DE69104603D1 - Kühlungsvorrichtung. - Google Patents

Kühlungsvorrichtung.

Info

Publication number
DE69104603D1
DE69104603D1 DE69104603T DE69104603T DE69104603D1 DE 69104603 D1 DE69104603 D1 DE 69104603D1 DE 69104603 T DE69104603 T DE 69104603T DE 69104603 T DE69104603 T DE 69104603T DE 69104603 D1 DE69104603 D1 DE 69104603D1
Authority
DE
Germany
Prior art keywords
cooling device
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69104603T
Other languages
English (en)
Other versions
DE69104603T2 (de
Inventor
Francois Jeanne Charl Leyssens
Hendrikus Martinus Jo Rombouts
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Bell NV
Original Assignee
Bell Telephone Manufacturing Co NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bell Telephone Manufacturing Co NV filed Critical Bell Telephone Manufacturing Co NV
Application granted granted Critical
Publication of DE69104603D1 publication Critical patent/DE69104603D1/de
Publication of DE69104603T2 publication Critical patent/DE69104603T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Other Air-Conditioning Systems (AREA)
  • Details Of Measuring And Other Instruments (AREA)
DE69104603T 1991-02-25 1991-02-25 Kühlungsvorrichtung. Expired - Fee Related DE69104603T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP91200392A EP0501044B1 (de) 1991-02-25 1991-02-25 Kühlungsvorrichtung

Publications (2)

Publication Number Publication Date
DE69104603D1 true DE69104603D1 (de) 1994-11-17
DE69104603T2 DE69104603T2 (de) 1995-05-04

Family

ID=8207526

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69104603T Expired - Fee Related DE69104603T2 (de) 1991-02-25 1991-02-25 Kühlungsvorrichtung.

Country Status (5)

