DE68900072D1 - Bildaufnahmevorrichtung mit kleiner abmessung. - Google Patents
Bildaufnahmevorrichtung mit kleiner abmessung.Info
- Publication number
- DE68900072D1 DE68900072D1 DE8989400130T DE68900072T DE68900072D1 DE 68900072 D1 DE68900072 D1 DE 68900072D1 DE 8989400130 T DE8989400130 T DE 8989400130T DE 68900072 T DE68900072 T DE 68900072T DE 68900072 D1 DE68900072 D1 DE 68900072D1
- Authority
- DE
- Germany
- Prior art keywords
- image device
- small dimension
- dimension
- small
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8800679A FR2626408B1 (fr) | 1988-01-22 | 1988-01-22 | Capteur d'image a faible encombrement |
Publications (1)
Publication Number | Publication Date |
---|---|
DE68900072D1 true DE68900072D1 (de) | 1991-06-13 |
Family
ID=9362509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8989400130T Expired - Lifetime DE68900072D1 (de) | 1988-01-22 | 1989-01-17 | Bildaufnahmevorrichtung mit kleiner abmessung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5051802A (de) |
EP (1) | EP0325525B1 (de) |
JP (1) | JPH023969A (de) |
DE (1) | DE68900072D1 (de) |
FR (1) | FR2626408B1 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5198881A (en) * | 1989-12-28 | 1993-03-30 | Massachusetts Institute Of Technology | Barrier layer device processing |
JP3017780B2 (ja) * | 1990-09-10 | 2000-03-13 | 株式会社東芝 | 電子内視鏡撮像装置 |
US5418566A (en) * | 1990-09-10 | 1995-05-23 | Kabushiki Kaisha Toshiba | Compact imaging apparatus for electronic endoscope with improved optical characteristics |
JP2603522Y2 (ja) * | 1991-03-29 | 2000-03-15 | 日本電気株式会社 | イメージセンサ |
KR970005706B1 (ko) * | 1994-01-24 | 1997-04-19 | 금성일렉트론 주식회사 | 고체촬상소자 및 그 제조방법 |
US6757483B1 (en) | 1996-03-19 | 2004-06-29 | Pioneer Electronic Corporation | Information recording medium with aggregate attribute information recorded in video manager, apparatus for recording the same and apparatus for reproducing the same |
US5801849A (en) * | 1996-10-21 | 1998-09-01 | Telesensory Corporation | Image reading device and document scanning system |
IL123207A0 (en) * | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
DE19831570A1 (de) * | 1998-07-14 | 2000-01-20 | Siemens Ag | Biometrischer Sensor und Verfahren zu dessen Herstellung |
US6130448A (en) * | 1998-08-21 | 2000-10-10 | Gentex Corporation | Optical sensor package and method of making same |
GB9928025D0 (en) * | 1999-11-27 | 2000-01-26 | Vlsi Vision Ltd | Improvements in or relating to image sensor devices and endoscopes incorporationg improved image sensor devices |
US6512219B1 (en) | 2000-01-25 | 2003-01-28 | Amkor Technology, Inc. | Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area |
US6515269B1 (en) | 2000-01-25 | 2003-02-04 | Amkor Technology, Inc. | Integrally connected image sensor packages having a window support in contact with a window and the active area |
US6492699B1 (en) | 2000-05-22 | 2002-12-10 | Amkor Technology, Inc. | Image sensor package having sealed cavity over active area |
US6503780B1 (en) * | 2000-07-05 | 2003-01-07 | Amkor Technology, Inc. | Wafer scale image sensor package fabrication method |
US6407381B1 (en) * | 2000-07-05 | 2002-06-18 | Amkor Technology, Inc. | Wafer scale image sensor package |
FR2819103B1 (fr) * | 2000-12-29 | 2003-12-12 | St Microelectronics Sa | Boitier semi-conducteur optique a pastille transparente et son procede de fabrication |
GB2374726A (en) * | 2001-04-20 | 2002-10-23 | Kingpak Tech Inc | Stacked structure of an image sensor having image sensing chip located above integrated circuit |
US7256589B2 (en) | 2001-04-27 | 2007-08-14 | Atrua Technologies, Inc. | Capacitive sensor system with improved capacitance measuring sensitivity |
US20030013328A1 (en) * | 2001-05-22 | 2003-01-16 | Andrade Thomas L. | Connection assembly for integrated circuit sensors |
US7259573B2 (en) * | 2001-05-22 | 2007-08-21 | Atrua Technologies, Inc. | Surface capacitance sensor system using buried stimulus electrode |
JP2004363380A (ja) * | 2003-06-05 | 2004-12-24 | Sanyo Electric Co Ltd | 光半導体装置およびその製造方法 |
DE102004055677A1 (de) * | 2004-11-18 | 2006-06-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Chipträgerverbund und Verfahren zum Herstellen eines Chipträgerverbunds |
US20080157252A1 (en) * | 2006-12-27 | 2008-07-03 | Lite-On Semiconductor Corp. | Optical sensor package |
TWI332790B (en) * | 2007-06-13 | 2010-11-01 | Ind Tech Res Inst | Image sensor module with a three-dimensional dies-stacking structure |
US8193632B2 (en) * | 2008-08-06 | 2012-06-05 | Industrial Technology Research Institute | Three-dimensional conducting structure and method of fabricating the same |
US7964448B2 (en) * | 2008-09-18 | 2011-06-21 | Infineon Technologies Ag | Electronic device and method of manufacturing same |
US7880127B2 (en) * | 2008-10-27 | 2011-02-01 | Itt Manufacturing Enterprises, Inc. | Apparatus and method for aligning an image sensor including a header alignment means |
DE102009011479A1 (de) * | 2009-03-06 | 2010-09-09 | Olympus Winter & Ibe Gmbh | Chirurgisches Instrument |
US20110221018A1 (en) * | 2010-03-15 | 2011-09-15 | Xunqing Shi | Electronic Device Package and Methods of Manufacturing an Electronic Device Package |
US9899442B2 (en) | 2014-12-11 | 2018-02-20 | Invensas Corporation | Image sensor device |
US11069734B2 (en) | 2014-12-11 | 2021-07-20 | Invensas Corporation | Image sensor device |
US10269756B2 (en) | 2017-04-21 | 2019-04-23 | Invensas Bonding Technologies, Inc. | Die processing |
US10217720B2 (en) | 2017-06-15 | 2019-02-26 | Invensas Corporation | Multi-chip modules formed using wafer-level processing of a reconstitute wafer |
US10727219B2 (en) | 2018-02-15 | 2020-07-28 | Invensas Bonding Technologies, Inc. | Techniques for processing devices |
US11462419B2 (en) | 2018-07-06 | 2022-10-04 | Invensas Bonding Technologies, Inc. | Microelectronic assemblies |
US11296053B2 (en) | 2019-06-26 | 2022-04-05 | Invensas Bonding Technologies, Inc. | Direct bonded stack structures for increased reliability and improved yield in microelectronics |
US11742314B2 (en) | 2020-03-31 | 2023-08-29 | Adeia Semiconductor Bonding Technologies Inc. | Reliable hybrid bonded apparatus |
US11631647B2 (en) | 2020-06-30 | 2023-04-18 | Adeia Semiconductor Bonding Technologies Inc. | Integrated device packages with integrated device die and dummy element |
US11764177B2 (en) | 2020-09-04 | 2023-09-19 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
US11728273B2 (en) | 2020-09-04 | 2023-08-15 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3456159A (en) * | 1963-08-08 | 1969-07-15 | Ibm | Connections for microminiature functional components |
JPS5840870A (ja) * | 1981-09-03 | 1983-03-09 | Sanyo Electric Co Ltd | 受光装置の製造方法 |
JPS58107788A (ja) * | 1981-12-21 | 1983-06-27 | Mitsubishi Electric Corp | 固体カラ−イメ−ジセンサ |
JPS5947774A (ja) * | 1982-09-10 | 1984-03-17 | Fuji Electric Co Ltd | 光半導体装置 |
JPS5996751A (ja) * | 1982-11-26 | 1984-06-04 | Hitachi Ltd | 半導体装置 |
FR2565408B1 (fr) * | 1984-05-30 | 1987-04-10 | Thomson Csf | Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier |
-
1988
- 1988-01-22 FR FR8800679A patent/FR2626408B1/fr not_active Expired - Lifetime
-
1989
- 1989-01-17 DE DE8989400130T patent/DE68900072D1/de not_active Expired - Lifetime
- 1989-01-17 EP EP89400130A patent/EP0325525B1/de not_active Expired - Lifetime
- 1989-01-20 JP JP1011780A patent/JPH023969A/ja active Pending
-
1990
- 1990-08-06 US US07/563,826 patent/US5051802A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2626408B1 (fr) | 1990-05-11 |
JPH023969A (ja) | 1990-01-09 |
EP0325525B1 (de) | 1991-05-08 |
FR2626408A1 (fr) | 1989-07-28 |
EP0325525A1 (de) | 1989-07-26 |
US5051802A (en) | 1991-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ATMEL GRENOBLE, SAINT EGREVE, FR |
|
8339 | Ceased/non-payment of the annual fee |