DE69115171T2 - Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung. - Google Patents

Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.

Info

Publication number
DE69115171T2
DE69115171T2 DE69115171T DE69115171T DE69115171T2 DE 69115171 T2 DE69115171 T2 DE 69115171T2 DE 69115171 T DE69115171 T DE 69115171T DE 69115171 T DE69115171 T DE 69115171T DE 69115171 T2 DE69115171 T2 DE 69115171T2
Authority
DE
Germany
Prior art keywords
production
flexible polyimide
multilayer laminates
polyimide multilayer
laminates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69115171T
Other languages
English (en)
Other versions
DE69115171D1 (de
Inventor
Kuppusamy Kanakarajan
John Anthony Kreuz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE69115171D1 publication Critical patent/DE69115171D1/de
Application granted granted Critical
Publication of DE69115171T2 publication Critical patent/DE69115171T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE69115171T 1990-08-27 1991-08-23 Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung. Expired - Lifetime DE69115171T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57191390A 1990-08-27 1990-08-27

Publications (2)

Publication Number Publication Date
DE69115171D1 DE69115171D1 (de) 1996-01-18
DE69115171T2 true DE69115171T2 (de) 1996-05-15

Family

ID=24285573

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115171T Expired - Lifetime DE69115171T2 (de) 1990-08-27 1991-08-23 Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.

Country Status (4)

Country Link
US (2) US5298331A (de)
EP (1) EP0474054B1 (de)
JP (1) JP2907598B2 (de)
DE (1) DE69115171T2 (de)

Families Citing this family (109)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0659553A1 (de) * 1993-12-22 1995-06-28 E.I. Du Pont De Nemours And Company Koextrudierter Mehrschichtfilm aus aromatischen Polyimiden und seine Herstellung
US6351348B1 (en) 1994-03-15 2002-02-26 International Business Machines Corporation Minimal stiffness conductors for a head gimbal assembly
US6282064B1 (en) 1994-03-15 2001-08-28 International Business Machines Corporation Head gimbal assembly with integrated electrical conductors
US5781379A (en) * 1994-03-15 1998-07-14 International Business Machines Corporation Single beam flexure for a head gimbal assembly
US5955176A (en) * 1994-03-15 1999-09-21 International Business Machines Corporation Integrated suspension using a high strength conductive material
US6365500B1 (en) * 1994-05-06 2002-04-02 Industrial Technology Research Institute Composite bump bonding
US5771135A (en) * 1994-06-13 1998-06-23 International Business Machines Corporation Vibration damping system for head suspension assemblies
WO1997001437A1 (en) * 1995-06-28 1997-01-16 Fraivillig Materials Company Circuit board laminates and method of making
CA2274264C (en) * 1996-12-05 2006-11-07 E.I. Du Pont De Nemours And Company Polyimides having high tg, high tos, and low moisture regain
US5922167A (en) * 1997-01-16 1999-07-13 Occidential Chemical Corporation Bending integrated circuit chips
US6073482A (en) * 1997-07-21 2000-06-13 Ysi Incorporated Fluid flow module
US5932799A (en) * 1997-07-21 1999-08-03 Ysi Incorporated Microfluidic analyzer module
US6293012B1 (en) 1997-07-21 2001-09-25 Ysi Incorporated Method of making a fluid flow module
EP0902048B1 (de) * 1997-09-11 2005-11-23 E.I. Du Pont De Nemours And Company Flexible Polyimidfolie mit hoher dielektrischer Konstante
JP3270378B2 (ja) * 1997-11-25 2002-04-02 住友ベークライト株式会社 金属・樹脂複合体、その製造方法及びフレキシブル回路配線板用基板
JP3631105B2 (ja) * 2000-05-31 2005-03-23 キヤノン株式会社 定着フィルムおよびそれを用いた像加熱装置
JP3694890B2 (ja) * 2000-06-05 2005-09-14 富士ゼロックス株式会社 無端状ベルトの製造方法並びに無端状ベルト及び画像形成装置
US6908685B2 (en) * 2000-08-24 2005-06-21 E. I. Du Pont De Nemours And Company Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
US6469126B1 (en) * 2000-12-21 2002-10-22 E. I. Du Pont De Nmeours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6476177B2 (en) 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6476182B1 (en) 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6444783B1 (en) 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
WO2002066539A1 (en) * 2001-02-16 2002-08-29 Dominion Energy, Inc. Poly amic acid system for polyimides
JPWO2002066546A1 (ja) * 2001-02-23 2004-06-17 鐘淵化学工業株式会社 ポリイミドフィルムおよびその製造方法
US6808818B2 (en) * 2001-10-11 2004-10-26 Ube Industries, Ltd. Fusible polyimide and composite polyimide film
JP2003176354A (ja) * 2001-12-11 2003-06-24 Manac Inc 透明な耐熱性ポリイミドフイルム
US20030216800A1 (en) * 2002-04-11 2003-11-20 Medtronic, Inc. Implantable medical device conductor insulation and process for forming
US7783365B2 (en) * 2002-04-11 2010-08-24 Medtronic, Inc. Implantable medical device conductor insulation and process for forming
WO2003097725A1 (fr) * 2002-05-21 2003-11-27 Kaneka Corporation Film de polyimide, son procede de production, et lamine de polyimide/metal
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
EP1606108B1 (de) * 2003-03-26 2015-08-19 LG Chem Ltd. Doppelseitiges metalllaminat und herstellungsverfahren dafür
US8103358B2 (en) * 2003-04-04 2012-01-24 Medtronic, Inc. Mapping guidelet
US7442727B2 (en) * 2003-06-04 2008-10-28 Degussa Ag Pyrogenically prepared, surface modified aluminum oxide
JP3952196B2 (ja) * 2003-06-25 2007-08-01 信越化学工業株式会社 フレキシブル金属箔ポリイミド積層板の製造方法
US7285321B2 (en) * 2003-11-12 2007-10-23 E.I. Du Pont De Nemours And Company Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
EP1614535B1 (de) * 2004-07-09 2007-10-24 DuPont-Toray Company, Ltd. Polyimid-Mehrschichtfolie und diese enthaltendes biegsames Schaltungssubstrat
US20060019102A1 (en) * 2004-07-26 2006-01-26 Kuppsuamy Kanakarajan Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto
KR100591068B1 (ko) * 2004-09-03 2006-06-19 주식회사 코오롱 플렉시블 동박 폴리이미드 적층판 및 그 제조방법
CN1305933C (zh) * 2004-12-07 2007-03-21 长春人造树脂厂股份有限公司 聚酰亚胺的制法
US20060124693A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device
US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
CN101193750B (zh) * 2005-04-18 2011-02-16 东洋纺织株式会社 薄膜层压的聚酰亚胺膜和柔性印刷电路板
KR100979618B1 (ko) * 2005-04-20 2010-09-01 토요 보세키 가부시기가이샤 접착 시트, 금속 적층 시트 및 인쇄 배선판
US7504150B2 (en) 2005-06-15 2009-03-17 E.I. Du Pont De Nemours & Company Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto
US7452610B2 (en) * 2005-06-29 2008-11-18 Du Pont Toray Company Limited Multi-layer polyimide films and flexible circuit substrates therefrom
US7621041B2 (en) * 2005-07-11 2009-11-24 E. I. Du Pont De Nemours And Company Methods for forming multilayer structures
US7550194B2 (en) 2005-08-03 2009-06-23 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
US20090226642A1 (en) * 2005-08-03 2009-09-10 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
US7338715B2 (en) * 2005-12-30 2008-03-04 E.I. Du Pont De Nemours And Company Low temperature cure polyimide compositions resistant to arc tracking and methods relating thereto
JP4896533B2 (ja) * 2006-01-25 2012-03-14 三菱瓦斯化学株式会社 樹脂複合銅箔およびその製造方法
US20070231588A1 (en) * 2006-03-31 2007-10-04 Karthikeyan Kanakarajan Capacitive polyimide laminate
US20070232734A1 (en) * 2006-03-31 2007-10-04 Karthikeyan Kanakarajan Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto
US20070298260A1 (en) * 2006-06-22 2007-12-27 Kuppusamy Kanakarajan Multi-layer laminate substrates useful in electronic type applications
US9161440B2 (en) * 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US8568867B2 (en) * 2006-06-26 2013-10-29 Sabic Innovative Plastics Ip B.V. Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US20080044639A1 (en) * 2006-06-26 2008-02-21 Kwok Pong Chan Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US8545975B2 (en) * 2006-06-26 2013-10-01 Sabic Innovative Plastics Ip B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US8399573B2 (en) * 2006-11-22 2013-03-19 Sabic Innovative Plastics Ip B.V. Polymer blend compositions
US20080119616A1 (en) 2006-11-22 2008-05-22 General Electric Company Polyimide resin compositions
US20080118730A1 (en) * 2006-11-22 2008-05-22 Ta-Hua Yu Biaxially oriented film, laminates made therefrom, and method
US20080213605A1 (en) * 2006-12-07 2008-09-04 Briney Gary C Multi-functional circuitry substrates and compositions and methods relating thereto
US8475924B2 (en) 2007-07-09 2013-07-02 E.I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
US7829794B2 (en) * 2007-09-13 2010-11-09 3M Innovative Properties Company Partially rigid flexible circuits and method of making same
JP5424234B2 (ja) * 2008-12-02 2014-02-26 日立金属株式会社 絶縁電線
US20100193950A1 (en) * 2009-01-30 2010-08-05 E.I.Du Pont De Nemours And Company Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto
JP2010189510A (ja) * 2009-02-17 2010-09-02 Hitachi Cable Ltd 絶縁塗料及び絶縁電線
JP5740834B2 (ja) * 2009-05-11 2015-07-01 三菱化学株式会社 液晶性ポリイミド、及びこれを含有する液晶性樹脂組成物、並びに半導体素子用樹脂膜
US8784980B2 (en) * 2009-05-13 2014-07-22 E I Du Pont De Nemours And Company Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
US8288466B2 (en) 2009-05-13 2012-10-16 E I Du Pont De Nemours And Company Composite of a polymer and surface modified hexagonal boron nitride particles
US8440292B2 (en) * 2009-05-13 2013-05-14 E I Du Pont De Nemours And Company Multi-layer article for flexible printed circuits
US8258346B2 (en) * 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles
KR20110042831A (ko) * 2009-10-20 2011-04-27 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 동박 적층판
CN104118167A (zh) * 2010-02-10 2014-10-29 宇部兴产株式会社 聚酰亚胺膜、含它的聚酰亚胺层压体和含它的聚酰亚胺金属层压体
US8809690B2 (en) * 2010-03-04 2014-08-19 Rogers Corporation Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
US8263202B2 (en) 2010-03-19 2012-09-11 Glenn Danny E Film based heating device and methods relating thereto
US8853723B2 (en) 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
US20130194814A1 (en) * 2012-01-31 2013-08-01 E.I. Du Pont De Nemours And Company Bent layered structure and methods relating thereto
JP5868753B2 (ja) * 2012-03-26 2016-02-24 東レ・デュポン株式会社 ポリイミドフィルム
US8962890B1 (en) 2012-04-20 2015-02-24 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinkers for shape-memory polyimides, polyamides and poly(amide-imides) and methods of making the same
US8791227B1 (en) 2012-04-20 2014-07-29 The United States Of America As Represented By The Secretary Of The Air Force Crosslinked aromatic polyimides and methods of making the same
US9085661B1 (en) 2012-10-26 2015-07-21 The United States Of America As Represented By The Secretary Of The Air Force Photomechanically active copolyimides derived from an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride
KR20140122677A (ko) * 2013-04-09 2014-10-20 주식회사 엘지화학 폴리이미드계 필름 및 이의 제조방법
US9139696B1 (en) 2014-03-28 2015-09-22 The United States Of America, As Represented By The Secretary Of The Air Force Aromatic diamines containing three ether-linked-benzonitrile moieties, polymers thereof, and methods of making the same
US9644071B1 (en) 2014-09-05 2017-05-09 The United States Of America As Represented By The Secretary Of The Air Force Bis(azobenzene) diamines and photomechanical polymers made therefrom
WO2016052491A1 (ja) * 2014-09-30 2016-04-07 ソマール株式会社 ポリイミド共重合体およびこれを用いた成形体
US10294255B1 (en) 2015-08-07 2019-05-21 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinking agent, crosslinked polymer, and method of making same
US10239254B1 (en) 2015-08-07 2019-03-26 The United States Of America As Represented By The Secretary Of The Air Force Method of fabricating shape memory films
US11021606B2 (en) 2017-09-13 2021-06-01 E I Du Pont De Nemours And Company Multilayer film for electronic circuitry applications
US11104801B2 (en) 2018-03-09 2021-08-31 Dupont Electronics, Inc. Low haze polyimide film
TWI832882B (zh) 2018-08-08 2024-02-21 美商杜邦電子股份有限公司 用於電子裝置中之聚合物
CN109438702A (zh) * 2018-09-29 2019-03-08 苏州市新广益电子有限公司 一种用于fpc行业的tpi薄膜及其制备和加工方法
DE112019005062T5 (de) 2018-10-09 2021-06-24 Dupont Electronics, Inc. Thermische Substrate
US11256001B2 (en) 2018-10-23 2022-02-22 Dupont Electronics, Inc. Low haze polymer films and electronic devices
JP7195530B2 (ja) * 2019-01-11 2022-12-26 エルジー・ケム・リミテッド フィルム、金属張積層板、フレキシブル基板、フィルムの製造方法、金属張積層板の製造方法、及びフレキシブル基板の製造方法
TW202041571A (zh) 2019-02-22 2020-11-16 美商杜邦電子股份有限公司 聚醯亞胺膜及電子裝置
CN110212090A (zh) 2019-05-23 2019-09-06 武汉华星光电半导体显示技术有限公司 一种pi基板及其制备方法
US11248143B2 (en) * 2019-05-24 2022-02-15 Dupont Electronics, Inc. Coated films and electronic devices
TW202110948A (zh) 2019-06-14 2021-03-16 美商杜邦電子股份有限公司 聚合物膜及電子裝置
US11718728B2 (en) 2019-11-21 2023-08-08 Dupont Electronics, Inc. Single layer polymer films and electronic devices
US11898011B2 (en) 2020-02-19 2024-02-13 Dupont Electronics, Inc. Polymers for use in electronic devices
US20210310126A1 (en) 2020-04-03 2021-10-07 Dupont Electronics, Inc. Metal-clad polymer films and electronic devices
JP2023521590A (ja) * 2020-09-21 2023-05-25 エルジー・ケム・リミテッド フレキシブルディスプレイ装置製造用複合基板、これを利用したフレキシブルディスプレイ装置の製造方法、およびフレキシブルディスプレイ装置用積層体
US11643514B2 (en) 2021-04-23 2023-05-09 Dupont Electronics, Inc. Polyimide films and electronic devices
KR102564597B1 (ko) * 2021-07-20 2023-08-09 피아이첨단소재 주식회사 폴리이미드 피복물
KR102564595B1 (ko) * 2021-07-20 2023-08-09 피아이첨단소재 주식회사 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 피복물
US20230082265A1 (en) 2021-09-15 2023-03-16 Dupont Electronics, Inc. Articles having inorganic substrates and polymer film layers
CN113831570A (zh) * 2021-10-13 2021-12-24 无锡顺铉新材料有限公司 特种线缆用聚酰亚胺复合膜及其制备方法
CN114736409B (zh) * 2022-04-19 2023-06-30 宝珠特种材料科技(江苏)有限公司 一种侧链接枝硅氧烷的聚酰亚胺薄膜
CN116003794A (zh) * 2022-12-29 2023-04-25 中国科学院化学研究所 一种高频高耐热可热封性聚(芳酯-酰亚胺)树脂及其制备方法与应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3576691A (en) * 1968-04-18 1971-04-27 Trw Inc Method of bonding employing high-temperature polymaleimide adhesives
US3728150A (en) * 1971-07-12 1973-04-17 Du Pont Bondable adhesive coated polyimide film
US3900662A (en) * 1973-01-17 1975-08-19 Du Pont Bondable adhesive coated polyimide film and laminates
US4543295A (en) * 1980-09-22 1985-09-24 The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration High temperature polyimide film laminates and process for preparation thereof
JPS57181857A (en) * 1981-05-06 1982-11-09 Ube Industries Polyimide laminated material and its manufacture
GB2104411B (en) * 1981-07-08 1985-02-20 Ube Industries Aromatic polyimide composite separating membrane
US4576857A (en) * 1983-03-14 1986-03-18 E. I. Du Pont De Nemours And Company Melt-fusible polyimides
EP0162017B1 (de) * 1984-05-17 1991-08-21 Ciba-Geigy Ag Homo- und Copolymere, Verfahren zu deren Vernetzung und derenVerwendung
EP0167020B1 (de) * 1984-06-30 1988-11-23 Akzo Patente GmbH Flexible Polyimid-Mehrschichtlaminate
JPS61111359A (ja) * 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
US4837300A (en) * 1985-06-20 1989-06-06 The United States Of America As Represented By The Administration Of The National Aeronautics And Space Administration Copolyimide with a combination of flexibilizing groups
JP2622678B2 (ja) * 1987-01-12 1997-06-18 チッソ株式会社 溶融成形可能な結晶性ポリイミド重合体
JPH0655491B2 (ja) * 1987-05-29 1994-07-27 宇部興産株式会社 芳香族ポリイミドフィルムの製造方法
US5233011A (en) * 1988-10-20 1993-08-03 Mitsui Toatsu Chemicals, Incorporated Process for preparing insulated wire
US5101005A (en) * 1989-05-08 1992-03-31 Hoechst Celanese Corp. Crosslinkable polyimides from bis (aminophenoxy) benzonitriles
US5137751A (en) * 1990-03-09 1992-08-11 Amoco Corporation Process for making thick multilayers of polyimide
US5152863A (en) * 1990-10-31 1992-10-06 E. I. Du Pont De Nemours And Company Reactive-oligoimide adhesives, laminates, and methods of making the laminates
US5252700A (en) * 1991-04-30 1993-10-12 Mitsui Toatsu Chemicals, Inc. Heat-resistant adhesive and method of adhesion by using adhesive
US5166292A (en) * 1991-10-29 1992-11-24 E. I. Du Pont De Nemours And Company Process for preparing a polyimide film with a preselected value for CTE

Also Published As

Publication number Publication date
EP0474054A2 (de) 1992-03-11
JP2907598B2 (ja) 1999-06-21
US5298331A (en) 1994-03-29
DE69115171D1 (de) 1996-01-18
JPH04234191A (ja) 1992-08-21
US5411765A (en) 1995-05-02
EP0474054A3 (en) 1992-05-06
EP0474054B1 (de) 1995-12-06

Similar Documents

Publication Publication Date Title
DE69115171T2 (de) Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
DE3850984D1 (de) Metallisierbare Mehrschichtfolie, ihre Herstellung und ihre Verwendung.
DE69431740T2 (de) Mehrlagige Verdrahtungsplatine und ihre Herstellung
PT80741A (de) Flexible polyimid-mehrschichtlaminate
DE3689884T2 (de) Mehrschichtige, flexible, faserhaltige gegenstände.
DE68914774T2 (de) Mehrschichtige mikroporöse Filmlaminate.
DE69226183T2 (de) Mit fluessigkeiten behandelte polytetrafluroaethylenprodukte und ihre herstellung
DE69226893T2 (de) Mehrschichten-Verbundfilm und seine Herstellung
DE69133409D1 (de) Mehrschicht-Verbindungsstruktur
DE69637928D1 (de) Mehrschichtige leiterplatte und ihre herstellung
DE69007597D1 (de) Laminate aus weichen polymeren Lagen und ihre Herstellung.
DE3869257D1 (de) N-aminobutyl-n-phenylarylamid-derivate, ihre herstellung und ihre verwendung in der heilkunde.
DE3785107D1 (de) Prepreg und dessen komposit.
DE3770020D1 (de) Sulfoxidderivate und ihre herstellung.
DE69534332D1 (de) Mehrschichtige leiterplatte und ihre herstellung
NO910156L (no) Imidisert segmentkopolymer.
DE3887146T2 (de) Flexible mehrschichtpanzerung.
DE69103702T2 (de) Hydroxylierte epoxyverbindungen und ihre herstellung.
DE59103165D1 (de) Mehrschichtenfolien.
NO892816D0 (no) Flerlagstruktur.
FR2666017B1 (fr) Structure gonflable permettant la pratique de l'escalade.
DE59103033D1 (de) Mehrschichtiger Kunststoffverbund.
DE3782698D1 (de) 5-fluoruridin-derivat und dessen herstellung.
DE59308512D1 (de) Cyclohexenonoximether, ihre herstellung und ihre verwendung
DE3672110D1 (de) Gummiartikel aus unterschiedlichen gummischichten, ihre herstellung und verwendung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition