DE69014418D1 - Elektrochemisches Aufrauhen von Oberflächen von Aluminium oder Aluminiumlegierungen. - Google Patents

Elektrochemisches Aufrauhen von Oberflächen von Aluminium oder Aluminiumlegierungen.

Info

Publication number
DE69014418D1
DE69014418D1 DE69014418T DE69014418T DE69014418D1 DE 69014418 D1 DE69014418 D1 DE 69014418D1 DE 69014418 T DE69014418 T DE 69014418T DE 69014418 T DE69014418 T DE 69014418T DE 69014418 D1 DE69014418 D1 DE 69014418D1
Authority
DE
Germany
Prior art keywords
aluminum
acid
alloys
electrochemical roughening
photosensitive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69014418T
Other languages
English (en)
Other versions
DE69014418T2 (de
Inventor
Osvaldo Gobbetti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diaprint SRL
Original Assignee
Diaprint SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diaprint SRL filed Critical Diaprint SRL
Application granted granted Critical
Publication of DE69014418D1 publication Critical patent/DE69014418D1/de
Publication of DE69014418T2 publication Critical patent/DE69014418T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/16—Pretreatment, e.g. desmutting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/04—Etching of light metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N3/00—Preparing for use and conserving printing surfaces
    • B41N3/03—Chemical or electrical pretreatment
    • B41N3/034—Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE69014418T 1989-06-05 1990-05-23 Elektrochemisches Aufrauhen von Oberflächen von Aluminium oder Aluminiumlegierungen. Expired - Fee Related DE69014418T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8984942A IT1235332B (it) 1989-06-05 1989-06-05 Granitura elettrochimica di superfici in alluminio o in lega di alluminio

Publications (2)

Publication Number Publication Date
DE69014418D1 true DE69014418D1 (de) 1995-01-12
DE69014418T2 DE69014418T2 (de) 1995-04-20

Family

ID=11326178

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69014418T Expired - Fee Related DE69014418T2 (de) 1989-06-05 1990-05-23 Elektrochemisches Aufrauhen von Oberflächen von Aluminium oder Aluminiumlegierungen.

Country Status (13)

Country Link
US (1) US5064511A (de)
EP (1) EP0401601B1 (de)
JP (1) JPH0324289A (de)
KR (1) KR910001093A (de)
AT (1) ATE114740T1 (de)
AU (1) AU5617690A (de)
BR (1) BR9002643A (de)
CA (1) CA2018180A1 (de)
DD (1) DD298364A5 (de)
DE (1) DE69014418T2 (de)
HU (1) HUT54316A (de)
IT (1) IT1235332B (de)
ZA (1) ZA904194B (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275473A (ja) * 1993-03-19 1994-09-30 Matsushita Electric Ind Co Ltd アルミ電解コンデンサ用陽極箔の製造方法
US7964085B1 (en) 2002-11-25 2011-06-21 Applied Materials, Inc. Electrochemical removal of tantalum-containing materials
KR20040071381A (ko) * 2003-02-06 2004-08-12 임병식 금속표면 전해연마용 전해액 조성물
US20060105182A1 (en) * 2004-11-16 2006-05-18 Applied Materials, Inc. Erosion resistant textured chamber surface
JP2005056786A (ja) 2003-08-07 2005-03-03 Denso Corp スパークプラグ
US7910218B2 (en) * 2003-10-22 2011-03-22 Applied Materials, Inc. Cleaning and refurbishing chamber components having metal coatings
US7618769B2 (en) * 2004-06-07 2009-11-17 Applied Materials, Inc. Textured chamber surface
EP1616959A1 (de) 2004-07-07 2006-01-18 Icon Genetics AG Biologisch sichere transiente Proteinexpression in Pflanzen
US7670436B2 (en) 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
US7579067B2 (en) 2004-11-24 2009-08-25 Applied Materials, Inc. Process chamber component with layered coating and method
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US7762114B2 (en) 2005-09-09 2010-07-27 Applied Materials, Inc. Flow-formed chamber component having a textured surface
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US20070125646A1 (en) 2005-11-25 2007-06-07 Applied Materials, Inc. Sputtering target for titanium sputtering chamber
DE602006003856D1 (de) * 2006-02-28 2009-01-08 Agfa Graphics Nv Verfahren zur Herstellung eines lithographischen Druckplattenträgers
US20080003411A1 (en) * 2006-06-29 2008-01-03 Joseph Hunter Aluminum lithographic substrate and method of making
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
JP5831440B2 (ja) 2012-12-17 2015-12-09 株式会社ダイヤメット 粉末冶金用原料粉末
US9101954B2 (en) 2013-09-17 2015-08-11 Applied Materials, Inc. Geometries and patterns for surface texturing to increase deposition retention
JP2018119184A (ja) * 2017-01-26 2018-08-02 株式会社Adeka 電解エッチング液組成物、電解エッチング方法、電解エッチングされた基材、アルミニウム電解コンデンサ用電極材、及びコンデンサ
JP6525035B2 (ja) * 2017-08-29 2019-06-05 日本軽金属株式会社 アルミニウム部材及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6613586A (de) * 1966-09-27 1968-03-28
US4052275A (en) * 1976-12-02 1977-10-04 Polychrome Corporation Process for electrolytic graining of aluminum sheet
US4174269A (en) * 1978-06-21 1979-11-13 Ppg Industries, Inc. Method of treating electrodes
JPS56135095A (en) * 1980-03-26 1981-10-22 Mitsubishi Chem Ind Ltd Manufacture of supporter for planographic process block
US4276129A (en) * 1980-06-25 1981-06-30 Matsushita Electric Industrial Co., Ltd. Method for producing foil electrodes for electrolytic capacitor
US4396468A (en) * 1981-12-21 1983-08-02 American Hoechst Corporation Three phase graining of aluminum substrates
JPS60163423A (ja) * 1984-02-03 1985-08-26 昭和アルミニウム株式会社 電解コンデンサ電極用アルミニウム箔のエツチング方法

Also Published As

Publication number Publication date
IT8984942A0 (it) 1989-06-05
ZA904194B (en) 1991-03-27
DE69014418T2 (de) 1995-04-20
HU903321D0 (en) 1990-10-28
CA2018180A1 (en) 1990-12-05
AU5617690A (en) 1990-12-06
IT1235332B (it) 1992-06-26
EP0401601B1 (de) 1994-11-30
EP0401601A1 (de) 1990-12-12
KR910001093A (ko) 1991-01-30
US5064511A (en) 1991-11-12
HUT54316A (en) 1991-02-28
DD298364A5 (de) 1992-02-20
BR9002643A (pt) 1991-08-20
ATE114740T1 (de) 1994-12-15
JPH0324289A (ja) 1991-02-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee