DE602004016382D1 - Dreieckige konforme üebrtragungsstruktur - Google Patents

Dreieckige konforme üebrtragungsstruktur

Info

Publication number
DE602004016382D1
DE602004016382D1 DE602004016382T DE602004016382T DE602004016382D1 DE 602004016382 D1 DE602004016382 D1 DE 602004016382D1 DE 602004016382 T DE602004016382 T DE 602004016382T DE 602004016382 T DE602004016382 T DE 602004016382T DE 602004016382 D1 DE602004016382 D1 DE 602004016382D1
Authority
DE
Germany
Prior art keywords
conformity
triangular
transmission structure
transmission
triangular conformity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004016382T
Other languages
English (en)
Inventor
David L Brunker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Publication of DE602004016382D1 publication Critical patent/DE602004016382D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
DE602004016382T 2003-12-24 2004-12-23 Dreieckige konforme üebrtragungsstruktur Expired - Fee Related DE602004016382D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53271903P 2003-12-24 2003-12-24
PCT/US2004/043977 WO2005067092A1 (en) 2003-12-24 2004-12-23 Triangular conforming transmission structure

Publications (1)

Publication Number Publication Date
DE602004016382D1 true DE602004016382D1 (de) 2008-10-16

Family

ID=34748820

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004016382T Expired - Fee Related DE602004016382D1 (de) 2003-12-24 2004-12-23 Dreieckige konforme üebrtragungsstruktur

Country Status (7)

Country Link
US (1) US20050151604A1 (de)
EP (1) EP1698016B1 (de)
JP (1) JP2007518311A (de)
KR (1) KR100744209B1 (de)
CN (1) CN100568614C (de)
DE (1) DE602004016382D1 (de)
WO (1) WO2005067092A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100751600B1 (ko) 2003-12-24 2007-08-22 몰렉스 인코포레이티드 변형 임피던스를 구비한 전송 라인
EP1698217A1 (de) * 2003-12-24 2006-09-06 Molex Incorporated Elektromagnetisch abgeschirmte schlitzübertragungsleitung
US7116190B2 (en) * 2003-12-24 2006-10-03 Molex Incorporated Slot transmission line patch connector
US20070188261A1 (en) * 2003-12-24 2007-08-16 Brunker David L Transmission line with a transforming impedance and solder lands
EP1698216A1 (de) 2003-12-24 2006-09-06 Molex Incorporated Übertragungsleitung mit einer transformierenden impedanz und lotflecken
EP1721496A2 (de) 2004-02-13 2006-11-15 Molex Incorporated Bevorzugte masse- und kontaktlochaustrittsstrukturen für leiterplatten
US20050201065A1 (en) * 2004-02-13 2005-09-15 Regnier Kent E. Preferential ground and via exit structures for printed circuit boards
EP1808010A2 (de) * 2004-10-25 2007-07-18 Intrado, Inc. System und verfahren zur einseitigen überfrüfung von informationen zum anruferstantort
CN101095381B (zh) 2004-10-29 2010-06-16 莫莱克斯公司 用于高速电连接器的印刷电路板
US20060139117A1 (en) * 2004-12-23 2006-06-29 Brunker David L Multi-channel waveguide structure
US7422483B2 (en) * 2005-02-22 2008-09-09 Molex Incorproated Differential signal connector with wafer-style construction
JP2010003892A (ja) * 2008-06-20 2010-01-07 Nitto Denko Corp 配線回路基板およびその製造方法
US8498539B1 (en) * 2009-04-21 2013-07-30 Oewaves, Inc. Dielectric photonic receivers and concentrators for radio frequency and microwave applications
CN108878020B (zh) * 2018-05-31 2019-11-26 维沃移动通信有限公司 一种信号传输线和终端设备
US20210391100A1 (en) * 2020-06-15 2021-12-16 Rosemount Inc. Self-Assembling Antenna Networks and Antenna Feed Circuits for Same

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293353A (en) * 1964-03-30 1966-12-20 Gen Electric Shielded interconnecting wiring medium
US3499215A (en) * 1964-09-03 1970-03-10 Gen Electric Capacitive fixed memory system
DE1291807B (de) * 1965-09-30 1969-04-03 Siemens Ag Mikrowellenbauteil mit wenigstens einem Doppelleitungsabschnitt
JPS61220499A (ja) * 1985-03-27 1986-09-30 株式会社日立製作所 混成多層配線基板
JPH01106602A (ja) * 1987-10-20 1989-04-24 Fujitsu Ltd マイクロストリップ線路とその製造方法
JP2700553B2 (ja) * 1988-03-31 1998-01-21 株式会社 潤工社 伝送回路
US5157477A (en) * 1990-01-10 1992-10-20 International Business Machines Corporation Matched impedance vertical conductors in multilevel dielectric laminated wiring
JP3118103B2 (ja) * 1992-12-21 2000-12-18 矢崎総業株式会社 電気回路用導電部材、電気回路体及びその製造方法
JP3241139B2 (ja) * 1993-02-04 2001-12-25 三菱電機株式会社 フィルムキャリア信号伝送線路
US6154103A (en) * 1994-04-15 2000-11-28 Superconductor Technologies, Inc. Push on connector for cryocable and mating weldable hermetic feedthrough
US6023408A (en) * 1996-04-09 2000-02-08 The Board Of Trustees Of The University Of Arkansas Floating plate capacitor with extremely wide band low impedance
JP3282608B2 (ja) * 1999-03-23 2002-05-20 日本電気株式会社 多層基板
EP1287579A1 (de) * 2000-04-20 2003-03-05 Paratek Microwave, Inc. Abstimmbarer phasenschieber in hohlleiter-flossenleitungstechnik
JP2002164713A (ja) * 2000-11-28 2002-06-07 Tdk Corp 被覆シート、該シートを用いたトリプレート線路、該シートを用いたコンピュータ用信号バス及び該シートを用いた電子回路被覆構造
JP4626919B2 (ja) * 2001-03-27 2011-02-09 ルネサスエレクトロニクス株式会社 半導体装置
US7061342B2 (en) * 2001-12-28 2006-06-13 Molex Incorporated Differential transmission channel link for delivering high frequency signals and power
EP1698216A1 (de) * 2003-12-24 2006-09-06 Molex Incorporated Übertragungsleitung mit einer transformierenden impedanz und lotflecken
KR100751600B1 (ko) * 2003-12-24 2007-08-22 몰렉스 인코포레이티드 변형 임피던스를 구비한 전송 라인
EP1698217A1 (de) * 2003-12-24 2006-09-06 Molex Incorporated Elektromagnetisch abgeschirmte schlitzübertragungsleitung
US7116190B2 (en) * 2003-12-24 2006-10-03 Molex Incorporated Slot transmission line patch connector
US20050201065A1 (en) * 2004-02-13 2005-09-15 Regnier Kent E. Preferential ground and via exit structures for printed circuit boards
EP1721496A2 (de) * 2004-02-13 2006-11-15 Molex Incorporated Bevorzugte masse- und kontaktlochaustrittsstrukturen für leiterplatten
CN101095381B (zh) * 2004-10-29 2010-06-16 莫莱克斯公司 用于高速电连接器的印刷电路板
US20060139117A1 (en) * 2004-12-23 2006-06-29 Brunker David L Multi-channel waveguide structure

Also Published As

Publication number Publication date
EP1698016B1 (de) 2008-09-03
WO2005067092A1 (en) 2005-07-21
CN100568614C (zh) 2009-12-09
JP2007518311A (ja) 2007-07-05
WO2005067092B1 (en) 2005-09-22
KR100744209B1 (ko) 2007-07-30
EP1698016A1 (de) 2006-09-06
KR20060126732A (ko) 2006-12-08
CN1906797A (zh) 2007-01-31
US20050151604A1 (en) 2005-07-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee