DE69110694D1 - Verfahren zum Herstellen eines piezoelektrischen Mehrschichtelementes sowie piezoelektrisches Mehrschichtelement. - Google Patents

Verfahren zum Herstellen eines piezoelektrischen Mehrschichtelementes sowie piezoelektrisches Mehrschichtelement.

Info

Publication number
DE69110694D1
DE69110694D1 DE69110694T DE69110694T DE69110694D1 DE 69110694 D1 DE69110694 D1 DE 69110694D1 DE 69110694 T DE69110694 T DE 69110694T DE 69110694 T DE69110694 T DE 69110694T DE 69110694 D1 DE69110694 D1 DE 69110694D1
Authority
DE
Germany
Prior art keywords
multilayer element
piezoelectric multilayer
producing
piezoelectric
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69110694T
Other languages
English (en)
Other versions
DE69110694T2 (de
Inventor
Johannus Wilhelmus Weekamp
Harry Willem Pront
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Application granted granted Critical
Publication of DE69110694D1 publication Critical patent/DE69110694D1/de
Publication of DE69110694T2 publication Critical patent/DE69110694T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Fuel-Injection Apparatus (AREA)
  • Transducers For Ultrasonic Waves (AREA)
DE69110694T 1990-02-07 1991-02-05 Verfahren zum Herstellen eines piezoelektrischen Mehrschichtelementes sowie piezoelektrisches Mehrschichtelement. Expired - Fee Related DE69110694T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9000291 1990-02-07

Publications (2)

Publication Number Publication Date
DE69110694D1 true DE69110694D1 (de) 1995-08-03
DE69110694T2 DE69110694T2 (de) 1996-02-22

Family

ID=19856550

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69110694T Expired - Fee Related DE69110694T2 (de) 1990-02-07 1991-02-05 Verfahren zum Herstellen eines piezoelektrischen Mehrschichtelementes sowie piezoelektrisches Mehrschichtelement.

Country Status (4)

Country Link
US (1) US5113566A (de)
EP (1) EP0441438B1 (de)
JP (1) JPH04213881A (de)
DE (1) DE69110694T2 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2013903A1 (en) * 1989-04-07 1990-10-07 Mitsui Chemicals, Inc. Laminated ceramic device and method of manufacturing the same
US5206557A (en) * 1990-11-27 1993-04-27 Mcnc Microelectromechanical transducer and fabrication method
US5479061A (en) * 1992-12-31 1995-12-26 University Of North Carolina Pleated sheet microelectromechanical transducer
JPH06334236A (ja) * 1993-05-20 1994-12-02 Fujitsu Ltd 積層型圧電・電歪アクチュエータの製造方法
US5406164A (en) * 1993-06-10 1995-04-11 Brother Kogyo Kabushiki Kaisha Multilayer piezoelectric element
US5761782A (en) * 1994-08-29 1998-06-09 Oceaneering International, Inc. Method of fabrication of piezoelectric bender elements
US5798600A (en) * 1994-08-29 1998-08-25 Oceaneering International, Inc. Piezoelectric pumps
US5889354A (en) * 1994-08-29 1999-03-30 Oceaneering International Inc. Piezoelectric unit cell
US5798599A (en) * 1996-10-24 1998-08-25 Dukane Corporation Ultrasonic transducer assembly using crush foils
US5895871A (en) * 1997-07-25 1999-04-20 General Electric Company Finger controlled inspection apparatus
US6291930B1 (en) 1998-08-13 2001-09-18 Oceaneering International, Inc. Low voltage piezoelectric bender elements and unit cells
JP2002141576A (ja) * 2000-11-02 2002-05-17 Fujitsu Ltd ピエゾ素子と電極との接合方法及び該接合方法を使用したピエゾマイクロアクチュエータ
DE102004011029B4 (de) * 2004-03-04 2009-11-19 Siemens Ag Polymeraktor in Stapelbauweise und Verfahren zu dessen Herstellung
JP5123491B2 (ja) * 2005-06-10 2013-01-23 日本碍子株式会社 積層型圧電／電歪素子
US7651587B2 (en) 2005-08-11 2010-01-26 Applied Materials, Inc. Two-piece dome with separate RF coils for inductively coupled plasma reactors
EP2313036A1 (de) * 2008-05-02 2011-04-27 Dymedix Corporation Agitator zur stimulierung des zentralen nervensystems
US20100049264A1 (en) * 2008-08-22 2010-02-25 Dymedix Corporation Diagnostic indicator and PSG interface for a closed loop neuromodulator
US20100069769A1 (en) * 2008-09-12 2010-03-18 Dymedix Corporation Wireless pyro/piezo sensor base station
JP2010079949A (ja) * 2008-09-24 2010-04-08 Fujitsu Ltd 圧電アクチュエータ、ヘッドスライダ、磁気ディスク装置
DE102010016499A1 (de) 2010-04-18 2011-10-20 Enrico Bischur Flächige Piezogeneratormodule und Verfahren zu ihrer Herstellung
CN101964392A (zh) * 2010-08-20 2011-02-02 中国兵器工业集团第五三研究所 一种有机压电薄膜叠层器件
DE102011001359A1 (de) 2011-03-17 2012-09-20 Gottfried Wilhelm Leibniz Universität Hannover Verfahren und Vorrichtung zur Herstellung einer Piezoaktorenkomponente
CN102522495B (zh) * 2011-12-21 2014-02-19 贝辛电子科技（上海）有限公司 一种提高压电驻极体薄膜传感器信噪比的方法
WO2015170446A1 (ja) * 2014-05-07 2015-11-12 パナソニックＩｐマネジメント株式会社 圧電デバイスおよびそれの製造方法
EP3041059B1 (de) * 2014-12-31 2019-09-11 LG Display Co., Ltd. Vielschichtaktuator und anzeigevorrichtung die diesen beinhaltet
JP2016141149A (ja) * 2015-02-05 2016-08-08 キヤノン株式会社 液体吐出ヘッド用基板の製造方法、及び該製造方法で製造された液体吐出ヘッド用基板
JP2019007749A (ja) * 2017-06-20 2019-01-17 ヤマハ株式会社 圧力センサー

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX145379A (es) * 1976-09-24 1982-01-29 Pennwalt Corp Metodo mejorado para polarizar una pila de capas multiples de peliculas formadoras de elementos piezoelectricos
JPS61292980A (ja) * 1985-06-21 1986-12-23 Toshiba Corp 積層型圧電アクチユエ−タ
US4803763A (en) * 1986-08-28 1989-02-14 Nippon Soken, Inc. Method of making a laminated piezoelectric transducer
US4752856A (en) * 1987-06-08 1988-06-21 Illinois Tool Works Inc. Capacitive structure

Also Published As

Publication number Publication date
DE69110694T2 (de) 1996-02-22
JPH04213881A (ja) 1992-08-04
US5113566A (en) 1992-05-19
EP0441438A1 (de) 1991-08-14
EP0441438B1 (de) 1995-06-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee