | Corning Inc | 分離強化玻璃基板之方法 |
DE102010053712A1 (de) * | 2010-12-07 | 2012-06-21 | Etec Gmbh | Verfahren zum Zerteilen und/oder Zerkleinern von Siliziumblöcken, Siliziumplatten oder Siliziumstäben |
KR20140083026A (ko) * | 2011-10-27 | 2014-07-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 박막 태양 전지를 위한 레이저 결정화 및 다결정 효율 개선 |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
US10017411B2 (en) * | 2014-11-19 | 2018-07-10 | Corning Incorporated | Methods of separating a glass web |
KR20180075707A (ko) * | 2015-11-25 | 2018-07-04 | 코닝 인코포레이티드 | 유리 웹의 분리 방법들 |
US9782906B1 (en) | 2015-12-16 | 2017-10-10 | Amazon Technologies, Inc. | On demand apparel panel cutting |
US10307926B2 (en) | 2016-03-14 | 2019-06-04 | Amazon Technologies, Inc. | Automated fabric picking |
US10820649B2 (en) | 2016-03-14 | 2020-11-03 | Amazon Technologies, Inc. | Organized assembly instruction printing and referencing |
US9895819B1 (en) * | 2016-03-14 | 2018-02-20 | Amazon Technologies, Inc. | Continuous feed fabric cutting |
US9868302B1 (en) | 2016-06-20 | 2018-01-16 | Amazon Technologies, Inc. | Fluorescent ink printing, cutting, and apparel assembly |
CN110678423B (zh) | 2017-03-22 | 2022-05-13 | 康宁股份有限公司 | 分离玻璃板条的方法 |
CN111108072B (zh) * | 2017-09-27 | 2022-06-17 | 三星钻石工业股份有限公司 | 玻璃基板的切断装置、切断方法和存储介质 |
WO2023228617A1 (ja) * | 2022-05-27 | 2023-11-30 | 日本電気硝子株式会社 | ガラス板の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1244346B (de) * | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
US3629545A (en) * | 1967-12-19 | 1971-12-21 | Western Electric Co | Laser substrate parting |
GB1246481A (en) * | 1968-03-29 | 1971-09-15 | Pilkington Brothers Ltd | Improvements in or relating to the cutting of glass |
NO134614C (de) * | 1972-10-12 | 1976-11-17 | Glaverbel | |
BE805694A (fr) * | 1972-10-12 | 1974-04-05 | Glaverbel | Procede et dispositif pour decouper un materiau vitreux ou vitrocristallin |
FR2228040B1 (de) * | 1973-05-04 | 1977-04-29 | Commissariat Energie Atomique | |
GB2139614B (en) * | 1983-05-13 | 1987-02-04 | Glaverbel | Method and apparatus for cutting glass |
GB2139613B (en) * | 1983-05-13 | 1987-03-04 | Glaverbel | Method and apparatus for cutting glass |
US4546231A (en) * | 1983-11-14 | 1985-10-08 | Group Ii Manufacturing Ltd. | Creation of a parting zone in a crystal structure |
-
1991
- 1991-03-04 US US07/664,073 patent/US5132505A/en not_active Expired - Fee Related
- 1991-03-18 EP EP91200580A patent/EP0448168B1/de not_active Expired - Lifetime
- 1991-03-18 JP JP3077169A patent/JPH04224091A/ja active Pending
- 1991-03-18 DE DE69128370T patent/DE69128370T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69128370T2 (de) | 1998-06-04 |
EP0448168B1 (de) | 1997-12-10 |
JPH04224091A (ja) | 1992-08-13 |
US5132505A (en) | 1992-07-21 |
EP0448168A1 (de) | 1991-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N |
|
8339 | Ceased/non-payment of the annual fee |