Country Link
US (1) US5329425A (de)
EP (1) EP0501044B1 (de)
JP (1) JPH05106956A (de)
DE (1) DE69104603T2 (de)
ES (1) ES2065606T3 (de)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5844777A (en) * 1997-01-27 1998-12-01 At&T Corp. Apparatus for heat removal from a PC card array
JP3942248B2 (ja) 1997-02-24 2007-07-11 富士通株式会社 ヒートシンクおよびそれを搭載した情報処理装置
CA2199239A1 (en) * 1997-03-05 1998-09-05 Trevor Zapach Electronic unit
US6292556B1 (en) 1997-11-06 2001-09-18 Anacapa Technology, Inc. Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction
US5953930A (en) * 1998-03-31 1999-09-21 International Business Machines Corporation Evaporator for use in an extended air cooling system for electronic components
US6044899A (en) * 1998-04-27 2000-04-04 Hewlett-Packard Company Low EMI emissions heat sink device
US6169247B1 (en) * 1998-06-11 2001-01-02 Lucent Technologies Inc. Enclosure for electronic components
US6310772B1 (en) * 1999-09-02 2001-10-30 Special Product Company Enclosure for telecommunications equipment
US6169660B1 (en) 1999-11-01 2001-01-02 Thermal Corp. Stress relieved integrated circuit cooler
US7630198B2 (en) 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US6430044B2 (en) 2000-02-10 2002-08-06 Special Product Company Telecommunications enclosure with individual, separated card holders
US6404637B2 (en) 2000-02-14 2002-06-11 Special Product Company Concentrical slot telecommunications equipment enclosure
WO2001072099A2 (en) * 2000-03-21 2001-09-27 Liebert Corporation Method and apparatus for cooling electronic enclosures
US6516954B2 (en) 2000-06-29 2003-02-11 Servervault Corp. Equipment rack with integral HVAC and power distribution features
US6940014B1 (en) 2000-07-27 2005-09-06 Special Product Company Modular electronic equipment enclosure comprising sealed cable interface module
US6507494B1 (en) 2000-07-27 2003-01-14 Adc Telecommunications, Inc. Electronic equipment enclosure
US6514095B1 (en) 2000-07-27 2003-02-04 Special Product Company Cable interface for electronic equipment enclosure
US6691766B1 (en) * 2000-09-15 2004-02-17 Lucent Technologies Inc. Cabinet cooling with heat pipe
US6628521B2 (en) 2000-11-06 2003-09-30 Adc Telecommunications, Inc. Mechanical housing
US6625017B1 (en) 2001-02-12 2003-09-23 Special Products Company Telecommunications enclosure with individual, separated card holders
US6506111B2 (en) 2001-05-16 2003-01-14 Sanmina-Sci Corporation Cooling airflow distribution device
US6657121B2 (en) * 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US6536510B2 (en) 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
US6894907B2 (en) 2001-07-31 2005-05-17 Adc Telecommunications, Inc. Clamping case
US6897377B2 (en) * 2001-07-31 2005-05-24 Adc Telecommunications, Inc. Clamping receptacle
US6856037B2 (en) * 2001-11-26 2005-02-15 Sony Corporation Method and apparatus for converting dissipated heat to work energy
GB0207382D0 (en) * 2002-03-28 2002-05-08 Holland Heating Uk Ltd Computer cabinet
US6862180B2 (en) * 2002-05-24 2005-03-01 Adc Dsl Systems, Inc. Housings for circuit cards
US7031158B2 (en) * 2002-10-30 2006-04-18 Charles Industries, Ltd. Heat pipe cooled electronics enclosure
US6781830B2 (en) * 2002-11-05 2004-08-24 Adc Dsl Systems, Inc. Methods and systems of heat transfer for electronic enclosures
US6865085B1 (en) 2003-09-26 2005-03-08 Adc Dsl Systems, Inc. Heat dissipation for electronic enclosures
EP2314956A1 (de) 2003-12-05 2011-04-27 Liebert Corporation Kühlsystem für Wärmelasten mit hoher Dichte
US20050207116A1 (en) * 2004-03-22 2005-09-22 Yatskov Alexander I Systems and methods for inter-cooling computer cabinets
US7304842B2 (en) * 2004-06-14 2007-12-04 Cray Inc. Apparatuses and methods for cooling electronic devices in computer systems
US7120027B2 (en) * 2004-07-08 2006-10-10 Cray Inc. Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
US7177156B2 (en) * 2004-07-08 2007-02-13 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
US7362571B2 (en) * 2004-09-16 2008-04-22 Cray Inc. Inlet flow conditioners for computer cabinet air conditioning systems
CN101044811A (zh) * 2004-11-14 2007-09-26 利伯特公司 用于立式板卡型计算机***的机架中的集成式热交换器
US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
EP1929850B1 (de) * 2005-08-04 2013-06-19 Liebert Corporation Gehäuse für elektronische geräte mit integriertem kühlsystem mit hoher kapazität und backup-ventilationssystem
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
US7450384B2 (en) * 2006-07-06 2008-11-11 Hybricon Corporation Card cage with parallel flow paths having substantially similar lengths
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US7898799B2 (en) 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7903403B2 (en) 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US8154116B2 (en) * 2008-11-03 2012-04-10 HeadwayTechnologies, Inc. Layered chip package with heat sink
EP2497346A1 (de) * 2009-11-02 2012-09-12 Telefonaktiebolaget L M Ericsson (PUBL) Passive kabinenkühlung
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US8542489B2 (en) * 2011-05-05 2013-09-24 Alcatel Lucent Mechanically-reattachable liquid-cooled cooling apparatus
US10209003B2 (en) 2012-02-21 2019-02-19 Thermal Corp. Electronics cabinet and rack cooling system and method
CN105491863A (zh) * 2016-01-20 2016-04-13 北京百度网讯科技有限公司 用于数据中心机柜的冷却装置、机柜和冷却***
CN105555106B (zh) * 2016-02-29 2018-05-22 北京百度网讯科技有限公司 用于机柜的冷却装置和机柜
US10694641B2 (en) 2016-04-29 2020-06-23 Intel Corporation Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6508824A (de) * 1964-07-08 1966-01-10
US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3700028A (en) * 1970-12-10 1972-10-24 Noren Products Inc Heat pipes
US3971435A (en) * 1971-07-13 1976-07-27 Ncr Corporation Heat transfer device
US4019098A (en) * 1974-11-25 1977-04-19 Sundstrand Corporation Heat pipe cooling system for electronic devices
US4184539A (en) * 1978-07-10 1980-01-22 The United States Of America As Represented By The Secretary Of The Navy Electronic card mount and heat transfer assembly for underwater vehicles
US4315300A (en) * 1979-01-29 1982-02-09 The United States Of America As Represented By The Secretary Of The Navy Cooling arrangement for plug-in module assembly
US4366526A (en) * 1980-10-03 1982-12-28 Grumman Aerospace Corporation Heat-pipe cooled electronic circuit card
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS6057956A (ja) * 1983-09-09 1985-04-03 Furukawa Electric Co Ltd:The 半導体用ヒ−トパイプ放熱器
DE3504992A1 (de) * 1985-02-14 1986-08-14 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit integriertem waermerohr
FR2580433B1 (fr) * 1985-04-16 1987-08-14 Socapex Connecteur thermique pour carte de circuit imprime revetue de composants electroniques
ATE64808T1 (de) * 1985-12-13 1991-07-15 Hasler Ag Ascom Verfahren und vorrichtung zum abfuehren der verlustwaerme wenigstens einer baugruppe elektrischer elemente.
US5029389A (en) * 1987-12-14 1991-07-09 Hughes Aircraft Company Method of making a heat pipe with improved end cap
US4958257A (en) * 1989-03-29 1990-09-18 Hughes Aircraft Company Heat conducting interface for electronic module
US5019939A (en) * 1989-10-24 1991-05-28 Ag Communication Systems Corp. Thermal management plate
EP0461114A1 (de) * 1989-12-28 1991-12-18 Bell Telephone Manufacturing Company Naamloze Vennootschap Kühlungsvorrichtung

