DE60222847D1 - Verfahren zur Verbesserung der Hafteigenschaften eines Keramiksubstrats - Google Patents

Verfahren zur Verbesserung der Hafteigenschaften eines Keramiksubstrats

Info

Publication number
DE60222847D1
DE60222847D1 DE60222847T DE60222847T DE60222847D1 DE 60222847 D1 DE60222847 D1 DE 60222847D1 DE 60222847 T DE60222847 T DE 60222847T DE 60222847 T DE60222847 T DE 60222847T DE 60222847 D1 DE60222847 D1 DE 60222847D1
Authority
DE
Germany
Prior art keywords
improving
ceramic substrate
adhesive properties
adhesive
properties
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60222847T
Other languages
English (en)
Other versions
DE60222847T2 (de
Inventor
Alain Petitbon
Jerome Evieux
Yves Baziard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom SA
Original Assignee
Alstom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alstom SA filed Critical Alstom SA
Application granted granted Critical
Publication of DE60222847D1 publication Critical patent/DE60222847D1/de
Publication of DE60222847T2 publication Critical patent/DE60222847T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Products (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laser Beam Processing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Die Bonding (AREA)
DE60222847T 2001-09-21 2002-08-28 Verfahren zur Verbesserung der Hafteigenschaften eines Keramiksubstrats Expired - Lifetime DE60222847T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0112185 2001-09-21
FR0112185A FR2830008B1 (fr) 2001-09-21 2001-09-21 Procede pour ameliorer les proprietes d'adhesion d'un substrat ceramique de la famille des non-oxydes en vue de son collage

Publications (2)

Publication Number Publication Date
DE60222847D1 true DE60222847D1 (de) 2007-11-22
DE60222847T2 DE60222847T2 (de) 2008-07-17

Family

ID=8867487

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60222847T Expired - Lifetime DE60222847T2 (de) 2001-09-21 2002-08-28 Verfahren zur Verbesserung der Hafteigenschaften eines Keramiksubstrats

Country Status (7)

Country Link
US (1) US6960278B2 (de)
EP (1) EP1300378B1 (de)
JP (1) JP4335509B2 (de)
CA (1) CA2404804C (de)
DE (1) DE60222847T2 (de)
ES (1) ES2295304T3 (de)
FR (1) FR2830008B1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6992887B2 (en) * 2003-10-15 2006-01-31 Visteon Global Technologies, Inc. Liquid cooled semiconductor device
US7190581B1 (en) * 2005-01-11 2007-03-13 Midwest Research Institute Low thermal resistance power module assembly
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
DE102006006175A1 (de) * 2006-02-10 2007-08-23 Ecpe Engineering Center For Power Electronics Gmbh Leistungselektronikanordnung
US20070236883A1 (en) * 2006-04-05 2007-10-11 Javier Ruiz Electronics assembly having heat sink substrate disposed in cooling vessel
JP4857017B2 (ja) * 2006-04-27 2012-01-18 日立オートモティブシステムズ株式会社 電力変換装置
JP4869150B2 (ja) * 2007-05-17 2012-02-08 浜松ホトニクス株式会社 樹脂・ガラス溶着方法及び樹脂・ガラス溶着装置
US9252069B2 (en) * 2010-08-31 2016-02-02 Teledyne Scientific & Imaging, Llc High power module cooling system
JP5773843B2 (ja) * 2011-10-31 2015-09-02 昭和電工パッケージング株式会社 空気二次電池用外装材、空気二次電池用外装材の製造方法及び空気二次電池
DE102015215682A1 (de) * 2015-08-18 2016-09-08 Continental Automotive Gmbh Kühlvorrichtung, Leistungselektronikanordnung mit einer Kühlvorrichtung
US11022383B2 (en) 2016-06-16 2021-06-01 Teledyne Scientific & Imaging, Llc Interface-free thermal management system for high power devices co-fabricated with electronic circuit
WO2021113138A1 (en) * 2019-12-03 2021-06-10 Panasonic intellectual property Management co., Ltd Condensation prevention for high-power laser systems

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3422495B2 (ja) * 1991-10-01 2003-06-30 イビデン株式会社 セラミックスｄｂｃ基板の製造方法
FR2692887B1 (fr) * 1992-06-29 1996-11-29 Alsthom Cge Alcatel Procede pour realiser une liaison entre du cuivre et un substrat pour l'electronique de puissance en ceramique non oxyde.
ES2164367T3 (es) * 1996-07-23 2002-02-16 Vantico Ag Tratamiento superficial del metal.
DE19723591A1 (de) * 1997-06-05 1998-12-10 Hoechst Ag Katalysator, Verfahren zu seiner Herstellung und seine Verwendung zur Herstellung von Vinylacetat
DE19860135C2 (de) * 1998-12-24 2003-02-06 Sunyx Surface Nanotechnologies Ultraphobe Oberfläche auf Basis von Wolframcarbit, ein Verfahren zu ihrer Herstellung und ihre Verwendung

Also Published As

Publication number Publication date
DE60222847T2 (de) 2008-07-17
CA2404804C (fr) 2012-07-10
CA2404804A1 (fr) 2003-03-21
US6960278B2 (en) 2005-11-01
FR2830008A1 (fr) 2003-03-28
FR2830008B1 (fr) 2004-06-11
ES2295304T3 (es) 2008-04-16
EP1300378A1 (de) 2003-04-09
EP1300378B1 (de) 2007-10-10
JP4335509B2 (ja) 2009-09-30
JP2003212676A (ja) 2003-07-30
US20030056892A1 (en) 2003-03-27

Similar Documents

Publication Publication Date Title
DE60144382D1 (de) Verfahren zur reinigung der oberfläche eines substrates
DE50208649D1 (de) Verfahren zur bereitschaftshaltung eines kombikraftwerkes
ATE309292T1 (de) Verfahren zur beschichtung einer oberfläche
DE602004021392D1 (de) Weiteres verfahren zur strukturierung eines substrats
DE60039744D1 (de) Verfahren zur Hersltellung einer Siliziumschicht
DE60110775D1 (de) Verfahren zur Reparaturbeschichtung
DE60210718D1 (de) Verfahren zur Herstellung einer Reparaturlackierung
DE60232117D1 (de) Verfahren zur Dickenmessung
DE60212702D1 (de) Verfahren zur Beschichtung mit Fluorkohlenwasserstoffharz
DE60328609D1 (de) Beschichtungsverfahren zur erzielung besonderer oberflächeneffekte
DE60226766D1 (de) Verfahren zur herstellung von phenolischen novolaken
DE60227207D1 (de) Verfahren zur Filmabscheidung
DE60222847D1 (de) Verfahren zur Verbesserung der Hafteigenschaften eines Keramiksubstrats
DE60333142D1 (de) Verfahren zur Modifikation der Oberfläche eines Quarzglastiegels
DE60124833D1 (de) Verfahren zur Herstellung eines Heissschmelzklebers
DE60121292D1 (de) Verfahren zur Konditionierung der Oberfläche eines Polierkissens
DE50209427D1 (de) Verfahren zur Entfernungsmessung
ATA19422001A (de) Verfahren zur vermessung der oberfläche eines geschliffenen schmucksteines
DE60307522D1 (de) Verfahren zur Überprüfung transparenter Substrate
DE60121585D1 (de) Verfahren zur versprühung eines schmelzklebers
ATA8432001A (de) Verfahren zum erzeugen einer schicht funktioneller moleküle
DE60239007D1 (de) Verfahren zur herstellung eines kontinuierlichen überzugs an der oberfläche eines bauteils
DE60230982D1 (de) Verfahren zur herstellung eines halbleiterbauelements
DE50208521D1 (de) Verfahren zur Ausbildung eines Silizium-Halbleiterkörpers
DE60231282D1 (de) Verfahren zur Herstellung eines Silikatphosphors

Legal Events

Date Code Title Description
8364 No opposition during term of opposition