DE60323152D1 - Polyarylen mit verminderter wärmeausdehung - Google Patents

Polyarylen mit verminderter wärmeausdehung

Info

Publication number
DE60323152D1
DE60323152D1 DE60323152T DE60323152T DE60323152D1 DE 60323152 D1 DE60323152 D1 DE 60323152D1 DE 60323152 T DE60323152 T DE 60323152T DE 60323152 T DE60323152 T DE 60323152T DE 60323152 D1 DE60323152 D1 DE 60323152D1
Authority
DE
Germany
Prior art keywords
polyarylene
heat expansion
reduced heat
crosslinked polyarylene
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60323152T
Other languages
English (en)
Inventor
Jeffrey C Hedrick
Muthumanickam Sankarapandian
Christy S Tyberg
James P Godschalx
Qing Shan Niu
H Craig Silvis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Dow Global Technologies LLC
Original Assignee
International Business Machines Corp
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp, Dow Global Technologies LLC filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE60323152D1 publication Critical patent/DE60323152D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/10—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aromatic carbon atoms, e.g. polyphenylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/312—Non-condensed aromatic systems, e.g. benzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/40—Polymerisation processes
    • C08G2261/46—Diels-Alder reactions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/90—Applications
    • C08G2261/92—TFT applications
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20—Cross-linking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/60—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE60323152T 2002-12-31 2003-11-24 Polyarylen mit verminderter wärmeausdehung Expired - Lifetime DE60323152D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/334,413 US6818285B2 (en) 2002-12-31 2002-12-31 Composition and method to achieve reduced thermal expansion in polyarylene networks
PCT/US2003/037535 WO2004060960A1 (en) 2002-12-31 2003-11-24 Composition and method to achieve reduced thermal expansion in polyarylene networks

Publications (1)

Publication Number Publication Date
DE60323152D1 true DE60323152D1 (de) 2008-10-02

Family

ID=32655041

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60323152T Expired - Lifetime DE60323152D1 (de) 2002-12-31 2003-11-24 Polyarylen mit verminderter wärmeausdehung

Country Status (11)

Country Link
US (1) US6818285B2 (de)
EP (1) EP1581578B1 (de)
JP (1) JP2006512768A (de)
KR (1) KR101022181B1 (de)
CN (1) CN100575385C (de)
AT (1) ATE405602T1 (de)
AU (1) AU2003294498A1 (de)
DE (1) DE60323152D1 (de)
HK (1) HK1084405A1 (de)
TW (1) TWI340750B (de)
WO (1) WO2004060960A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4637830B2 (ja) * 2003-04-02 2011-02-23 ダウ グローバル テクノロジーズ インコーポレイティド 多官能性の、置換モノマー類、および、そのポリアリーレン組成物
JP2005142473A (ja) * 2003-11-10 2005-06-02 Semiconductor Leading Edge Technologies Inc 半導体装置の製造方法
US20080090007A1 (en) * 2004-06-10 2008-04-17 Niu Q Jason Method Of Forming A Nanoporous Dielectric Film
CN101100420B (zh) * 2006-07-06 2010-12-29 中国科学院化学研究所 合成3,3’-(氧联二-1,4-亚苯基)双（2,4,5-三苯基环戊二烯酮）的方法
US9868820B2 (en) * 2014-08-29 2018-01-16 Rohm And Haas Electronic Materials Llc Polyarylene materials
US9752051B2 (en) * 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
US20170009006A1 (en) * 2015-07-06 2017-01-12 Rohm And Haas Electronic Materials Llc Polyarylene materials
US11042093B2 (en) * 2017-11-15 2021-06-22 Rohm And Haas Electronic Materials Llc Gap-filling method
GB202010228D0 (en) * 2020-07-03 2020-08-19 Sumitomo Chemical Co Thermally conductive material for electronic devices

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339526A (en) 1981-06-24 1982-07-13 International Business Machines Corporation Acetylene terminated, branched polyphenylene resist and protective coating for integrated circuit devices
US4400540A (en) 1982-04-08 1983-08-23 The United States Of America As Represented By The Secretary Of The Air Force Oxy and thioaryl-phenylated aromatic biscyclopentadienones
US5093279A (en) 1991-02-01 1992-03-03 International Business Machines Corporation Laser ablation damascene process
US5262354A (en) 1992-02-26 1993-11-16 International Business Machines Corporation Refractory metal capped low resistivity metal conductor lines and vias
US5486493A (en) 1994-02-25 1996-01-23 Jeng; Shin-Puu Planarized multi-level interconnect scheme with embedded low-dielectric constant insulators
US5550405A (en) 1994-12-21 1996-08-27 Advanced Micro Devices, Incorporated Processing techniques for achieving production-worthy, low dielectric, low interconnect resistance and high performance ICS
US5959157A (en) * 1995-06-26 1999-09-28 Alliedsignal, Inc. Process for making hydroxy-substituted ethynylated biphenyl compounds
US5965679A (en) 1996-09-10 1999-10-12 The Dow Chemical Company Polyphenylene oligomers and polymers
JP2000191752A (ja) * 1998-12-25 2000-07-11 Dow Chem Co:The ポリフェニレンオリゴマ―及びポリマ―
EP1157059A1 (de) 1999-01-08 2001-11-28 The Dow Chemical Company Polymere mit einer niedriegen dielektrischen konstante, guten haftung und zähigkeit, und die daraus hergestellten gegenstände
US6107357A (en) * 1999-11-16 2000-08-22 International Business Machines Corporatrion Dielectric compositions and method for their manufacture
US6359091B1 (en) 1999-11-22 2002-03-19 The Dow Chemical Company Polyarylene compositions with enhanced modulus profiles

Also Published As

Publication number Publication date
KR101022181B1 (ko) 2011-03-17
US20040126586A1 (en) 2004-07-01
JP2006512768A (ja) 2006-04-13
CN1745120A (zh) 2006-03-08
TW200427724A (en) 2004-12-16
US6818285B2 (en) 2004-11-16
KR20050091042A (ko) 2005-09-14
ATE405602T1 (de) 2008-09-15
TWI340750B (en) 2011-04-21
CN100575385C (zh) 2009-12-30
EP1581578A1 (de) 2005-10-05
AU2003294498A1 (en) 2004-07-29
EP1581578B1 (de) 2008-08-20
HK1084405A1 (en) 2006-07-28
WO2004060960A1 (en) 2004-07-22

Similar Documents

Publication Publication Date Title
HK1084405A1 (en) Composition and method to achieve reduced thermal expansion in polyarylene networks
TW200613388A (en) Oriented polyester film
HK1142990A1 (en) High power resistor having an improved operating temperature range and method for making same
DE60312358D1 (de) Photovoltaisches modul mit einstellbarem kühlkörper und herstellungsverfahren
DE60234558D1 (de) Brennkammerhemd mit hybrider Filmkühlung
MXPA03004772A (es) Composiciones adhesivas sensibles a presion reticuladas y articulos adhesivos basados en las mismas, utiles en aplicaciones a alta temperatura.
SE9901831L (sv) Bärare för elektronikkomponenter
DE60112033D1 (de) Heisse platte
DE69934653D1 (de) Brennkammerhemd mit Filmkühlung
TW200501458A (en) High powered light emitter packages with compact optics
WO2005115742A3 (en) Improved thermal interface material
SE0000481D0 (sv) Method and device relating to battery temperature regulation
DE502004004390D1 (de) Isolationsmaterial
CA2232425A1 (en) Functionally gradient material and its use in a semiconductor circuit substrate
TW200711558A (en) Heat dissipation device and composite material with high thermal conductivity
SE9804146D0 (sv) Packaging
WO2008101044A3 (en) Lamp for rapid thermal processing chamber
DE60334049D1 (de) Glas- und Bandzusammensetzung mit hoher Wärmeausdehnung
ATE456643T1 (de) Schmelzkleber
WO2003079435A3 (en) Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly
MXPA04000132A (es) Calentador de pelicula gruesa integrado con componentes de baja temperatura y metodo de fabricacion del mismo.
DE60021289D1 (de) Fluoroelastomerzusammensetzung mit hervorragender verarbeitbarkeit und hervorragenden niedrigtemperatureigenschaften
ATE460126T1 (de) Thermische kaustikvorrichtungen mit verbesserten heizprofilen
DE10083600D2 (de) Siliziumcarbid-Element
ATE363131T1 (de) Schnell aufheizende kathode

Legal Events

Date Code Title Description
8364 No opposition during term of opposition