DE602008002650D1 - Prüfvorrichtung und Prüfverfahren - Google Patents

Prüfvorrichtung und Prüfverfahren

Info

Publication number
DE602008002650D1
DE602008002650D1 DE602008002650T DE602008002650T DE602008002650D1 DE 602008002650 D1 DE602008002650 D1 DE 602008002650D1 DE 602008002650 T DE602008002650 T DE 602008002650T DE 602008002650 T DE602008002650 T DE 602008002650T DE 602008002650 D1 DE602008002650 D1 DE 602008002650D1
Authority
DE
Germany
Prior art keywords
test
test method
test device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008002650T
Other languages
English (en)
Inventor
Shigekazu Komatsu
Dai Shinozaki
Katsuaki Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE602008002650D1 publication Critical patent/DE602008002650D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
    • G01R31/31926—Routing signals to or from the device under test [DUT], e.g. switch matrix, pin multiplexing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06766—Input circuits therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
DE602008002650T 2007-07-20 2008-07-10 Prüfvorrichtung und Prüfverfahren Active DE602008002650D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007189500A JP4664334B2 (ja) 2007-07-20 2007-07-20 検査方法

Publications (1)

Publication Number Publication Date
DE602008002650D1 true DE602008002650D1 (de) 2010-11-04

Family

ID=39789864

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008002650T Active DE602008002650D1 (de) 2007-07-20 2008-07-10 Prüfvorrichtung und Prüfverfahren

Country Status (7)

Country Link
US (1) US7586317B2 (de)
EP (1) EP2017634B1 (de)
JP (1) JP4664334B2 (de)
KR (1) KR101019241B1 (de)
CN (1) CN101349736B (de)
DE (1) DE602008002650D1 (de)
TW (1) TWI369499B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG153689A1 (en) * 2007-12-17 2009-07-29 Test Max Mfg Pte Ltd Contactor assembly for integrated circuit testing
JP5312227B2 (ja) 2009-06-29 2013-10-09 株式会社日本マイクロニクス プローブカード及び検査装置
DE102009050279B4 (de) * 2009-10-21 2017-12-14 Metrawatt International Gmbh Vorrichtung und Verfahren zur Überprüfung des Widerstandes elektrischer Erdungsverbindungen
JP6155725B2 (ja) * 2013-03-19 2017-07-05 富士電機株式会社 半導体装置の検査方法及びその方法を用いた半導体装置の製造方法
JP2015001470A (ja) * 2013-06-17 2015-01-05 日本電産リード株式会社 基板検査装置
CN103439582A (zh) * 2013-08-28 2013-12-11 三星高新电机（天津）有限公司 检测块的测试装置
JP6267928B2 (ja) 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
JP6646685B2 (ja) * 2015-12-21 2020-02-14 東芝三菱電機産業システム株式会社 電気トリー試験方法、および電極設定用部材セット

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0620005B2 (ja) * 1989-12-07 1994-03-16 ローム株式会社 抵抗体のトリミング装置
JP2788132B2 (ja) * 1991-02-23 1998-08-20 ローム株式会社 サーマルプリントヘッドにおけるパルストリミング装置
JPH0673325B2 (ja) * 1992-01-28 1994-09-14 ローム株式会社 抵抗体のトリミング装置
JP3642456B2 (ja) 1998-02-24 2005-04-27 株式会社村田製作所 電子部品の検査方法および装置
JP4841737B2 (ja) * 2000-08-21 2011-12-21 東京エレクトロン株式会社 検査方法及び検査装置
JP4456325B2 (ja) * 2002-12-12 2010-04-28 東京エレクトロン株式会社 検査方法及び検査装置
JP4387125B2 (ja) * 2003-06-09 2009-12-16 東京エレクトロン株式会社 検査方法及び検査装置
CN2854830Y (zh) * 2005-12-13 2007-01-03 罗贯诚 单排式的充电器探针模块
JP2008157818A (ja) 2006-12-25 2008-07-10 Tokyo Electron Ltd 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体

Also Published As

Publication number Publication date
KR101019241B1 (ko) 2011-03-04
CN101349736B (zh) 2011-10-26
EP2017634A1 (de) 2009-01-21
EP2017634B1 (de) 2010-09-22
US20090021272A1 (en) 2009-01-22
TWI369499B (en) 2012-08-01
KR20090009707A (ko) 2009-01-23
US7586317B2 (en) 2009-09-08
JP4664334B2 (ja) 2011-04-06
JP2009025187A (ja) 2009-02-05
CN101349736A (zh) 2009-01-21
TW200921110A (en) 2009-05-16

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