Also Published As

Publication number Publication date
ES2065606T3 (es) 1995-02-16
US5329425A (en) 1994-07-12
EP0501044B1 (de) 1994-10-12
EP0501044A1 (de) 1992-09-02
JPH05106956A (ja) 1993-04-27
DE69104603T2 (de) 1995-05-04

Similar Documents

Publication Publication Date Title
DE69104603T2 (de) Kühlungsvorrichtung.
DE69206082D1 (de) Motorkühlungsvorrichtung.
DE69101539D1 (de) Magnetische Kühlvorrichtung.
DE69203280D1 (de) Verschiebungsvorrichtung.
DE69314058T2 (de) Hochwirksame, wasserstoffbetriebene kühlvorrichtung
DE69203841D1 (de) Verbindungsvorrichtung.
DE69202412T2 (de) Kühlvorrichtung.
NO913199D0 (no) Monteringsanordning.
DE59201480D1 (de) Kühlgerät.
DE69000769T2 (de) Kuehlvorrichtung.
ITRM910970A0 (it) Dispositivo di zettatura.
DE69202363D1 (de) Halbleiteranordnung.
DE69206600T2 (de) Laservorrichtung.
DE68903067T2 (de) Kuehlvorrichtung.
DE69112543D1 (de) Gekühltes elektrisches Gerät.
MX9205398A (es) Dispositivo de climatizacion.
NO912551L (no) Jekkanordning.
DE59203042D1 (de) Wiedergabegerät.
DE3868927D1 (de) Kuehlvorrichtung.
ES1015227Y (es) Dispositivo henidor graduable.
ES1020707Y (es) Dispositivo despaletizador.
NO910049L (no) Maskineringsanordning.
ITTO910743A1 (it) Dispositivo di telesoccorso.
KR920015344U (ko) 조작장치
ES1016233Y (es) Dispositivo sujeta-lapices.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee