DE69128370D1 - Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens - Google Patents

Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens

Info

Publication number
DE69128370D1
DE69128370D1 DE69128370T DE69128370T DE69128370D1 DE 69128370 D1 DE69128370 D1 DE 69128370D1 DE 69128370 T DE69128370 T DE 69128370T DE 69128370 T DE69128370 T DE 69128370T DE 69128370 D1 DE69128370 D1 DE 69128370D1
Authority
DE
Germany
Prior art keywords
splitting
carrying
brittle plate
brittle
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69128370T
Other languages
English (en)
Other versions
DE69128370T2 (de
Inventor
Maarten Harm Zonneveld
Jacobus Nicolaas Dekker
Gerrit Cornelis Verkade
Ireneus Henricus Theo Fierkens
Theodorus Johannes Van Gennip
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE69128370D1 publication Critical patent/DE69128370D1/de
Publication of DE69128370T2 publication Critical patent/DE69128370T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • General Physics & Mathematics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
DE69128370T 1990-03-21 1991-03-18 Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens Expired - Fee Related DE69128370T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9000655 1990-03-21

Publications (2)

Publication Number Publication Date
DE69128370D1 true DE69128370D1 (de) 1998-01-22
DE69128370T2 DE69128370T2 (de) 1998-06-04

Family

ID=19856782

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69128370T Expired - Fee Related DE69128370T2 (de) 1990-03-21 1991-03-18 Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens

Country Status (4)

Country Link
US (1) US5132505A (de)
EP (1) EP0448168B1 (de)
JP (1) JPH04224091A (de)
DE (1) DE69128370T2 (de)

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JPH0639572A (ja) * 1991-01-11 1994-02-15 Souei Tsusho Kk ウェハ割断装置
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
DE4214159C1 (de) * 1992-04-30 1993-11-18 Schott Glaswerke Verfahren zum Erzeugen von Bruchspannungen in Glas
DE4305107C2 (de) * 1993-02-19 1995-02-23 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Schneiden eines spröden Körpers mit Laserstrahlung
DE4305106C2 (de) * 1993-02-19 1995-02-02 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Schneiden eines spröden Körpers mit Laserstrahlung
EP0738241B1 (de) * 1993-04-02 1998-08-26 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Verfahren zum schneiden von hohlglas
US5387776A (en) * 1993-05-11 1995-02-07 General Electric Company Method of separation of pieces from super hard material by partial laser cut and pressure cleavage
US5581971A (en) * 1994-09-16 1996-12-10 Alumet Manufacturing, Inc. Glass spacer bar for use in multipane window construction and method of making the same
DE4434648A1 (de) * 1994-09-28 1996-04-04 Glaswerke H U Kl Ritzenhoff Gm Verfahren zum Absprengen einer Glaskuppe von einem dünnwandigen geblasenen Glas
IT1284082B1 (it) * 1996-06-27 1998-05-08 Calp Spa Metodo e dispositivo per il taglio mediante un raggio laser di articoli cavi in vetro
KR100218580B1 (ko) * 1996-07-09 1999-09-01 구자홍 고 밀도 대형 액정 표시 장치 제조 방법
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
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US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
KR100553119B1 (ko) * 1999-01-15 2006-02-22 삼성전자주식회사 레이저를 이용한 절단장치
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
US6795274B1 (en) 1999-09-07 2004-09-21 Asahi Glass Company, Ltd. Method for manufacturing a substantially circular substrate by utilizing scribing
US6664503B1 (en) 1999-09-07 2003-12-16 Asahi Glass Company, Ltd. Method for manufacturing a magnetic disk
CN1413136A (zh) 1999-11-24 2003-04-23 应用光子学公司 非金属材料的分离方法和装置
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
DE10014788A1 (de) * 2000-03-24 2001-10-11 Schott Spezialglas Gmbh Verfahren zum Herstellen von Displays
US20020006765A1 (en) * 2000-05-11 2002-01-17 Thomas Michel System for cutting brittle materials
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP2004515366A (ja) * 2000-12-15 2004-05-27 エルツェットハー レーザーツェントルム ハノーファー エー ファウ ガラス、セラミック、ガラスセラミック等製の各構成部品を、切断領域で前記構成部品に熱応力による引きつれ割れを生じることによって切断する方法
KR100845391B1 (ko) 2001-07-25 2008-07-09 블라디미르 스테파노비치 콘드라텐코 깨어지기 쉬운 비금속 물질의 절단방법(두가지의 변형)
CN100485902C (zh) 2002-03-12 2009-05-06 浜松光子学株式会社 基板的分割方法
ATE493226T1 (de) 2002-03-12 2011-01-15 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
KR100948914B1 (ko) * 2002-11-15 2010-03-24 주식회사 포스코 레이져 용접기의 반사장치
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
FR2852250B1 (fr) * 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
WO2004080643A1 (ja) * 2003-03-12 2004-09-23 Hamamatsu Photonics K.K. レーザ加工方法
DE10330179A1 (de) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
DE102004014276A1 (de) * 2004-03-22 2005-10-13 Grenzebach Maschinenbau Gmbh Verfahren zum Laserschneiden von Flachglas
DE102004014277A1 (de) * 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
DE102004024475A1 (de) * 2004-05-14 2005-12-01 Lzh Laserzentrum Hannover E.V. Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien
SG156607A1 (en) * 2004-07-30 2009-11-26 Mitsuboshi Diamond Ind Co Ltd Method for forming median crack in substrate and apparatus for forming median crack in substrate
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
US20060021977A1 (en) * 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
WO2006025994A2 (en) * 2004-08-31 2006-03-09 Gyrotron Technology, Inc. A method of separating non-metallic material using microwave radiation
US20080236199A1 (en) * 2005-07-28 2008-10-02 Vladislav Sklyarevich Method of Separating Non-Metallic Material Using Microwave Radiation
DE102006018622B3 (de) * 2005-12-29 2007-08-09 H2B Photonics Gmbh Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material
CA2560238A1 (en) * 2006-09-20 2008-03-20 Institut National D'optique Laser-based ablation method and optical system
EP1990168B1 (de) * 2007-05-10 2012-06-27 Grenzebach Maschinenbau GmbH Verfahren zum laserthermischen Trennen von keramischem oder anderem spröden Plattenmaterial
DE102008007632A1 (de) * 2008-02-04 2009-08-06 Limo Patentverwaltung Gmbh & Co. Kg Verfahren zum Laserschneiden eines nichtmetallischen Werkstücks
JP5345334B2 (ja) * 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
US8245540B2 (en) * 2009-02-24 2012-08-21 Corning Incorporated Method for scoring a sheet of brittle material
US8269138B2 (en) 2009-05-21 2012-09-18 Corning Incorporated Method for separating a sheet of brittle material
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
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TWI513670B (zh) * 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
DE102010053712A1 (de) * 2010-12-07 2012-06-21 Etec Gmbh Verfahren zum Zerteilen und/oder Zerkleinern von Siliziumblöcken, Siliziumplatten oder Siliziumstäben
KR20140083026A (ko) * 2011-10-27 2014-07-03 어플라이드 머티어리얼스, 인코포레이티드 박막 태양 전지를 위한 레이저 결정화 및 다결정 효율 개선
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
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US10017411B2 (en) * 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
KR20180075707A (ko) * 2015-11-25 2018-07-04 코닝 인코포레이티드 유리 웹의 분리 방법들
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Also Published As

Publication number Publication date
DE69128370T2 (de) 1998-06-04
EP0448168B1 (de) 1997-12-10
JPH04224091A (ja) 1992-08-13
US5132505A (en) 1992-07-21
EP0448168A1 (de) 1991-09-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee