DE68915529D1 - Integration von GaAs auf Si-Unterlage. - Google Patents
Integration von GaAs auf Si-Unterlage.Info
- Publication number
- DE68915529D1 DE68915529D1 DE68915529T DE68915529T DE68915529D1 DE 68915529 D1 DE68915529 D1 DE 68915529D1 DE 68915529 T DE68915529 T DE 68915529T DE 68915529 T DE68915529 T DE 68915529T DE 68915529 D1 DE68915529 D1 DE 68915529D1
- Authority
- DE
- Germany
- Prior art keywords
- gaas
- integration
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/026—Deposition thru hole in mask
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/097—Lattice strain and defects
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/945—Special, e.g. metal
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Led Devices (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP89200205A EP0380815B1 (de) | 1989-01-31 | 1989-01-31 | Integration von GaAs auf Si-Unterlage |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68915529D1 true DE68915529D1 (de) | 1994-06-30 |
DE68915529T2 DE68915529T2 (de) | 1994-12-01 |
Family
ID=8202308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68915529T Expired - Fee Related DE68915529T2 (de) | 1989-01-31 | 1989-01-31 | Integration von GaAs auf Si-Unterlage. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5108947A (de) |
EP (1) | EP0380815B1 (de) |
JP (1) | JP2954958B2 (de) |
DE (1) | DE68915529T2 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5256594A (en) * | 1989-06-16 | 1993-10-26 | Intel Corporation | Masking technique for depositing gallium arsenide on silicon |
US5212112A (en) * | 1991-05-23 | 1993-05-18 | At&T Bell Laboratories | Selective epitaxy of silicon in silicon dioxide apertures with suppression of unwanted formation of facets |
FR2682128B1 (fr) * | 1991-10-08 | 1993-12-03 | Thomson Csf | Procede de croissance de couches heteroepitaxiales. |
US5443685A (en) * | 1993-11-01 | 1995-08-22 | At&T Corp. | Composition and method for off-axis growth sites on nonpolar substrates |
GB0220438D0 (en) * | 2002-09-03 | 2002-10-09 | Univ Warwick | Formation of lattice-turning semiconductor substrates |
DE102005004582A1 (de) | 2005-01-26 | 2006-07-27 | Philipps-Universität Marburg | III/V-Halbleiter |
US8324660B2 (en) | 2005-05-17 | 2012-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
US9153645B2 (en) | 2005-05-17 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
WO2007112066A2 (en) | 2006-03-24 | 2007-10-04 | Amberwave Systems Corporation | Lattice-mismatched semiconductor structures and related methods for device fabrication |
US8173551B2 (en) | 2006-09-07 | 2012-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Defect reduction using aspect ratio trapping |
WO2008039534A2 (en) | 2006-09-27 | 2008-04-03 | Amberwave Systems Corporation | Quantum tunneling devices and circuits with lattice- mismatched semiconductor structures |
WO2008051503A2 (en) | 2006-10-19 | 2008-05-02 | Amberwave Systems Corporation | Light-emitter-based devices with lattice-mismatched semiconductor structures |
FR2912552B1 (fr) * | 2007-02-14 | 2009-05-22 | Soitec Silicon On Insulator | Structure multicouche et son procede de fabrication. |
US7825328B2 (en) | 2007-04-09 | 2010-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nitride-based multi-junction solar cell modules and methods for making the same |
US9508890B2 (en) * | 2007-04-09 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photovoltaics on silicon |
US8237151B2 (en) | 2009-01-09 | 2012-08-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Diode-based devices and methods for making the same |
US8304805B2 (en) | 2009-01-09 | 2012-11-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor diodes fabricated by aspect ratio trapping with coalesced films |
US8329541B2 (en) | 2007-06-15 | 2012-12-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | InP-based transistor fabrication |
WO2009035746A2 (en) | 2007-09-07 | 2009-03-19 | Amberwave Systems Corporation | Multi-junction solar cells |
US8183667B2 (en) | 2008-06-03 | 2012-05-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Epitaxial growth of crystalline material |
US8274097B2 (en) | 2008-07-01 | 2012-09-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reduction of edge effects from aspect ratio trapping |
US8981427B2 (en) | 2008-07-15 | 2015-03-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing of small composite semiconductor materials |
US20100072515A1 (en) | 2008-09-19 | 2010-03-25 | Amberwave Systems Corporation | Fabrication and structures of crystalline material |
KR101216541B1 (ko) | 2008-09-19 | 2012-12-31 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 에피텍셜층 과성장에 의한 장치의 형성 |
US8253211B2 (en) | 2008-09-24 | 2012-08-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor sensor structures with reduced dislocation defect densities |
EP2415083B1 (de) | 2009-04-02 | 2017-06-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Aus einer nicht polaren ebene eines kristallinen materials geformte vorrichtungen und verfahren zu ihrer herstellung |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598823A (en) * | 1979-01-20 | 1980-07-28 | Tdk Corp | Manufacture of single crystal element |
JPS61189619A (ja) * | 1985-02-18 | 1986-08-23 | Sharp Corp | 化合物半導体装置 |
JPS62213117A (ja) * | 1986-03-13 | 1987-09-19 | Oki Electric Ind Co Ltd | 半導体素子の製造方法 |
US4774205A (en) * | 1986-06-13 | 1988-09-27 | Massachusetts Institute Of Technology | Monolithic integration of silicon and gallium arsenide devices |
JPS63108709A (ja) * | 1986-10-25 | 1988-05-13 | Toyota Central Res & Dev Lab Inc | 半導体装置およびその製造方法 |
US4914053A (en) * | 1987-09-08 | 1990-04-03 | Texas Instruments Incorporated | Heteroepitaxial selective-area growth through insulator windows |
JPS6490518A (en) * | 1987-10-01 | 1989-04-07 | Mitsubishi Electric Corp | Formation of gaas epitaxial layer |
US4826784A (en) * | 1987-11-13 | 1989-05-02 | Kopin Corporation | Selective OMCVD growth of compound semiconductor materials on silicon substrates |
US4940672A (en) * | 1989-03-17 | 1990-07-10 | Kopin Corporation | Method of making monolithic integrated III-V type laser devices and silicon devices on silicon |
-
1989
- 1989-01-31 EP EP89200205A patent/EP0380815B1/de not_active Expired - Lifetime
- 1989-01-31 DE DE68915529T patent/DE68915529T2/de not_active Expired - Fee Related
-
1990
- 1990-01-25 US US07/470,356 patent/US5108947A/en not_active Expired - Fee Related
- 1990-01-26 JP JP1765090A patent/JP2954958B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0380815A1 (de) | 1990-08-08 |
JPH03114222A (ja) | 1991-05-15 |
US5108947A (en) | 1992-04-28 |
DE68915529T2 (de) | 1994-12-01 |
EP0380815B1 (de) | 1994-05-25 |
JP2954958B2 (ja) | 1999-09-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |