DE68910563D1 - Lichtempfindliches Polymer. - Google Patents

Lichtempfindliches Polymer.

Info

Publication number
DE68910563D1
DE68910563D1 DE89303513T DE68910563T DE68910563D1 DE 68910563 D1 DE68910563 D1 DE 68910563D1 DE 89303513 T DE89303513 T DE 89303513T DE 68910563 T DE68910563 T DE 68910563T DE 68910563 D1 DE68910563 D1 DE 68910563D1
Authority
DE
Germany
Prior art keywords
photosensitive polymer
photosensitive
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89303513T
Other languages
English (en)
Other versions
DE68910563T2 (de
Inventor
Hirotoshi Maeda
Kouichi Kunimune
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JNC Corp
Original Assignee
Chisso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chisso Corp filed Critical Chisso Corp
Application granted granted Critical
Publication of DE68910563D1 publication Critical patent/DE68910563D1/de
Publication of DE68910563T2 publication Critical patent/DE68910563T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C9/00—Aliphatic saturated hydrocarbons
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C7/00—Multicolour photographic processes or agents therefor; Regeneration of such processing agents; Photosensitive materials for multicolour processes
    • G03C7/30—Colour processes using colour-coupling substances; Materials therefor; Preparing or processing such materials
    • G03C7/32—Colour coupling substances
    • G03C7/36—Couplers containing compounds with active methylene groups
    • G03C7/38—Couplers containing compounds with active methylene groups in rings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polyamides (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE89303513T 1988-04-11 1989-04-10 Lichtempfindliches Polymer. Expired - Fee Related DE68910563T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8861288 1988-04-11

Publications (2)

Publication Number Publication Date
DE68910563D1 true DE68910563D1 (de) 1993-12-16
DE68910563T2 DE68910563T2 (de) 1994-04-28

Family

ID=13947634

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89303513T Expired - Fee Related DE68910563T2 (de) 1988-04-11 1989-04-10 Lichtempfindliches Polymer.

Country Status (5)

Country Link
US (1) US5025088A (de)
EP (1) EP0337698B1 (de)
JP (1) JP2626696B2 (de)
KR (1) KR940010316B1 (de)
DE (1) DE68910563T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0430221B1 (de) * 1989-11-30 1997-04-16 Sumitomo Bakelite Company Limited Fotoempfindliche Harzzusammensetzung
DE69030643T2 (de) * 1989-11-30 1997-09-25 Sumitomo Bakelite Co Lichtempfindliche Harzzusammensetzung und ihre Verwendung zur Herstellung eines Halbleiterapparats
JP2890213B2 (ja) * 1991-02-25 1999-05-10 チッソ株式会社 感光性重合体組成物及びパターンの形成方法
JP2687751B2 (ja) * 1991-03-18 1997-12-08 信越化学工業株式会社 感光性重合体材料
US5177181A (en) * 1991-06-06 1993-01-05 Occidental Chemical Corporation Diamines and photosensitive polyimides made therefrom
EP0718696B1 (de) * 1992-07-22 2002-01-16 Asahi Kasei Kabushiki Kaisha Photoempfindliche Polyimidvorlaüferzusammensetzung
JP3004583U (ja) * 1994-02-15 1994-11-22 相云 李 石材研磨機
US6071667A (en) 1995-04-13 2000-06-06 Hitachi Chemical Co., Ltd. Photosensitive resin composition containing a photosensitive polyamide resin
US6379865B1 (en) 2000-04-11 2002-04-30 3M Innovative Properties Company Photoimageable, aqueous acid soluble polyimide polymers
KR100805134B1 (ko) * 2001-07-03 2008-02-21 히다찌 가세이 고오교 가부시끼가이샤 감광성 수지 조성물, 이를 사용한 패턴제조법 및 전자부품
CN1668980B (zh) * 2002-07-11 2010-05-12 旭化成电子材料株式会社 高耐热性负型光敏树脂组合物
TWI262041B (en) * 2003-11-14 2006-09-11 Hitachi Chemical Co Ltd Formation method of metal layer on resin layer, printed wiring board, and production method thereof
JP5045145B2 (ja) * 2006-03-20 2012-10-10 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、この感光性樹脂組成物を用いたパターン形成方法及び電子部品
WO2018179382A1 (ja) * 2017-03-31 2018-10-04 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
KR102299419B1 (ko) * 2018-02-28 2021-09-06 주식회사 엘지화학 감광성 수지 조성물 및 경화막
WO2019193647A1 (ja) * 2018-04-03 2019-10-10 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体の製造方法、感光性樹脂組成物の製造方法、パターン硬化物の製造方法、層間絶縁膜、カバーコート層又は表面保護膜の製造方法、及び電子部品の製造方法
CN116178716B (zh) * 2023-05-04 2023-08-01 广州奥松电子股份有限公司 一种聚异酰亚胺及其制备方法和应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168942A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Photosensitive polymer composition
US4454220A (en) * 1982-01-04 1984-06-12 E. I. Du Pont De Nemours And Company Electrical device containing a radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound
US4416973A (en) * 1982-01-04 1983-11-22 E. I. Du Pont De Nemours & Co. Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound
JPS58223149A (ja) * 1982-06-22 1983-12-24 Toray Ind Inc 感光性ポリイミド用現像液
DE3233912A1 (de) * 1982-09-13 1984-03-15 Merck Patent Gmbh, 6100 Darmstadt Fotolacke zur ausbildung von reliefstrukturen aus hochwaermebestaendigen polymeren
US4515887A (en) * 1983-08-29 1985-05-07 General Electric Company Photopatternable dielectric compositions, method for making and use
US4587204A (en) * 1983-08-29 1986-05-06 General Electric Company Photopatternable dielectric compositions, method for making and use
DE3411697A1 (de) * 1984-03-29 1985-10-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von polyimid- und polyisoindolochinazolindion-reliefstrukturen
US4578328A (en) * 1984-07-09 1986-03-25 General Electric Company Photopatternable polyimide compositions and method for making
US4551522A (en) * 1985-04-26 1985-11-05 E. I. Du Pont De Nemours And Company Process for making photopolymerizable aromatic polyamic acid derivatives
US4830953A (en) * 1986-08-18 1989-05-16 Ciba-Geigy Corporation Radiation-sensitive coating composition with polyazide and polyimide and process of photo-crosslinking the coating
JPS63223746A (ja) * 1987-03-13 1988-09-19 Kanebo Ltd 樹脂皮膜によるパタ−ン形成方法

Also Published As

Publication number Publication date
DE68910563T2 (de) 1994-04-28
KR940010316B1 (ko) 1994-10-22
JPH0296168A (ja) 1990-04-06
EP0337698B1 (de) 1993-11-10
EP0337698A3 (en) 1990-06-06
EP0337698A2 (de) 1989-10-18
KR890016421A (ko) 1989-11-29
JP2626696B2 (ja) 1997-07-02
US5025088A (en) 1991-06-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee