DE602008000591D1 - Prepreg und Laminat - Google Patents
Prepreg und LaminatInfo
- Publication number
- DE602008000591D1 DE602008000591D1 DE602008000591T DE602008000591T DE602008000591D1 DE 602008000591 D1 DE602008000591 D1 DE 602008000591D1 DE 602008000591 T DE602008000591 T DE 602008000591T DE 602008000591 T DE602008000591 T DE 602008000591T DE 602008000591 D1 DE602008000591 D1 DE 602008000591D1
- Authority
- DE
- Germany
- Prior art keywords
- prepreg
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007028117 | 2007-02-07 | ||
JP2007186929A JP5263705B2 (ja) | 2007-02-07 | 2007-07-18 | プリプレグ及び積層板 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602008000591D1 true DE602008000591D1 (de) | 2010-03-18 |
Family
ID=39835029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602008000591T Active DE602008000591D1 (de) | 2007-02-07 | 2008-02-05 | Prepreg und Laminat |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5263705B2 (de) |
KR (1) | KR101494834B1 (de) |
CN (1) | CN101240111B (de) |
DE (1) | DE602008000591D1 (de) |
TW (1) | TWI408052B (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5024205B2 (ja) * | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
JP5233710B2 (ja) * | 2008-02-12 | 2013-07-10 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグおよび金属箔張り積層板 |
JP5381016B2 (ja) * | 2008-10-30 | 2014-01-08 | 日立化成株式会社 | 熱硬化性樹脂組成物、及びこれを用いたプリプレグ,積層板 |
EP2402388B1 (de) | 2009-02-25 | 2017-01-04 | Mitsubishi Gas Chemical Company, Inc. | Prepreg und laminierte folie |
JP5223781B2 (ja) * | 2009-06-01 | 2013-06-26 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ及び積層板 |
JP5526820B2 (ja) * | 2010-01-29 | 2014-06-18 | 日立化成株式会社 | 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ及び積層板 |
CN105315435A (zh) * | 2010-03-02 | 2016-02-10 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料及层压板 |
GB201005444D0 (en) * | 2010-03-31 | 2010-05-19 | 3M Innovative Properties Co | Epoxy adhesive compositions comprising an adhesion promoter |
SG10201502708PA (en) | 2010-04-08 | 2015-05-28 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, and laminated sheet |
JP5849948B2 (ja) | 2010-06-02 | 2016-02-03 | 三菱瓦斯化学株式会社 | 樹脂組成物およびこれを用いたプリプレグ及び積層板 |
CN101967264A (zh) * | 2010-08-31 | 2011-02-09 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的高频电路基板 |
CN102558472A (zh) * | 2010-12-24 | 2012-07-11 | 广东生益科技股份有限公司 | 萘酚酚醛型氰酸酯树脂及其合成方法 |
JP5958827B2 (ja) * | 2011-01-20 | 2016-08-02 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、および積層板 |
SG191950A1 (en) * | 2011-03-07 | 2013-08-30 | Mitsubishi Gas Chemical Co | Resin composition, and prepreg as well as laminate using the same |
JP5397717B2 (ja) | 2011-09-26 | 2014-01-22 | 三菱瓦斯化学株式会社 | モリブデン化合物粉体、プリプレグ及び積層板 |
KR101945076B1 (ko) * | 2011-11-07 | 2019-02-01 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 이것을 사용한 프리프레그 및 적층판 |
US9944787B2 (en) * | 2012-03-30 | 2018-04-17 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg and laminate |
JP2014005338A (ja) * | 2012-06-22 | 2014-01-16 | Dic Corp | 硬化性組成物、硬化物、及びプリント配線基板 |
WO2014059654A1 (zh) * | 2012-10-19 | 2014-04-24 | 广东生益科技股份有限公司 | 氰酸酯树脂组合物及使用其制作的预浸料、层压材料与覆金属箔层压材料 |
SG11201502925UA (en) * | 2012-10-19 | 2015-06-29 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, laminate and printed-wiring board |
JP2013237844A (ja) * | 2013-06-12 | 2013-11-28 | Hitachi Chemical Co Ltd | 熱硬化性樹脂組成物、及びこれを用いたプリプレグ、積層板 |
CN103497488B (zh) * | 2013-10-11 | 2016-05-25 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其用途 |
CN105237949B (zh) * | 2014-06-12 | 2017-11-03 | 广东生益科技股份有限公司 | 一种热固性环氧树脂组合物及其用途 |
CN104320911A (zh) * | 2014-08-27 | 2015-01-28 | 无锡长辉机电科技有限公司 | 一种电路板吸湿性爆板的解决方法 |
JP6264250B2 (ja) * | 2014-09-30 | 2018-01-24 | 信越化学工業株式会社 | 合成樹脂組成物に配合するシリコーンゴム粒子の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0245349B2 (ja) * | 1983-09-13 | 1990-10-09 | Sumitomo Bakelite Co | Insatsukairoyosekisoban |
JPH064310B2 (ja) * | 1986-01-27 | 1994-01-19 | 松下電工株式会社 | 電気用積層板 |
JPH11124433A (ja) * | 1997-10-22 | 1999-05-11 | Mitsubishi Gas Chem Co Inc | フェノールノボラック型シアン酸エステルプレポリマー |
KR100617287B1 (ko) * | 2001-07-17 | 2006-08-30 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반도체 캡슐화용 에폭시 수지 조성물 및 반도체 장치 |
KR100470178B1 (ko) * | 2003-06-03 | 2005-02-04 | 주식회사 엘지화학 | 동박 적층판용 수지 조성물 |
JP2006131743A (ja) * | 2004-11-05 | 2006-05-25 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、プリント配線板 |
JP4843944B2 (ja) * | 2005-01-13 | 2011-12-21 | 三菱瓦斯化学株式会社 | 樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
JP2006348187A (ja) * | 2005-06-16 | 2006-12-28 | Mitsubishi Gas Chem Co Inc | 樹脂組成物並びにそれを用いたプリプレグおよび銅張積層板 |
-
2007
- 2007-07-18 JP JP2007186929A patent/JP5263705B2/ja active Active
-
2008
- 2008-02-04 TW TW097104159A patent/TWI408052B/zh active
- 2008-02-04 KR KR20080011400A patent/KR101494834B1/ko active IP Right Grant
- 2008-02-05 CN CN2008100086948A patent/CN101240111B/zh active Active
- 2008-02-05 DE DE602008000591T patent/DE602008000591D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
CN101240111B (zh) | 2011-12-28 |
TWI408052B (zh) | 2013-09-11 |
TW200848257A (en) | 2008-12-16 |
JP2008214602A (ja) | 2008-09-18 |
KR20080074037A (ko) | 2008-08-12 |
KR101494834B1 (ko) | 2015-02-23 |
CN101240111A (zh) | 2008-08-13 |
JP5263705B2 (ja) | 2013-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |