DE60238147D1 - Verfahren zur selbstanordnung elektronischer schaltkreise und damit hergestellte schaltungen - Google Patents
Verfahren zur selbstanordnung elektronischer schaltkreise und damit hergestellte schaltungenInfo
- Publication number
- DE60238147D1 DE60238147D1 DE60238147T DE60238147T DE60238147D1 DE 60238147 D1 DE60238147 D1 DE 60238147D1 DE 60238147 T DE60238147 T DE 60238147T DE 60238147 T DE60238147 T DE 60238147T DE 60238147 D1 DE60238147 D1 DE 60238147D1
- Authority
- DE
- Germany
- Prior art keywords
- self
- circuits
- arranging electronic
- made therefor
- electronic circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000001338 self-assembly Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/701—Organic molecular electronic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Bipolar Transistors (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2002/040307 WO2004059730A1 (en) | 2002-12-18 | 2002-12-18 | Method of self-assembling electronic circuitry and circuits formed thereby |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60238147D1 true DE60238147D1 (de) | 2010-12-09 |
Family
ID=32679928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60238147T Expired - Lifetime DE60238147D1 (de) | 2002-12-18 | 2002-12-18 | Verfahren zur selbstanordnung elektronischer schaltkreise und damit hergestellte schaltungen |
Country Status (10)
Country | Link |
---|---|
US (1) | US7615776B2 (de) |
EP (1) | EP1579499B1 (de) |
JP (1) | JP4755827B2 (de) |
CN (1) | CN100386868C (de) |
AT (1) | ATE486368T1 (de) |
AU (1) | AU2002351391A1 (de) |
DE (1) | DE60238147D1 (de) |
IL (1) | IL169138A (de) |
TW (1) | TWI240373B (de) |
WO (1) | WO2004059730A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4635410B2 (ja) * | 2002-07-02 | 2011-02-23 | ソニー株式会社 | 半導体装置及びその製造方法 |
WO2006076036A2 (en) * | 2004-05-25 | 2006-07-20 | The Trustees Of The University Of Pennsylvania | Nanostructure assemblies, methods and devices thereof |
WO2006102292A2 (en) * | 2005-03-21 | 2006-09-28 | The Trustees Of The University Of Pennsylvania | Nanogaps: methods and devices containing same |
FI122011B (fi) * | 2007-06-08 | 2011-07-15 | Teknologian Tutkimuskeskus Vtt | Menetelmä elektroniikkamoduulin tuottamiseksi, välituote elektroniikkamoduulin valmistamiseksi, muistielementti, painettu elektroniikkatuote, anturilaite sekä RFID-tunniste |
FI122644B (fi) * | 2007-06-08 | 2012-04-30 | Teknologian Tutkimuskeskus Vtt | Menetelmä sähköisesti johtavien tai puolijohtavien reittien muodostamiseksi substraatille sekä menetelmän käyttö transistorien tuottamiseen ja anturien valmistukseen |
FI122014B (fi) * | 2007-06-08 | 2011-07-15 | Teknologian Tutkimuskeskus Vtt | Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi |
JP5846626B2 (ja) * | 2011-07-12 | 2016-01-20 | 国立研究開発法人情報通信研究機構 | 超伝導単一光子検出システムおよび超伝導単一光子検出方法 |
US8871601B2 (en) | 2012-12-27 | 2014-10-28 | Intermolecular, Inc. | Diffusion barriers |
US8859439B1 (en) | 2013-03-28 | 2014-10-14 | International Business Machines Corporation | Solution-assisted carbon nanotube placement with graphene electrodes |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6290839B1 (en) * | 1998-06-23 | 2001-09-18 | Clinical Micro Sensors, Inc. | Systems for electrophoretic transport and detection of analytes |
US6262129B1 (en) * | 1998-07-31 | 2001-07-17 | International Business Machines Corporation | Method for producing nanoparticles of transition metals |
US6265021B1 (en) * | 1998-07-31 | 2001-07-24 | International Business Machines Corporation | Nanoparticle structures utilizing synthetic DNA lattices |
US6340822B1 (en) * | 1999-10-05 | 2002-01-22 | Agere Systems Guardian Corp. | Article comprising vertically nano-interconnected circuit devices and method for making the same |
US7335603B2 (en) * | 2000-02-07 | 2008-02-26 | Vladimir Mancevski | System and method for fabricating logic devices comprising carbon nanotube transistors |
US6294450B1 (en) * | 2000-03-01 | 2001-09-25 | Hewlett-Packard Company | Nanoscale patterning for the formation of extensive wires |
US20020079487A1 (en) * | 2000-10-12 | 2002-06-27 | G. Ramanath | Diffusion barriers comprising a self-assembled monolayer |
US6755956B2 (en) * | 2000-10-24 | 2004-06-29 | Ut-Battelle, Llc | Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
AU2002227138A1 (en) * | 2000-10-24 | 2002-05-06 | Molecular Electronics Corporation | Three-terminal field-controlled molecular devices |
US6562633B2 (en) * | 2001-02-26 | 2003-05-13 | International Business Machines Corporation | Assembling arrays of small particles using an atomic force microscope to define ferroelectric domains |
WO2002080360A1 (en) * | 2001-03-30 | 2002-10-10 | California Institute Of Technology | Pattern-aligned carbon nanotube growth and tunable resonator apparatus |
JP2004136377A (ja) * | 2002-10-15 | 2004-05-13 | Nippon Telegr & Teleph Corp <Ntt> | 分子ナノワイヤ−ナノ微粒子複合体、その製造方法ならびに該複合体を用いた分子ワイヤリング法 |
-
2002
- 2002-12-18 JP JP2004563135A patent/JP4755827B2/ja not_active Expired - Fee Related
- 2002-12-18 DE DE60238147T patent/DE60238147D1/de not_active Expired - Lifetime
- 2002-12-18 AU AU2002351391A patent/AU2002351391A1/en not_active Abandoned
- 2002-12-18 WO PCT/US2002/040307 patent/WO2004059730A1/en active Application Filing
- 2002-12-18 CN CNB028300653A patent/CN100386868C/zh not_active Expired - Lifetime
- 2002-12-18 EP EP02787050A patent/EP1579499B1/de not_active Expired - Lifetime
- 2002-12-18 AT AT02787050T patent/ATE486368T1/de not_active IP Right Cessation
- 2002-12-18 US US10/538,935 patent/US7615776B2/en active Active
-
2003
- 2003-12-02 TW TW092133852A patent/TWI240373B/zh not_active IP Right Cessation
-
2005
- 2005-06-14 IL IL169138A patent/IL169138A/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI240373B (en) | 2005-09-21 |
CN1714443A (zh) | 2005-12-28 |
ATE486368T1 (de) | 2010-11-15 |
EP1579499A1 (de) | 2005-09-28 |
JP4755827B2 (ja) | 2011-08-24 |
US20060049486A1 (en) | 2006-03-09 |
IL169138A (en) | 2011-09-27 |
EP1579499B1 (de) | 2010-10-27 |
TW200520156A (en) | 2005-06-16 |
JP2006511090A (ja) | 2006-03-30 |
WO2004059730A1 (en) | 2004-07-15 |
CN100386868C (zh) | 2008-05-07 |
EP1579499A4 (de) | 2007-09-12 |
AU2002351391A1 (en) | 2004-07-22 |
IL169138A0 (en) | 2007-07-04 |
US7615776B2 (en) | 2009-11-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE369626T1 (de) | Verfahren zur herstellung von elektronischen bauelementen | |
IL169138A0 (en) | Method of self-assembling electronic circuitry and circuits thereby | |
ATE491228T1 (de) | Magnetische selbstanordnung von integrierten schaltungen | |
DE60330969D1 (de) | Düsen und komponenten davon sowie herstellungsverfahren dafür | |
TW200640325A (en) | Wiring board manufacturing method | |
TW200721934A (en) | Electronic component embedded board and its manufacturing method | |
TW200746231A (en) | Method to produce semiconductor components and thin-film semiconductor components | |
WO2005024910A3 (en) | Apparatus and method for integrated circuit power management | |
WO2005114235A3 (en) | Method and structure to develop a test program for semiconductor integrated circuits | |
TW200631145A (en) | A heat sink, an electronic component package, and a method of manufacturing a heat sink | |
TW200610080A (en) | Electronic device and method of manufacturing the same | |
ATE360833T1 (de) | Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren | |
ATE531131T1 (de) | Verfahren und vorrichtung zum verteilen mehrerer signaleingänge an mehrere integrierte schaltungen | |
DE10295165D2 (de) | Molekulares elektronisches Bauelement zum Aufbau nanoelektronischer Schaltungen, molekulare elektronische Baugruppe, elektronische Schaltung und Herstellungsverfahren | |
DE69715472D1 (de) | Herstellungsverfahren für einen integrierten schaltkreis und der damit hergetellte integrierte schaltkreis | |
ATE368369T1 (de) | Durchkontaktierung von flexiblen leiterplatten | |
ATE383737T1 (de) | Verfahren zum zusammenbau einer schaltung | |
TW200501845A (en) | Multi-layered circuit board and electromagnetic shielding method for the multi-layered circuit board | |
ATE516246T1 (de) | Verfahren zur herstellung einer elektronischen baugruppe; elektronische baugruppe, abdeckung und substrat | |
DE502005006555D1 (de) | Trägermaterial sowie verfahren zur herstellung eines wertdokumentes | |
TW200802716A (en) | Devices and methods for integrated circuit manufacturing | |
EP1805794A4 (de) | Integrierte halbleiterschaltung und entwurfsverfahren dafür und elektronische vorrichtung damit | |
TW200725844A (en) | Substrate including a multi-layer interconnection structure, methods of manufacturing and recycling the same, method of packaging electronic devices by using the same, and method of manufacturing an interconnection device | |
FR2877537B1 (fr) | Boitier microelectronique multiplans | |
WO2003096158A3 (en) | Method and apparatus for assembling printed circuit boards |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8320 | Willingness to grant licences declared (paragraph 23) |