DE60236645D1 - Isolierte thermische schnittstelle - Google Patents

Isolierte thermische schnittstelle

Info

Publication number
DE60236645D1
DE60236645D1 DE60236645T DE60236645T DE60236645D1 DE 60236645 D1 DE60236645 D1 DE 60236645D1 DE 60236645 T DE60236645 T DE 60236645T DE 60236645 T DE60236645 T DE 60236645T DE 60236645 D1 DE60236645 D1 DE 60236645D1
Authority
DE
Germany
Prior art keywords
thermal interface
insulated thermal
major surfaces
presented
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60236645T
Other languages
English (en)
Inventor
Jing-Wen Tzeng
Daniel Witold Krassowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Graftech International Holdings Inc
Original Assignee
Graftech International Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25247230&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60236645(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Graftech International Holdings Inc filed Critical Graftech International Holdings Inc
Application granted granted Critical
Publication of DE60236645D1 publication Critical patent/DE60236645D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Wood Science & Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Conductors (AREA)
  • Magnetic Heads (AREA)
  • Glass Compositions (AREA)
  • Manufacturing Of Electric Cables (AREA)
DE60236645T 2001-04-05 2002-04-01 Isolierte thermische schnittstelle Expired - Lifetime DE60236645D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/826,676 US7166912B2 (en) 2001-04-05 2001-04-05 Isolated thermal interface
PCT/US2002/010218 WO2002082535A1 (en) 2001-04-05 2002-04-01 Isolated thermal interface

Publications (1)

Publication Number Publication Date
DE60236645D1 true DE60236645D1 (de) 2010-07-22

Family

ID=25247230

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60236645T Expired - Lifetime DE60236645D1 (de) 2001-04-05 2002-04-01 Isolierte thermische schnittstelle

Country Status (5)

Country Link
US (1) US7166912B2 (de)
EP (2) EP2081225A3 (de)
AT (1) ATE470954T1 (de)
DE (1) DE60236645D1 (de)
WO (1) WO2002082535A1 (de)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6696910B2 (en) * 2001-07-12 2004-02-24 Custom One Design, Inc. Planar inductors and method of manufacturing thereof
US6838750B2 (en) * 2001-07-12 2005-01-04 Custom One Design, Inc. Interconnect circuitry, multichip module, and methods of manufacturing thereof
US20060046034A1 (en) * 2001-07-25 2006-03-02 Schober, Inc. Solid surface products
US7276273B2 (en) * 2003-10-14 2007-10-02 Advanced Energy Technology Inc. Heat spreader for display device
US7303820B2 (en) 2003-10-14 2007-12-04 Graftech International Holdings Inc. Heat spreader for display device
US7160619B2 (en) * 2003-10-14 2007-01-09 Advanced Energy Technology Inc. Heat spreader for emissive display device
US8211260B2 (en) * 2003-10-14 2012-07-03 Graftech International Holdings Inc. Heat spreader for plasma display panel
US6982874B2 (en) 2003-11-25 2006-01-03 Advanced Energy Technology Inc. Thermal solution for electronic devices
US7051790B2 (en) * 2003-12-19 2006-05-30 Asia Vital Component Co., Ltd. Protect cover for a radiator
US20050136187A1 (en) * 2003-12-23 2005-06-23 Weber Thomas W. Method of improving adhesion of a coating to a flexible graphite material
US20070053168A1 (en) * 2004-01-21 2007-03-08 General Electric Company Advanced heat sinks and thermal spreaders
US6935420B1 (en) * 2004-06-16 2005-08-30 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US7161809B2 (en) * 2004-09-15 2007-01-09 Advanced Energy Technology Inc. Integral heat spreader
US7799428B2 (en) * 2004-10-06 2010-09-21 Graftech International Holdings Inc. Sandwiched thermal solution
US7306847B2 (en) 2005-01-28 2007-12-11 Graftech International Holdings Inc. Heat spreader for display device
US20090114633A1 (en) * 2005-02-17 2009-05-07 David Naylor Portable Pouch Heating Unit
US20090101632A1 (en) * 2005-02-17 2009-04-23 David Naylor Heating unit for direct current applications
US20090107986A1 (en) * 2005-02-17 2009-04-30 David Naylor Three layer glued laminate heating unit
US10920379B2 (en) 2005-02-17 2021-02-16 Greenheat Ip Holdings Llc Grounded modular heated cover
US8258443B2 (en) * 2005-02-17 2012-09-04 417 And 7/8, Llc Heating unit for warming pallets
US8633425B2 (en) * 2005-02-17 2014-01-21 417 And 7/8, Llc Systems, methods, and devices for storing, heating, and dispensing fluid
US20070262073A1 (en) * 2005-09-01 2007-11-15 David Naylor Modular heated cover
US20090302023A1 (en) * 2008-05-12 2009-12-10 Thomas Caterina Heating unit for warming pallets of materials
US9945080B2 (en) * 2005-02-17 2018-04-17 Greenheat Ip Holdings, Llc Grounded modular heated cover
US7880121B2 (en) * 2005-02-17 2011-02-01 David Naylor Modular radiant heating apparatus
US9392646B2 (en) 2005-02-17 2016-07-12 417 And 7/8, Llc Pallet warmer heating unit
US20090114634A1 (en) 2005-02-17 2009-05-07 David Naylor Heating unit for warming fluid conduits
US20090107972A1 (en) * 2005-02-17 2009-04-30 David Naylor Heating unit for warming propane tanks
US20090107975A1 (en) * 2005-02-17 2009-04-30 Thomas Caterina Heating unit for warming pallets
US9087669B2 (en) 2005-06-27 2015-07-21 Graftech International Holdings Inc. Display device having improved properties
US7385819B1 (en) 2005-06-27 2008-06-10 Graftech International Holdings Inc. Display device
US9081220B2 (en) 2005-06-27 2015-07-14 Graftech International Holdings Inc. Optimized frame system for a display device
US9104058B2 (en) 2005-06-27 2015-08-11 Graftech International Holdings Inc. Optimized frame system for a liquid crystal display device
JP4801537B2 (ja) 2005-10-13 2011-10-26 ポリマテック株式会社 キーシート
EP1800763A1 (de) * 2005-12-20 2007-06-27 Sgl Carbon Ag Verfahren zur Beschichtung von Graphitfolie
CN100534280C (zh) * 2006-03-16 2009-08-26 富准精密工业(深圳)有限公司 热传介质保护装置
KR100760770B1 (ko) * 2006-03-29 2007-09-21 삼성에스디아이 주식회사 플라즈마 표시장치
US20100140792A1 (en) * 2006-10-31 2010-06-10 The Regents Of The University Of California Graphite nanoplatelets for thermal and electrical applications
CN101562964B (zh) * 2008-04-14 2013-01-09 鸿富锦精密工业（深圳）有限公司 导热介质保护盖及具有该保护盖的散热装置
US7779895B2 (en) * 2008-04-14 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Protective device for protecting thermal interface material and fasteners of heat dissipation device
CN101573020A (zh) * 2008-04-28 2009-11-04 富准精密工业(深圳)有限公司 保护盖
US20100009174A1 (en) * 2008-07-10 2010-01-14 Reis Bradley E Heat Dissipation For Low Profile Devices
JP5271879B2 (ja) * 2008-11-28 2013-08-21 富士高分子工業株式会社 熱拡散シート及びその実装方法
US8955580B2 (en) * 2009-08-14 2015-02-17 Wah Hong Industrial Corp. Use of a graphite heat-dissipation device including a plating metal layer
TW201035513A (en) * 2009-03-25 2010-10-01 Wah Hong Ind Corp Method for manufacturing heat dissipation interface device and product thereof
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US20100314081A1 (en) * 2009-06-12 2010-12-16 Reis Bradley E High Temperature Graphite Heat Exchanger
US8405600B2 (en) * 2009-12-04 2013-03-26 Graftech International Holdings Inc. Method for reducing temperature-caused degradation in the performance of a digital reader
JP2012077988A (ja) * 2010-09-30 2012-04-19 Fujitsu Ltd 熱中継機構及び放熱フィン
CN102655128A (zh) * 2011-03-03 2012-09-05 硕恩科技股份有限公司 多孔性石墨散热器及多孔性石墨的制备方法
US10347559B2 (en) 2011-03-16 2019-07-09 Momentive Performance Materials Inc. High thermal conductivity/low coefficient of thermal expansion composites
DE102011081149A1 (de) * 2011-08-17 2013-02-21 Sgl Carbon Se Wärmeableiter und elektrischer Energiespeicher
CN103650134B (zh) * 2011-10-20 2017-08-25 松下电器产业株式会社 半导体装置
CN102917574B (zh) * 2012-10-24 2015-05-27 华为技术有限公司 导热垫、制造导热垫的方法、散热装置和电子设备
WO2015026704A1 (en) * 2013-08-21 2015-02-26 Graftech International Holdings Inc. Mechanically isolated thermal link
US20150334871A1 (en) * 2014-05-19 2015-11-19 Laird Technologies, Inc. Thermal interface materials with thin film sealants
US20160168037A1 (en) 2014-12-10 2016-06-16 Hyundai Motor Company Thermal interface material and method for manufacturing thermal interface material
US20160242321A1 (en) * 2015-02-13 2016-08-18 Laird Technologies, Inc. Mid-plates and electromagnetic interference (emi) board level shields with embedded and/or internal heat spreaders
CN107850703B (zh) 2015-07-24 2021-07-27 3M创新有限公司 带散热层的反射叠堆
WO2017044712A1 (en) 2015-09-11 2017-03-16 Laird Technologies, Inc. Devices for absorbing energy from electronic components
EP3733527B1 (de) * 2017-12-29 2022-08-17 Airbus Defence and Space SA Thermischer verbinder mit hoher leitfähigkeit
JP7451088B2 (ja) 2019-03-29 2024-03-18 大阪瓦斯株式会社 熱伝導材料
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
KR20230061446A (ko) * 2020-09-04 2023-05-08 네오그라프 솔루션즈, 엘엘씨 흑연 엘리먼트를 포함하는 열 관리 시스템을 갖는 전자 디바이스

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991581A (en) * 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
US4471837A (en) * 1981-12-28 1984-09-18 Aavid Engineering, Inc. Graphite heat-sink mountings
US4455334A (en) * 1982-05-21 1984-06-19 Nippon Pillar Packing Co. Ltd. Molded gland packing
US4611813A (en) * 1984-09-28 1986-09-16 Combustion Engineering Co., Inc. Method of and apparatus for providing an annular seal
US4867235A (en) * 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
FR2616997B1 (fr) * 1987-06-16 1989-08-25 Thomson Csf Support pour circuit imprime, formant drain thermique a dilatation controlee, et procede de fabrication
US4895713A (en) * 1987-08-31 1990-01-23 Union Carbide Corporation Intercalation of graphite
US5198063A (en) * 1991-06-03 1993-03-30 Ucar Carbon Technology Corporation Method and assembly for reinforcing flexible graphite and article
US5270902A (en) * 1992-12-16 1993-12-14 International Business Machines Corporation Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip
US5650592A (en) * 1993-04-05 1997-07-22 Olin Corporation Graphite composites for electronic packaging
US5288054A (en) * 1993-06-28 1994-02-22 M&Fc Holding Company, Inc. Globe valve and method for making same
KR100261634B1 (ko) * 1995-01-11 2000-07-15 모리시타 요이찌 그래파이트클래드구조체
US5745344A (en) * 1995-11-06 1998-04-28 International Business Machines Corporation Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
JP3885246B2 (ja) * 1996-01-12 2007-02-21 松下電器産業株式会社 プラズマディスプレイパネル
US5834337A (en) * 1996-03-21 1998-11-10 Bryte Technologies, Inc. Integrated circuit heat transfer element and method
US6075287A (en) * 1997-04-03 2000-06-13 International Business Machines Corporation Integrated, multi-chip, thermally conductive packaging device and methodology
US5902762A (en) 1997-04-04 1999-05-11 Ucar Carbon Technology Corporation Flexible graphite composite
JPH1158591A (ja) * 1997-08-22 1999-03-02 Furukawa Electric Co Ltd:The 熱伝導シート
DE69834934T2 (de) * 1997-09-19 2007-02-01 General Electric Co. Flexibele wärmeübertragungsvorrichtung und verfahren
US5934617A (en) * 1997-09-22 1999-08-10 Northcoast Technologies De-ice and anti-ice system and method for aircraft surfaces
US6228914B1 (en) 1998-01-02 2001-05-08 Graftech Inc. Intumescent composition and method
US6060166A (en) * 1998-02-05 2000-05-09 Raytheon Company Flexible graphite fiber thermal shunt
DE19828789A1 (de) * 1998-06-27 1999-12-30 Sgl Technik Gmbh Packungsgarn aus Graphit- und Plastikfolie
US6245400B1 (en) * 1998-10-07 2001-06-12 Ucar Graph-Tech Inc. Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
JP2000281802A (ja) * 1999-03-30 2000-10-10 Polymatech Co Ltd 熱伝導性成形体およびその製造方法ならびに半導体装置
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
AU1348901A (en) * 1999-10-28 2001-05-08 P1 Diamond, Inc. Improved diamond thermal management components
US6262893B1 (en) * 1999-11-24 2001-07-17 Kechuan Liu Heat sink with integral component clip

Also Published As

Publication number Publication date
EP2081225A3 (de) 2009-08-05
WO2002082535A1 (en) 2002-10-17
EP1384261B1 (de) 2010-06-09
ATE470954T1 (de) 2010-06-15
US20020163076A1 (en) 2002-11-07
US7166912B2 (en) 2007-01-23
EP2081225A2 (de) 2009-07-22
EP1384261A4 (de) 2007-04-04
EP1384261A1 (de) 2004-01-28

Similar Documents

Publication Publication Date Title
DE60236645D1 (de) Isolierte thermische schnittstelle
ATE304279T1 (de) Keramischer heizer.
CY1119044T1 (el) Διαταξη κεντραρισματος
ATE222956T1 (de) Hitzebeständige xylanasen
SE7702764L (sv) Vermeisolerande ledningsfoder samt sett att framstella detta
AU9651701A (en) Emulsion and coated product thereof
KR970700728A (ko) 금속 표면을 플루오로수지로 코팅하기 위한 프라이머 조성물 및 그 조성물의 용도(Primer Composition and Use of the Same Composition for Coating Metal Surfaces with a Fluororesin)
EP1116753A3 (de) Mit Siliziumverbindungen behandelte Pulver, Verfahren zu seiner Herstellung und diese enthaltende Zusammensetzung
AU2003224129A1 (en) Substrates having a biofilm-inhibiting coating
IT1293736B1 (it) Apparecchiatura per l'applicazione di rivestimenti protettivi con tecnica a plasma
ES2056645T3 (es) Composicion de revestimiento.
DE69728996D1 (de) Wässrige dispersion und wasserbeständiges material
DK2275598T3 (da) Overfladebelægninger
NO995963D0 (no) Karboksamider anvendelige som 5-HTIF-agonister
ATE259472T1 (de) Kreiselpumpe mit einer korrosionsschutzhülse
ATE312307T1 (de) Verschleissfeste schaltgabel
FR2826541B1 (fr) Perfectionnements a la structure d'un four a resistance graphite
DE60024837D1 (de) Wärmeübertragungsvorrichtung
ATE185581T1 (de) Beschichtungszusammensetzung
CA2330453A1 (en) Safety-enhanced heat tracing
DE60239603D1 (de) Metallpulver für das thermische beschichten von substraten
NO20052973L (no) An assembly for protecting a fexible tube against wear by friction.
BR0208452A (pt) RobÈ industrial que tem um canhão giratório
DE59909912D1 (de) Joystick mit mikrofon
AU2003247114A1 (en) Utensil and use of a sol gel coating on such a utensil