DE60232250D1 - Bogenförmige federelemente für mikro-elektromechanischen beschleunigungssensor - Google Patents
Bogenförmige federelemente für mikro-elektromechanischen beschleunigungssensorInfo
- Publication number
- DE60232250D1 DE60232250D1 DE60232250T DE60232250T DE60232250D1 DE 60232250 D1 DE60232250 D1 DE 60232250D1 DE 60232250 T DE60232250 T DE 60232250T DE 60232250 T DE60232250 T DE 60232250T DE 60232250 D1 DE60232250 D1 DE 60232250D1
- Authority
- DE
- Germany
- Prior art keywords
- arch
- acceleration sensor
- spring elements
- shaped spring
- microelectromechanical acceleration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0181—See-saws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/058—Rotation out of a plane parallel to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0133—Wet etching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31377701P | 2001-08-20 | 2001-08-20 | |
PCT/US2002/026440 WO2003016919A1 (en) | 2001-08-20 | 2002-08-20 | Micro-machined electromechanical system (mems) accelerometer device having arcuately shaped flexures |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60232250D1 true DE60232250D1 (de) | 2009-06-18 |
Family
ID=23217101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60232250T Expired - Lifetime DE60232250D1 (de) | 2001-08-20 | 2002-08-20 | Bogenförmige federelemente für mikro-elektromechanischen beschleunigungssensor |
Country Status (4)
Country | Link |
---|---|
US (2) | US6897538B2 (de) |
EP (1) | EP1419396B1 (de) |
DE (1) | DE60232250D1 (de) |
WO (1) | WO2003016919A1 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6912902B2 (en) * | 2003-03-26 | 2005-07-05 | Honeywell International Inc. | Bending beam accelerometer with differential capacitive pickoff |
KR100741875B1 (ko) * | 2004-09-06 | 2007-07-23 | 동부일렉트로닉스 주식회사 | Cmos 이미지 센서 및 그의 제조 방법 |
US7623142B2 (en) * | 2004-09-14 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Flexure |
FI119785B (fi) * | 2004-09-23 | 2009-03-13 | Vti Technologies Oy | Kapasitiivinen anturi ja menetelmä kapasitiivisen anturin valmistamiseksi |
US7258010B2 (en) * | 2005-03-09 | 2007-08-21 | Honeywell International Inc. | MEMS device with thinned comb fingers |
US7210352B2 (en) * | 2005-06-14 | 2007-05-01 | Innovative Micro Technology | MEMS teeter-totter apparatus with curved beam and method of manufacture |
US7426860B2 (en) * | 2005-08-08 | 2008-09-23 | Litton Systems Inc. | Ring resonator gyro with folded cylinder suspension |
US7623414B2 (en) * | 2006-02-22 | 2009-11-24 | Westerngeco L.L.C. | Particle motion vector measurement in a towed, marine seismic cable |
US7257512B1 (en) | 2006-04-07 | 2007-08-14 | Honeywell International Inc. | Methods and systems for vibropendulous error compensation of acceleration sensors |
US7466625B2 (en) * | 2006-06-23 | 2008-12-16 | Westerngeco L.L.C. | Noise estimation in a vector sensing streamer |
US8593907B2 (en) * | 2007-03-08 | 2013-11-26 | Westerngeco L.L.C. | Technique and system to cancel noise from measurements obtained from a multi-component streamer |
US8077543B2 (en) * | 2007-04-17 | 2011-12-13 | Dirk-Jan Van Manen | Mitigation of noise in marine multicomponent seismic data through the relationship between wavefield components at the free surface |
US7676327B2 (en) | 2007-04-26 | 2010-03-09 | Westerngeco L.L.C. | Method for optimal wave field separation |
US7578190B2 (en) * | 2007-08-03 | 2009-08-25 | Freescale Semiconductor, Inc. | Symmetrical differential capacitive sensor and method of making same |
DE102007057044B4 (de) | 2007-09-10 | 2021-08-05 | Continental Teves Ag & Co. Ohg | Mikromechanische Feder |
DE102007061096A1 (de) * | 2007-12-19 | 2009-06-25 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit auslenkfähigem Element |
US8187902B2 (en) * | 2008-07-09 | 2012-05-29 | The Charles Stark Draper Laboratory, Inc. | High performance sensors and methods for forming the same |
US9229128B2 (en) * | 2008-08-17 | 2016-01-05 | Westerngeco L.L.C. | Estimating and correcting perturbations on seismic particle motion sensors employing seismic source signals |
US8207586B2 (en) * | 2008-09-22 | 2012-06-26 | Alps Electric Co., Ltd. | Substrate bonded MEMS sensor |
US8499629B2 (en) | 2008-10-10 | 2013-08-06 | Honeywell International Inc. | Mounting system for torsional suspension of a MEMS device |
DE102008043788A1 (de) * | 2008-11-17 | 2010-05-20 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
US8187903B2 (en) * | 2009-01-13 | 2012-05-29 | Robert Bosch Gmbh | Method of epitaxially growing piezoresistors |
JP5223003B2 (ja) * | 2009-06-03 | 2013-06-26 | アルプス電気株式会社 | 物理量センサ |
ITTO20090597A1 (it) * | 2009-07-31 | 2011-02-01 | St Microelectronics Srl | Struttura di rilevamento microelettromeccanica ad asse z con ridotte derive termiche |
US8528405B2 (en) * | 2009-12-04 | 2013-09-10 | The Charles Stark Draper Laboratory, Inc. | Flexure assemblies and methods for manufacturing and using the same |
JP5527015B2 (ja) * | 2010-05-26 | 2014-06-18 | セイコーエプソン株式会社 | 素子構造体、慣性センサー、電子機器 |
US8604663B2 (en) * | 2010-11-15 | 2013-12-10 | DigitalOptics Corporation MEMS | Motion controlled actuator |
US9069005B2 (en) * | 2011-06-17 | 2015-06-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Capacitance detector for accelerometer and gyroscope and accelerometer and gyroscope with capacitance detector |
US10273147B2 (en) | 2013-07-08 | 2019-04-30 | Motion Engine Inc. | MEMS components and method of wafer-level manufacturing thereof |
JP6339669B2 (ja) | 2013-07-08 | 2018-06-06 | モーション・エンジン・インコーポレーテッド | Memsデバイスおよび製造する方法 |
EP3028007A4 (de) | 2013-08-02 | 2017-07-12 | Motion Engine Inc. | Mems-bewegungssensor und verfahren zur herstellung |
JP6590812B2 (ja) | 2014-01-09 | 2019-10-16 | モーション・エンジン・インコーポレーテッド | 集積memsシステム |
WO2015154173A1 (en) | 2014-04-10 | 2015-10-15 | Motion Engine Inc. | Mems pressure sensor |
US11674803B2 (en) | 2014-06-02 | 2023-06-13 | Motion Engine, Inc. | Multi-mass MEMS motion sensor |
WO2016090467A1 (en) | 2014-12-09 | 2016-06-16 | Motion Engine Inc. | 3d mems magnetometer and associated methods |
CA3220839A1 (en) | 2015-01-15 | 2016-07-21 | Motion Engine Inc. | 3d mems device with hermetic cavity |
US11458233B2 (en) | 2016-06-13 | 2022-10-04 | Henry Ford Health System | Method for detecting intravascular volume depletion during a hemodialysis session |
US10442680B2 (en) * | 2016-06-14 | 2019-10-15 | Mems Drive, Inc. | Electric connection flexures |
US10816568B2 (en) | 2017-12-26 | 2020-10-27 | Physical Logic Ltd. | Closed loop accelerometer |
US10859596B2 (en) | 2018-07-20 | 2020-12-08 | Honeywell International Inc. | Mechanically-isolated in-plane pendulous vibrating beam accelerometer |
US10816569B2 (en) | 2018-09-07 | 2020-10-27 | Analog Devices, Inc. | Z axis accelerometer using variable vertical gaps |
US11255873B2 (en) | 2018-09-12 | 2022-02-22 | Analog Devices, Inc. | Increased sensitivity z-axis accelerometer |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4099409A (en) * | 1977-07-05 | 1978-07-11 | The Bendix Corporation | Multi-axis load cell with arcuate flexures |
US4435737A (en) * | 1981-12-16 | 1984-03-06 | Rockwell International Corporation | Low cost capacitive accelerometer |
US4922756A (en) * | 1988-06-20 | 1990-05-08 | Triton Technologies, Inc. | Micro-machined accelerometer |
GB2192718B (en) | 1986-07-15 | 1990-06-13 | Stc Plc | Accelerometer or seismometer |
US5245504A (en) * | 1989-02-28 | 1993-09-14 | United Technologies Corporation | Methodology for manufacturing hinged diaphragms for semiconductor sensors |
US5241861A (en) * | 1991-02-08 | 1993-09-07 | Sundstrand Corporation | Micromachined rate and acceleration sensor |
US5650568A (en) * | 1993-02-10 | 1997-07-22 | The Charles Stark Draper Laboratory, Inc. | Gimballed vibrating wheel gyroscope having strain relief features |
US5484073A (en) * | 1994-03-28 | 1996-01-16 | I/O Sensors, Inc. | Method for fabricating suspension members for micromachined sensors |
US6248713B1 (en) * | 1995-07-11 | 2001-06-19 | Biogen, Inc. | Cell adhesion inhibitors |
US5948981A (en) * | 1996-05-21 | 1999-09-07 | Alliedsignal Inc. | Vibrating beam accelerometer |
JPH10104263A (ja) * | 1996-10-01 | 1998-04-24 | Nissan Motor Co Ltd | 半導体加速度センサおよびその製造方法 |
GB9904140D0 (en) | 1999-02-23 | 1999-04-14 | Inertia Switch Ltd | Acceleration sensitive devices |
US6257060B1 (en) * | 1999-06-22 | 2001-07-10 | Alliedsignal Inc. | Combined enhanced shock load capability and stress isolation structure for an improved performance silicon micro-machined accelerometer |
US6428713B1 (en) | 1999-10-01 | 2002-08-06 | Delphi Technologies, Inc. | MEMS sensor structure and microfabrication process therefor |
EP1322545A2 (de) | 2000-10-03 | 2003-07-02 | Honeywell International Inc. | Verfahren zum abgleichen von mikroverarbeiteten elektromechanischen (mems) sensorsbauelementen |
US6612067B2 (en) * | 2001-05-16 | 2003-09-02 | Topp Construction Services, Inc. | Apparatus for and method of eradicating pests |
-
2002
- 2002-08-20 EP EP02753497A patent/EP1419396B1/de not_active Expired - Fee Related
- 2002-08-20 WO PCT/US2002/026440 patent/WO2003016919A1/en active Application Filing
- 2002-08-20 US US10/223,947 patent/US6897538B2/en not_active Expired - Fee Related
- 2002-08-20 DE DE60232250T patent/DE60232250D1/de not_active Expired - Lifetime
-
2004
- 2004-11-30 US US11/000,652 patent/US6991957B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6991957B2 (en) | 2006-01-31 |
US6897538B2 (en) | 2005-05-24 |
EP1419396A1 (de) | 2004-05-19 |
EP1419396B1 (de) | 2009-05-06 |
US20030036214A1 (en) | 2003-02-20 |
WO2003016919A1 (en) | 2003-02-27 |
US20050202585A1 (en) | 2005-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |