DE68915182D1 - Härtbare Klebstoffzusammensetzung. - Google Patents

Härtbare Klebstoffzusammensetzung.

Info

Publication number: DE68915182D1
Authority: DE; Germany
Prior art keywords: adhesive composition; curable adhesive; curable; composition; adhesive
Prior art date: 1988-02-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE68915182T

Other languages

English (en)

Inventor

Ryuichi Fujii

Takayuki Kawano

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Somar Corp

Original Assignee

Somar Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-02-20

Filing date

1989-02-20

Publication date

1994-06-16

1988-02-20 Priority claimed from JP63037854A external-priority patent/JP2700246B2/ja

1988-02-20 Priority claimed from JP63037853A external-priority patent/JP2700245B2/ja

1989-02-20 Application filed by Somar Corp filed Critical Somar Corp

1994-06-16 Application granted granted Critical

1994-06-16 Publication of DE68915182D1 publication Critical patent/DE68915182D1/de

2009-02-21 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
- C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Adhesives Or Adhesive Processes (AREA)
Macromonomer-Based Addition Polymer (AREA)

DE68915182T 1988-02-20 1989-02-20 Härtbare Klebstoffzusammensetzung. Expired - Lifetime DE68915182D1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP63037854A JP2700246B2 (ja)	1988-02-20	1988-02-20	チップ部品用硬化性組成物
JP63037853A JP2700245B2 (ja)	1988-02-20	1988-02-20	硬化性接着剤組成物

Publications (1)

Publication Number	Publication Date
DE68915182D1 true DE68915182D1 (de)	1994-06-16

Family

ID=26377010

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE68915182T Expired - Lifetime DE68915182D1 (de)	1988-02-20	1989-02-20	Härtbare Klebstoffzusammensetzung.

Country Status (2)

Country	Link
EP (1)	EP0330115B1 (de)
DE (1)	DE68915182D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0492521B1 (de) *	1990-12-28	1995-12-06	Denki Kagaku Kogyo Kabushiki Kaisha	Klebstoffzusammensetzung und metallgebundener Verbundkörper
DE4213999C2 (de) *	1992-04-29	1994-11-03	Glunz Ag	Härtbare Mischung für die Herstellung einer hochabriebfesten Beschichtung
FR2698636B1 (fr) *	1992-11-27	1995-02-17	Aerospatiale	Adhésif structural monocomposant durcissable sous rayonnement ionisant et procédé d'assemblage utilisant cet adhésif.
GB9420743D0 (en) *	1994-10-15	1994-11-30	Chemence Ltd	An aerobic preparation
US6617371B2 (en)	2001-06-08	2003-09-09	Addison Clear Wave, Llc	Single component room temperature stable heat-curable acrylate resin adhesive
US10975275B2 (en)	2015-11-03	2021-04-13	Lord Corporation	Elastomer adhesive with rapid tack development

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4309334A (en) *	1975-10-08	1982-01-05	Loctite Corporation	Thermally-resistant glass-filled adhesive/sealant compositions
DE3044318C2 (de) *	1980-11-25	1983-06-09	Henkel KGaA, 4000 Düsseldorf	Verwendung von Acrylsäureestern von Tris-(2-hydroxy-alkyl)-isocyanuraten in Klebstoffen sowie Ringöffnungsprodukte von Glycidylacrylaten mit Maleinsäurehalbestern von Tris-(2-hydroxy-alkyl)-isocyanuraten und Verfahren zur Herstellung dieser Verbindungen
EP0114117B1 (de) *	1983-01-18	1986-09-24	Loctite Corporation	Schnell vernetzbare Akrylmonomersysteme
JPS61211386A (ja) *	1985-03-15	1986-09-19	Suriibondo:Kk	安定性の良好な嫌気硬化性組成物

1989
- 1989-02-20 DE DE68915182T patent/DE68915182D1/de not_active Expired - Lifetime
- 1989-02-20 EP EP89102890A patent/EP0330115B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP0330115B1 (de)	1994-05-11
EP0330115A3 (de)	1991-08-07
EP0330115A2 (de)	1989-08-30

Legal Events

Date	Code	Title	Description
1994-11-03	8332	No legal effect for de

Publication	Publication Date	Title
DE68920635T2 (de)	1995-05-18	Härtbare Zusammensetzung.
DE68902340D1 (de)	1992-09-10	Klebemasse.
DE68924099T2 (de)	1996-02-01	Härtbare Zusammensetzung.
DE3871189D1 (de)	1992-06-25	Haertbare adhaesivzusammensetzungen.
NO885263D0 (no)	1988-11-25	Klebemiddelsammensetning.
DE58904705D1 (de)	1993-07-22	Vorgelierbarer klebstoff.
DE68915020D1 (de)	1994-06-09	Härtbare Zusammensetzung.
DE69016406T2 (de)	1995-08-17	Klebstoffzusammensetzung.
DE3852597D1 (de)	1995-02-09	Härtbare Zusammensetzung.
DE68909636T2 (de)	1994-03-03	Adhäsive Zusammensetzung.
DE68913427T2 (de)	1994-09-29	Härtbare Harzzusammensetzung.
DE69001938T2 (de)	1994-01-20	Klebstoffzusammensetzung.
NO891824L (no)	1989-11-06	Klebemiddelblandinger.
DE68901293D1 (de)	1992-05-27	Haertbare zusammensetzung.
DE68915182D1 (de)	1994-06-16	Härtbare Klebstoffzusammensetzung.
IT1233882B (it)	1992-04-21	Composizioni adesive.
DE68925953D1 (de)	1996-04-18	Härtbare Zusammensetzung
DE3888114T2 (de)	1994-07-07	Klebstoff-Zusammensetzung.
DE68906580T2 (de)	1993-10-28	Klebstoffzusammensetzungen.
DE68910160D1 (de)	1993-12-02	Klebstoff-Zusammensetzung.
DE68906578D1 (de)	1993-06-24	Klebstoffzusammensetzungen.
DE68908552D1 (de)	1993-09-23	Klebemitelzusammensetzung.
SG76694G (en)	1994-10-14	Curable adhesive composition.
ATE101637T1 (de)	1994-03-15	Druckempfindliche klebstoffzusammensetzungen.
NO911913D0 (no)	1991-05-16	Klebemiddel.