DE60138505D1 - Leiterplatte und Verfahren zu deren Herstellung - Google Patents
Leiterplatte und Verfahren zu deren HerstellungInfo
- Publication number
- DE60138505D1 DE60138505D1 DE60138505T DE60138505T DE60138505D1 DE 60138505 D1 DE60138505 D1 DE 60138505D1 DE 60138505 T DE60138505 T DE 60138505T DE 60138505 T DE60138505 T DE 60138505T DE 60138505 D1 DE60138505 D1 DE 60138505D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- circuit board
- printed circuit
- printed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000086857A JP3775970B2 (ja) | 2000-03-27 | 2000-03-27 | 電子部品実装用基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60138505D1 true DE60138505D1 (de) | 2009-06-10 |
Family
ID=18602958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60138505T Expired - Lifetime DE60138505D1 (de) | 2000-03-27 | 2001-03-26 | Leiterplatte und Verfahren zu deren Herstellung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6730859B2 (de) |
EP (1) | EP1146780B1 (de) |
JP (1) | JP3775970B2 (de) |
DE (1) | DE60138505D1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4554873B2 (ja) * | 2002-04-22 | 2010-09-29 | 日本電気株式会社 | 配線板、電子機器および電子部品の実装方法並びに製造方法 |
KR100499004B1 (ko) * | 2002-12-18 | 2005-07-01 | 삼성전기주식회사 | 광비아홀을 구비하는 인쇄회로기판 및 가공 공정 |
EP1443810A1 (de) * | 2003-01-23 | 2004-08-04 | Alcatel | Mehrschichtige Rückwandplatte mit Kontaktlöchern für Steckerstifte |
TW579665B (en) * | 2003-04-23 | 2004-03-11 | Via Tech Inc | Vertical routing structure |
TWI281367B (en) * | 2005-02-04 | 2007-05-11 | Lite On Technology Corp | Printed circuit board and forming method thereof |
KR20070006458A (ko) * | 2005-07-08 | 2007-01-11 | 삼성전자주식회사 | 발광 다이오드 모듈, 이를 구비한 백라이트 어셈블리, 및이를 구비한 표시 장치 |
JP4864419B2 (ja) * | 2005-10-28 | 2012-02-01 | 株式会社東芝 | プリント回路板および電子機器 |
WO2008129831A1 (ja) * | 2007-03-30 | 2008-10-30 | Panasonic Corporation | 配線基板 |
US20080280463A1 (en) * | 2007-05-09 | 2008-11-13 | Mercury Computer Systems, Inc. | Rugged Chip Packaging |
JP2013089313A (ja) * | 2011-10-13 | 2013-05-13 | Tyco Electronics Japan Kk | コネクタ |
JP2015023251A (ja) * | 2013-07-23 | 2015-02-02 | ソニー株式会社 | 多層配線基板およびその製造方法、並びに半導体製品 |
CN104349576A (zh) * | 2013-08-01 | 2015-02-11 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1042234A (en) * | 1965-03-05 | 1966-09-14 | Mullard Ltd | Multilayer printed circuits |
US5079065A (en) * | 1990-04-02 | 1992-01-07 | Fuji Xerox Co., Ltd. | Printed-circuit substrate and method of making thereof |
FI88241C (fi) * | 1990-10-30 | 1993-04-13 | Nokia Mobile Phones Ltd | Foerfarande foer framstaellning av kretskort |
US5199879A (en) * | 1992-02-24 | 1993-04-06 | International Business Machines Corporation | Electrical assembly with flexible circuit |
JPH05315760A (ja) * | 1992-05-01 | 1993-11-26 | Cmk Corp | 多層プリント配線板の製造方法 |
US6400573B1 (en) * | 1993-02-09 | 2002-06-04 | Texas Instruments Incorporated | Multi-chip integrated circuit module |
US5573172A (en) * | 1993-11-08 | 1996-11-12 | Sawtek, Inc. | Surface mount stress relief hidden lead package device and method |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
US5826330A (en) * | 1995-12-28 | 1998-10-27 | Hitachi Aic Inc. | Method of manufacturing multilayer printed wiring board |
US5730932A (en) * | 1996-03-06 | 1998-03-24 | International Business Machines Corporation | Lead-free, tin-based multi-component solder alloys |
JPH1041605A (ja) * | 1996-07-25 | 1998-02-13 | Hitachi Aic Inc | 電子部品の実装構造 |
US6307161B1 (en) * | 1996-09-10 | 2001-10-23 | Formfactor, Inc. | Partially-overcoated elongate contact structures |
JP2991155B2 (ja) * | 1997-05-09 | 1999-12-20 | 日本電気株式会社 | 電子部品およびその実装構造 |
US6027858A (en) * | 1997-06-06 | 2000-02-22 | International Business Machines Corporation | Process for tenting PTH's with PID dry film |
US6392160B1 (en) * | 1998-11-25 | 2002-05-21 | Lucent Technologies Inc. | Backplane for radio frequency signals |
-
2000
- 2000-03-27 JP JP2000086857A patent/JP3775970B2/ja not_active Expired - Fee Related
-
2001
- 2001-03-26 DE DE60138505T patent/DE60138505D1/de not_active Expired - Lifetime
- 2001-03-26 EP EP01302775A patent/EP1146780B1/de not_active Expired - Lifetime
- 2001-03-27 US US09/817,947 patent/US6730859B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1146780B1 (de) | 2009-04-29 |
US20010023781A1 (en) | 2001-09-27 |
JP2001274546A (ja) | 2001-10-05 |
JP3775970B2 (ja) | 2006-05-17 |
EP1146780A3 (de) | 2003-05-14 |
US6730859B2 (en) | 2004-05-04 |
EP1146780A2 (de) | 2001-10-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |