DE60222847D1 - Verfahren zur Verbesserung der Hafteigenschaften eines Keramiksubstrats - Google Patents
Verfahren zur Verbesserung der Hafteigenschaften eines KeramiksubstratsInfo
- Publication number
- DE60222847D1 DE60222847D1 DE60222847T DE60222847T DE60222847D1 DE 60222847 D1 DE60222847 D1 DE 60222847D1 DE 60222847 T DE60222847 T DE 60222847T DE 60222847 T DE60222847 T DE 60222847T DE 60222847 D1 DE60222847 D1 DE 60222847D1
- Authority
- DE
- Germany
- Prior art keywords
- improving
- ceramic substrate
- adhesive properties
- adhesive
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000000919 ceramic Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laser Beam Processing (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0112185 | 2001-09-21 | ||
FR0112185A FR2830008B1 (fr) | 2001-09-21 | 2001-09-21 | Procede pour ameliorer les proprietes d'adhesion d'un substrat ceramique de la famille des non-oxydes en vue de son collage |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60222847D1 true DE60222847D1 (de) | 2007-11-22 |
DE60222847T2 DE60222847T2 (de) | 2008-07-17 |
Family
ID=8867487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60222847T Expired - Lifetime DE60222847T2 (de) | 2001-09-21 | 2002-08-28 | Verfahren zur Verbesserung der Hafteigenschaften eines Keramiksubstrats |
Country Status (7)
Country | Link |
---|---|
US (1) | US6960278B2 (de) |
EP (1) | EP1300378B1 (de) |
JP (1) | JP4335509B2 (de) |
CA (1) | CA2404804C (de) |
DE (1) | DE60222847T2 (de) |
ES (1) | ES2295304T3 (de) |
FR (1) | FR2830008B1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6992887B2 (en) * | 2003-10-15 | 2006-01-31 | Visteon Global Technologies, Inc. | Liquid cooled semiconductor device |
US7190581B1 (en) * | 2005-01-11 | 2007-03-13 | Midwest Research Institute | Low thermal resistance power module assembly |
US7331378B2 (en) * | 2006-01-17 | 2008-02-19 | Delphi Technologies, Inc. | Microchannel heat sink |
DE102006006175A1 (de) * | 2006-02-10 | 2007-08-23 | Ecpe Engineering Center For Power Electronics Gmbh | Leistungselektronikanordnung |
US20070236883A1 (en) * | 2006-04-05 | 2007-10-11 | Javier Ruiz | Electronics assembly having heat sink substrate disposed in cooling vessel |
JP4857017B2 (ja) * | 2006-04-27 | 2012-01-18 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP4869150B2 (ja) * | 2007-05-17 | 2012-02-08 | 浜松ホトニクス株式会社 | 樹脂・ガラス溶着方法及び樹脂・ガラス溶着装置 |
US9252069B2 (en) * | 2010-08-31 | 2016-02-02 | Teledyne Scientific & Imaging, Llc | High power module cooling system |
JP5773843B2 (ja) * | 2011-10-31 | 2015-09-02 | 昭和電工パッケージング株式会社 | 空気二次電池用外装材、空気二次電池用外装材の製造方法及び空気二次電池 |
DE102015215682A1 (de) * | 2015-08-18 | 2016-09-08 | Continental Automotive Gmbh | Kühlvorrichtung, Leistungselektronikanordnung mit einer Kühlvorrichtung |
US11022383B2 (en) | 2016-06-16 | 2021-06-01 | Teledyne Scientific & Imaging, Llc | Interface-free thermal management system for high power devices co-fabricated with electronic circuit |
WO2021113138A1 (en) * | 2019-12-03 | 2021-06-10 | Panasonic intellectual property Management co., Ltd | Condensation prevention for high-power laser systems |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3422495B2 (ja) * | 1991-10-01 | 2003-06-30 | イビデン株式会社 | セラミックスdbc基板の製造方法 |
FR2692887B1 (fr) * | 1992-06-29 | 1996-11-29 | Alsthom Cge Alcatel | Procede pour realiser une liaison entre du cuivre et un substrat pour l'electronique de puissance en ceramique non oxyde. |
ES2164367T3 (es) * | 1996-07-23 | 2002-02-16 | Vantico Ag | Tratamiento superficial del metal. |
DE19723591A1 (de) * | 1997-06-05 | 1998-12-10 | Hoechst Ag | Katalysator, Verfahren zu seiner Herstellung und seine Verwendung zur Herstellung von Vinylacetat |
DE19860135C2 (de) * | 1998-12-24 | 2003-02-06 | Sunyx Surface Nanotechnologies | Ultraphobe Oberfläche auf Basis von Wolframcarbit, ein Verfahren zu ihrer Herstellung und ihre Verwendung |
-
2001
- 2001-09-21 FR FR0112185A patent/FR2830008B1/fr not_active Expired - Fee Related
-
2002
- 2002-08-28 EP EP02292108A patent/EP1300378B1/de not_active Expired - Fee Related
- 2002-08-28 ES ES02292108T patent/ES2295304T3/es not_active Expired - Lifetime
- 2002-08-28 DE DE60222847T patent/DE60222847T2/de not_active Expired - Lifetime
- 2002-09-05 US US10/234,255 patent/US6960278B2/en not_active Expired - Lifetime
- 2002-09-13 CA CA2404804A patent/CA2404804C/fr not_active Expired - Fee Related
- 2002-09-18 JP JP2002271050A patent/JP4335509B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE60222847T2 (de) | 2008-07-17 |
CA2404804C (fr) | 2012-07-10 |
CA2404804A1 (fr) | 2003-03-21 |
US6960278B2 (en) | 2005-11-01 |
FR2830008A1 (fr) | 2003-03-28 |
FR2830008B1 (fr) | 2004-06-11 |
ES2295304T3 (es) | 2008-04-16 |
EP1300378A1 (de) | 2003-04-09 |
EP1300378B1 (de) | 2007-10-10 |
JP4335509B2 (ja) | 2009-09-30 |
JP2003212676A (ja) | 2003-07-30 |
US20030056892A1 (en) | 2003-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60144382D1 (de) | Verfahren zur reinigung der oberfläche eines substrates | |
DE50208649D1 (de) | Verfahren zur bereitschaftshaltung eines kombikraftwerkes | |
ATE309292T1 (de) | Verfahren zur beschichtung einer oberfläche | |
DE602004021392D1 (de) | Weiteres verfahren zur strukturierung eines substrats | |
DE60039744D1 (de) | Verfahren zur Hersltellung einer Siliziumschicht | |
DE60110775D1 (de) | Verfahren zur Reparaturbeschichtung | |
DE60210718D1 (de) | Verfahren zur Herstellung einer Reparaturlackierung | |
DE60232117D1 (de) | Verfahren zur Dickenmessung | |
DE60212702D1 (de) | Verfahren zur Beschichtung mit Fluorkohlenwasserstoffharz | |
DE60328609D1 (de) | Beschichtungsverfahren zur erzielung besonderer oberflächeneffekte | |
DE60226766D1 (de) | Verfahren zur herstellung von phenolischen novolaken | |
DE60227207D1 (de) | Verfahren zur Filmabscheidung | |
DE60222847D1 (de) | Verfahren zur Verbesserung der Hafteigenschaften eines Keramiksubstrats | |
DE60333142D1 (de) | Verfahren zur Modifikation der Oberfläche eines Quarzglastiegels | |
DE60124833D1 (de) | Verfahren zur Herstellung eines Heissschmelzklebers | |
DE60121292D1 (de) | Verfahren zur Konditionierung der Oberfläche eines Polierkissens | |
DE50209427D1 (de) | Verfahren zur Entfernungsmessung | |
ATA19422001A (de) | Verfahren zur vermessung der oberfläche eines geschliffenen schmucksteines | |
DE60307522D1 (de) | Verfahren zur Überprüfung transparenter Substrate | |
DE60121585D1 (de) | Verfahren zur versprühung eines schmelzklebers | |
ATA8432001A (de) | Verfahren zum erzeugen einer schicht funktioneller moleküle | |
DE60239007D1 (de) | Verfahren zur herstellung eines kontinuierlichen überzugs an der oberfläche eines bauteils | |
DE60230982D1 (de) | Verfahren zur herstellung eines halbleiterbauelements | |
DE50208521D1 (de) | Verfahren zur Ausbildung eines Silizium-Halbleiterkörpers | |
DE60231282D1 (de) | Verfahren zur Herstellung eines Silikatphosphors |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |