DE60231566D1 - Beidseitiges schleifverfahren und beidseitige schleifmaschine für ein dünnes plattenähnliches arbeitsstück - Google Patents

Beidseitiges schleifverfahren und beidseitige schleifmaschine für ein dünnes plattenähnliches arbeitsstück

Info

Publication number
DE60231566D1
DE60231566D1 DE60231566T DE60231566T DE60231566D1 DE 60231566 D1 DE60231566 D1 DE 60231566D1 DE 60231566 T DE60231566 T DE 60231566T DE 60231566 T DE60231566 T DE 60231566T DE 60231566 D1 DE60231566 D1 DE 60231566D1
Authority
DE
Germany
Prior art keywords
sided grinding
workpiece
thin plate
grinding machine
grinding process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60231566T
Other languages
English (en)
Inventor
Kenji Okura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Machine Systems Corp
Original Assignee
Koyo Machine Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Machine Industries Co Ltd filed Critical Koyo Machine Industries Co Ltd
Application granted granted Critical
Publication of DE60231566D1 publication Critical patent/DE60231566D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/14—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
    • B24B9/148—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms electrically, e.g. numerically, controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE60231566T 2002-10-09 2002-10-09 Beidseitiges schleifverfahren und beidseitige schleifmaschine für ein dünnes plattenähnliches arbeitsstück Expired - Lifetime DE60231566D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/010493 WO2004033148A1 (ja) 2002-10-09 2002-10-09 薄肉円板状工作物の両面研削方法および両面研削装置

Publications (1)

Publication Number Publication Date
DE60231566D1 true DE60231566D1 (de) 2009-04-23

Family

ID=32089042

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60231566T Expired - Lifetime DE60231566D1 (de) 2002-10-09 2002-10-09 Beidseitiges schleifverfahren und beidseitige schleifmaschine für ein dünnes plattenähnliches arbeitsstück

Country Status (6)

Country Link
US (1) US7150674B2 (de)
EP (1) EP1616662B1 (de)
JP (1) JP4072788B2 (de)
KR (1) KR100954534B1 (de)
DE (1) DE60231566D1 (de)
WO (1) WO2004033148A1 (de)

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JP4227326B2 (ja) * 2001-11-28 2009-02-18 Ｄｏｗａホールディングス株式会社 焼結希土類磁石合金からなるリング状薄板の製法
JP3993856B2 (ja) * 2004-01-22 2007-10-17 光洋機械工業株式会社 両頭平面研削装置
DE102004053308A1 (de) * 2004-11-04 2006-03-23 Siltronic Ag Verfahren und Vorrichtung zum gleichzeitigen Schleifen beider Seiten eines scheibenförmigen Werkstücks sowie damit herstellbare Halbleiterscheibe
JP4396518B2 (ja) * 2004-12-28 2010-01-13 トヨタ自動車株式会社 姿勢制御装置および精密加工装置
JP4752475B2 (ja) * 2005-12-08 2011-08-17 信越半導体株式会社 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法
US7930058B2 (en) * 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
US7601049B2 (en) * 2006-01-30 2009-10-13 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
US7662023B2 (en) * 2006-01-30 2010-02-16 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
JP5518338B2 (ja) * 2006-01-30 2014-06-11 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 加工対象物のナノトポロジを評価するためのウェハ両面グラインダ及び方法
JP2008012612A (ja) * 2006-07-04 2008-01-24 Sumitomo Heavy Ind Ltd 両面加工装置の加工方法
JP2008012611A (ja) * 2006-07-04 2008-01-24 Sumitomo Heavy Ind Ltd 両面加工装置
SM200600026B (it) 2006-08-03 2008-02-06 Automatismi Brazzale Srl Macchina, linea automatica e metodo per la lavorazione superificiale di elementi discoidali
DE102007049810B4 (de) * 2007-10-17 2012-03-22 Siltronic Ag Simultanes Doppelseitenschleifen von Halbleiterscheiben
JP2009246240A (ja) * 2008-03-31 2009-10-22 Tokyo Seimitsu Co Ltd 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置
JP5463570B2 (ja) * 2008-10-31 2014-04-09 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 ウェハ用両頭研削装置および両頭研削方法
DE102009024125B4 (de) * 2009-06-06 2023-07-27 Lapmaster Wolters Gmbh Verfahren zum Bearbeiten von flachen Werkstücken
US8712575B2 (en) * 2010-03-26 2014-04-29 Memc Electronic Materials, Inc. Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
JP5406126B2 (ja) * 2010-06-09 2014-02-05 株式会社岡本工作機械製作所 インゴットブロックの複合面取り加工装置および加工方法
CN102229073B (zh) * 2011-06-24 2013-03-27 潘旭华 一种转子轴的磨削方法
CN102275109B (zh) * 2011-09-02 2013-05-01 洛阳Lyc轴承有限公司 一种用于双端面磨床加工圆锥内圈的支撑方法
JP6113960B2 (ja) * 2012-02-21 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
CN103586772B (zh) * 2012-08-16 2016-01-06 鸿富锦精密工业（深圳）有限公司 压力检测装置
CN102909626B (zh) * 2012-09-18 2015-02-25 陈政伟 平磨机
JP6327007B2 (ja) * 2014-06-24 2018-05-23 株式会社Sumco 研削装置および研削方法
CN104259942A (zh) * 2014-09-18 2015-01-07 洛阳巨优机床有限公司 一种双端面磨床修整杆的离合齿调节装置
CN104889838B (zh) * 2015-04-22 2018-07-31 北京金风科创风电设备有限公司 预制混凝土塔段的切削机床及切削方法
CN105538072A (zh) * 2015-12-02 2016-05-04 无锡威孚马山油泵油嘴有限公司 出油阀座的双端面磨加工工艺
JP6508109B2 (ja) * 2016-04-13 2019-05-08 株式会社Sumco 工作機械のレベリングマウント調整方法およびそれを用いたワークの研削加工方法
CN110216531B (zh) * 2019-06-28 2024-05-24 深圳市圆梦精密技术研究院 双头超声波加工设备及应用其的双面加工方法
CN112259442B (zh) * 2020-09-11 2024-05-24 中环领先(徐州)半导体材料有限公司 晶圆双面减薄的方法和装置、存储介质
CN112816356A (zh) * 2021-01-18 2021-05-18 中铁隆昌铁路器材有限公司 一种快速打磨砂轮磨削性能试验装置
CN114670069B (zh) * 2022-04-07 2023-05-23 深圳市合发齿轮机械有限公司 一种齿轮端面磨平抛光装置
CN114918773A (zh) * 2022-06-01 2022-08-19 安徽富乐德长江半导体材料股份有限公司 用于再生晶圆边角打磨设备
CN115723035B (zh) * 2022-09-08 2024-05-28 西安奕斯伟材料科技股份有限公司 用于监控研磨装置的加工状态的***、方法及双面研磨装置
CN115256081A (zh) * 2022-10-08 2022-11-01 徐州晨晓精密机械制造有限公司 一种五金件打磨装置
CN116079521B (zh) * 2023-03-24 2023-08-18 肇庆高峰机械科技有限公司 一种双控制方式磨床

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JP3138205B2 (ja) * 1996-03-27 2001-02-26 株式会社不二越 高脆性材の両面研削装置
US5989108A (en) * 1996-09-09 1999-11-23 Koyo Machine Industries Co., Ltd. Double side grinding apparatus for flat disklike work
US5816895A (en) * 1997-01-17 1998-10-06 Tokyo Seimitsu Co., Ltd. Surface grinding method and apparatus
JPH11198009A (ja) * 1998-01-13 1999-07-27 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置および断面形状測定装置
JP3270890B2 (ja) * 1998-02-26 2002-04-02 光洋機械工業株式会社 研削盤における砥石ティルト装置
JP3969956B2 (ja) * 1999-05-07 2007-09-05 信越半導体株式会社 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤
JP2001062718A (ja) * 1999-08-20 2001-03-13 Super Silicon Kenkyusho:Kk 両頭研削装置及び砥石位置修正方法
WO2001021356A1 (fr) * 1999-09-24 2001-03-29 Shin-Etsu Handotai Co., Ltd. Procede et dispositif de meulage des deux faces d'un disque fin
WO2001082354A1 (fr) * 2000-04-24 2001-11-01 Sumitomo Mitsubishi Silicon Corporation Procédé de fabrication d'une plaquette de semi-conducteur
DE10048881A1 (de) * 2000-09-29 2002-03-07 Infineon Technologies Ag Vorrichtung und Verfahren zum planen Verbinden zweier Wafer für ein Dünnschleifen und ein Trennen eines Produkt-Wafers

Also Published As

Publication number Publication date
EP1616662B1 (de) 2009-03-11
JP4072788B2 (ja) 2008-04-09
JPWO2004033148A1 (ja) 2006-02-09
US20060009125A1 (en) 2006-01-12
EP1616662A4 (de) 2006-11-22
EP1616662A1 (de) 2006-01-18
WO2004033148A1 (ja) 2004-04-22
KR100954534B1 (ko) 2010-04-23
KR20050083738A (ko) 2005-08-26
US7150674B2 (en) 2006-12-19

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Legal Events

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