DE68903683D1 - Dichtungsstruktur eines moduls. - Google Patents
Dichtungsstruktur eines moduls.Info
- Publication number
- DE68903683D1 DE68903683D1 DE8989305218T DE68903683T DE68903683D1 DE 68903683 D1 DE68903683 D1 DE 68903683D1 DE 8989305218 T DE8989305218 T DE 8989305218T DE 68903683 T DE68903683 T DE 68903683T DE 68903683 D1 DE68903683 D1 DE 68903683D1
- Authority
- DE
- Germany
- Prior art keywords
- module
- sealing structure
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4332—Bellows
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63125023A JPH0812890B2 (ja) | 1988-05-24 | 1988-05-24 | モジュール封止方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68903683D1 true DE68903683D1 (de) | 1993-01-14 |
DE68903683T2 DE68903683T2 (de) | 1993-04-01 |
Family
ID=14899943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8989305218T Expired - Fee Related DE68903683T2 (de) | 1988-05-24 | 1989-05-23 | Dichtungsstruktur eines moduls. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4949219A (de) |
EP (1) | EP0343936B1 (de) |
JP (1) | JPH0812890B2 (de) |
AU (1) | AU606524B2 (de) |
CA (1) | CA1298667C (de) |
DE (1) | DE68903683T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5006924A (en) * | 1989-12-29 | 1991-04-09 | International Business Machines Corporation | Heat sink for utilization with high density integrated circuit substrates |
JPH0770844B2 (ja) * | 1990-06-18 | 1995-07-31 | 富士通株式会社 | 通信機用キャビネット |
US5161087A (en) * | 1990-10-15 | 1992-11-03 | International Business Machines Corporation | Pivotal heat sink assembly |
JPH04206555A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 電子機器の冷却装置 |
JP2927010B2 (ja) * | 1991-03-01 | 1999-07-28 | 株式会社日立製作所 | 半導体パッケージ |
US5268814A (en) * | 1992-05-20 | 1993-12-07 | International Business Machines Corporation | Module packaging |
JP3067399B2 (ja) * | 1992-07-03 | 2000-07-17 | 株式会社日立製作所 | 半導体冷却装置 |
US5760333A (en) * | 1992-08-06 | 1998-06-02 | Pfu Limited | Heat-generating element cooling device |
US6140571A (en) * | 1992-08-06 | 2000-10-31 | Pfu Limited | Heat-generating element cooling device |
DE69329946T2 (de) * | 1992-08-06 | 2001-07-05 | Pfu Ltd | Kühler für eine wärmeerzeugungsvorrichtung |
US5578869A (en) * | 1994-03-29 | 1996-11-26 | Olin Corporation | Components for housing an integrated circuit device |
JP3058047B2 (ja) * | 1995-04-04 | 2000-07-04 | 株式会社日立製作所 | マルチチップモジュールの封止冷却構造 |
US6392431B1 (en) | 1996-10-23 | 2002-05-21 | Aetrium, Inc. | Flexibly suspended heat exchange head for a DUT |
JP2001223460A (ja) * | 2000-02-08 | 2001-08-17 | Fujitsu Ltd | 実装回路基板及びその製造方法 |
US7385821B1 (en) * | 2001-12-06 | 2008-06-10 | Apple Inc. | Cooling method for ICS |
US20130027885A1 (en) * | 2011-07-25 | 2013-01-31 | International Business Machines Corporation | Heat spreader for multi-chip modules |
CN103002722B (zh) * | 2012-12-18 | 2015-03-25 | 武汉光迅科技股份有限公司 | 一种功率设备的热控制装置 |
CN111406314B (zh) * | 2018-06-27 | 2023-09-22 | 富士电机株式会社 | 冷却装置、半导体模块以及车辆 |
JP7244747B2 (ja) * | 2019-02-28 | 2023-03-23 | 富士通株式会社 | 液浸槽及び液浸冷却装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4138692A (en) * | 1977-09-12 | 1979-02-06 | International Business Machines Corporation | Gas encapsulated cooling module |
JPS5941857A (ja) * | 1982-08-31 | 1984-03-08 | Mitsubishi Electric Corp | 半導体モジユ−ル装置 |
US4561011A (en) * | 1982-10-05 | 1985-12-24 | Mitsubishi Denki Kabushiki Kaisha | Dimensionally stable semiconductor device |
CA1227886A (en) * | 1984-01-26 | 1987-10-06 | Haruhiko Yamamoto | Liquid-cooling module system for electronic circuit components |
JPS61222242A (ja) * | 1985-03-28 | 1986-10-02 | Fujitsu Ltd | 冷却装置 |
US4833567A (en) * | 1986-05-30 | 1989-05-23 | Digital Equipment Corporation | Integral heat pipe module |
FR2632070B1 (fr) * | 1988-05-26 | 1990-11-23 | Bendix Electronics Sa | Circuit de commande de l'alimentation d'une charge electrique, a dispositif de detection d'un court-circuit de la charge |
-
1988
- 1988-05-24 JP JP63125023A patent/JPH0812890B2/ja not_active Expired - Fee Related
-
1989
- 1989-05-23 CA CA000600354A patent/CA1298667C/en not_active Expired - Fee Related
- 1989-05-23 EP EP19890305218 patent/EP0343936B1/de not_active Expired - Lifetime
- 1989-05-23 DE DE8989305218T patent/DE68903683T2/de not_active Expired - Fee Related
- 1989-05-23 AU AU35100/89A patent/AU606524B2/en not_active Ceased
- 1989-05-24 US US07/356,245 patent/US4949219A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0812890B2 (ja) | 1996-02-07 |
EP0343936A3 (en) | 1990-04-18 |
EP0343936B1 (de) | 1992-12-02 |
EP0343936A2 (de) | 1989-11-29 |
AU3510089A (en) | 1989-11-30 |
US4949219A (en) | 1990-08-14 |
CA1298667C (en) | 1992-04-07 |
DE68903683T2 (de) | 1993-04-01 |
AU606524B2 (en) | 1991-02-07 |
JPH01295450A (ja) | 1989-11-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |