DE60305590D1 - Vorrichtung und Verfahren zur Herstellung eines Bauteils aus einem Metall-Keramik-Komposit - Google Patents
Vorrichtung und Verfahren zur Herstellung eines Bauteils aus einem Metall-Keramik-KompositInfo
- Publication number
- DE60305590D1 DE60305590D1 DE60305590T DE60305590T DE60305590D1 DE 60305590 D1 DE60305590 D1 DE 60305590D1 DE 60305590 T DE60305590 T DE 60305590T DE 60305590 T DE60305590 T DE 60305590T DE 60305590 D1 DE60305590 D1 DE 60305590D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- metal
- component
- ceramic composite
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/122—Metallic interlayers based on refractory metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/402—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/407—Copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Products (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casting Support Devices, Ladles, And Melt Control Thereby (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002268100 | 2002-09-13 | ||
JP2002268100A JP4324704B2 (ja) | 2002-09-13 | 2002-09-13 | 金属−セラミックス複合部材の製造装置、製造用鋳型、並びに製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60305590D1 true DE60305590D1 (de) | 2006-07-06 |
DE60305590T2 DE60305590T2 (de) | 2006-10-05 |
Family
ID=31944501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60305590T Expired - Lifetime DE60305590T2 (de) | 2002-09-13 | 2003-09-12 | Vorrichtung und Verfahren zur Herstellung eines Bauteils aus einem Metall-Keramik-Komposit |
Country Status (4)
Country | Link |
---|---|
US (2) | US7131483B2 (de) |
EP (1) | EP1400500B1 (de) |
JP (1) | JP4324704B2 (de) |
DE (1) | DE60305590T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4324704B2 (ja) | 2002-09-13 | 2009-09-02 | Dowaメタルテック株式会社 | 金属−セラミックス複合部材の製造装置、製造用鋳型、並びに製造方法 |
JP4543279B2 (ja) * | 2004-03-31 | 2010-09-15 | Dowaメタルテック株式会社 | アルミニウム接合部材の製造方法 |
US7532481B2 (en) * | 2004-04-05 | 2009-05-12 | Mitsubishi Materials Corporation | Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material |
JP4565249B2 (ja) * | 2004-08-26 | 2010-10-20 | Dowaメタルテック株式会社 | 金属−セラミックス接合基板およびその製造方法 |
JP4692716B2 (ja) * | 2004-10-04 | 2011-06-01 | Dowaメタルテック株式会社 | 溶湯供給装置 |
JP5176042B2 (ja) * | 2004-11-05 | 2013-04-03 | Dowaメタルテック株式会社 | 電子部品搭載基板の製造装置および製造方法 |
US7584778B2 (en) | 2005-09-21 | 2009-09-08 | United Technologies Corporation | Method of producing a castable high temperature aluminum alloy by controlled solidification |
JP4965305B2 (ja) * | 2006-03-31 | 2012-07-04 | Dowaメタルテック株式会社 | 金属−セラミックス接合基板の製造方法 |
US9179579B2 (en) * | 2006-06-08 | 2015-11-03 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
JP4965314B2 (ja) * | 2007-03-30 | 2012-07-04 | Dowaメタルテック株式会社 | 金属−セラミックス接合基板の製造装置 |
US8056606B2 (en) * | 2009-10-26 | 2011-11-15 | General Electric Company | Methods of making and using ceramic metallic interlocked components |
CN102401358B (zh) | 2010-09-10 | 2016-08-03 | 欧司朗股份有限公司 | 冷却体的制造方法、冷却体以及具有该冷却体的照明装置 |
JP5837754B2 (ja) * | 2011-03-23 | 2015-12-24 | Dowaメタルテック株式会社 | 金属−セラミックス接合基板およびその製造方法 |
JP6138026B2 (ja) * | 2013-11-12 | 2017-05-31 | 日本メクトロン株式会社 | 導電ペーストの充填方法、および多層プリント配線板の製造方法 |
US10088456B2 (en) | 2014-03-31 | 2018-10-02 | Texas Instruments Incorporated | Scanning acoustic microscopy system and method |
JP2017212316A (ja) * | 2016-05-25 | 2017-11-30 | Dowaホールディングス株式会社 | 金属−セラミックス接合基板およびその製造方法 |
US10782316B2 (en) * | 2017-01-09 | 2020-09-22 | Delta Design, Inc. | Socket side thermal system |
JP2022048812A (ja) * | 2020-09-15 | 2022-03-28 | Dowaメタルテック株式会社 | 放熱部材およびその製造方法 |
WO2023278632A1 (en) | 2021-06-30 | 2023-01-05 | Delta Design, Inc. | Temperature control system including contactor assembly |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH416428A (fr) | 1962-07-10 | 1966-06-30 | British Aluminium Co Ltd | Procédé pour assembler un métal conducteur de l'électricité avec un élément fait d'une substance dure réfractaire et assemblage obtenu par ce procédé |
GB1211945A (en) | 1968-02-22 | 1970-11-11 | Lev Avromovich Volokhonsky | Electric furnaces |
US3842896A (en) * | 1973-06-04 | 1974-10-22 | Monsanto Co | Method for producing composite metal wire |
JP2918191B2 (ja) | 1994-04-11 | 1999-07-12 | 同和鉱業株式会社 | 金属−セラミックス複合部材の製造方法 |
JP3286102B2 (ja) | 1995-02-10 | 2002-05-27 | 日本碍子株式会社 | 複合鋳造体及びその製造方法 |
US5615727A (en) * | 1995-02-24 | 1997-04-01 | Ollman; Melvin L. | Composite metal strip and methods of making same |
JPH09315875A (ja) | 1996-05-29 | 1997-12-09 | Dowa Mining Co Ltd | アルミニウム−セラミックス複合基板及びその製造方法 |
JP3837680B2 (ja) | 1996-10-24 | 2006-10-25 | 同和鉱業株式会社 | 金属−セラミックス複合基板製造用鋳型 |
US5736199A (en) * | 1996-12-05 | 1998-04-07 | Northeastern University | Gating system for continuous pressure infiltration processes |
DE19731124C1 (de) * | 1997-07-19 | 1999-01-21 | Schloemann Siemag Ag | Verfahren und Vorrichtung zur Erzeugung von beschichtetem Warm- und Kaltband |
JP4237284B2 (ja) | 1998-02-16 | 2009-03-11 | Dowaホールディングス株式会社 | 金属ーセラミックス複合部材の製造方法、製造装置、及び製造用鋳型 |
JP3452822B2 (ja) * | 1999-01-12 | 2003-10-06 | 同和鉱業株式会社 | アルミニウム−セラミックス複合部材の製造方法 |
JP3710048B2 (ja) * | 2000-08-29 | 2005-10-26 | 矢崎総業株式会社 | 繊維束内へ金属を含浸させる圧力含浸装置 |
DE10142093B4 (de) * | 2000-08-31 | 2004-02-12 | Yazaki Corp. | Verfahren zum Infiltrieren eines strangförmigen Materials mit einem geschmolzenen Metall und Vorrichtung hierfür |
JP4756200B2 (ja) | 2000-09-04 | 2011-08-24 | Dowaメタルテック株式会社 | 金属セラミックス回路基板 |
JP3613759B2 (ja) | 2000-09-11 | 2005-01-26 | 同和鉱業株式会社 | 金属−セラミックス複合基板 |
US6705384B2 (en) * | 2001-10-23 | 2004-03-16 | Alcoa Inc. | Simultaneous multi-alloy casting |
JP4324704B2 (ja) * | 2002-09-13 | 2009-09-02 | Dowaメタルテック株式会社 | 金属−セラミックス複合部材の製造装置、製造用鋳型、並びに製造方法 |
-
2002
- 2002-09-13 JP JP2002268100A patent/JP4324704B2/ja not_active Expired - Lifetime
-
2003
- 2003-09-11 US US10/659,305 patent/US7131483B2/en not_active Expired - Lifetime
- 2003-09-12 DE DE60305590T patent/DE60305590T2/de not_active Expired - Lifetime
- 2003-09-12 EP EP03020807A patent/EP1400500B1/de not_active Expired - Lifetime
-
2006
- 2006-09-28 US US11/528,425 patent/US8011416B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1400500B1 (de) | 2006-05-31 |
US8011416B2 (en) | 2011-09-06 |
JP2004105978A (ja) | 2004-04-08 |
DE60305590T2 (de) | 2006-10-05 |
JP4324704B2 (ja) | 2009-09-02 |
US20070017652A1 (en) | 2007-01-25 |
US20040123968A1 (en) | 2004-07-01 |
US7131483B2 (en) | 2006-11-07 |
EP1400500A1 (de) | 2004-03-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |