DE60102115D1 - Verfahren und Vorrichtung zum Schwall-Löten - Google Patents
Verfahren und Vorrichtung zum Schwall-LötenInfo
- Publication number
- DE60102115D1 DE60102115D1 DE60102115T DE60102115T DE60102115D1 DE 60102115 D1 DE60102115 D1 DE 60102115D1 DE 60102115 T DE60102115 T DE 60102115T DE 60102115 T DE60102115 T DE 60102115T DE 60102115 D1 DE60102115 D1 DE 60102115D1
- Authority
- DE
- Germany
- Prior art keywords
- wave soldering
- soldering
- wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title 1
- 238000005476 soldering Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000249588 | 2000-08-21 | ||
JP2000249588 | 2000-08-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60102115D1 true DE60102115D1 (de) | 2004-04-01 |
DE60102115T2 DE60102115T2 (de) | 2004-12-23 |
Family
ID=18739311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60102115T Expired - Fee Related DE60102115T2 (de) | 2000-08-21 | 2001-08-17 | Verfahren und Vorrichtung zum Schwall-Löten |
Country Status (3)
Country | Link |
---|---|
US (2) | US6648216B2 (de) |
EP (1) | EP1188506B1 (de) |
DE (1) | DE60102115T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002018085A1 (en) * | 2000-09-01 | 2002-03-07 | Fry's Metals, Inc. D/B/A Alpha Metals, Inc. | Rapid surface cooling of solder droplets by flash evaporation |
EP1259101A4 (de) | 2000-09-26 | 2003-04-09 | Matsushita Electric Ind Co Ltd | Schwallötvorrichtung und -methode |
JP2003051671A (ja) * | 2001-06-01 | 2003-02-21 | Nec Corp | 実装構造体の製造方法および実装構造体 |
US7861915B2 (en) * | 2004-04-16 | 2011-01-04 | Ms2 Technologies, Llc | Soldering process |
TW200610122A (en) * | 2004-09-14 | 2006-03-16 | P Kay Metal Inc | Soldering process |
US20060226199A1 (en) * | 2005-03-30 | 2006-10-12 | Visteon Global Technologies, Inc. | Selective soldering of flat flexible cable with lead-free solder to a substrate |
JP3942623B2 (ja) * | 2005-12-12 | 2007-07-11 | 富士通テン株式会社 | フラットディップ装置およびフラットディップ装置のはんだ付け方法 |
US20070254255A1 (en) * | 2006-03-28 | 2007-11-01 | Neville James E | System, apparatus and methods for board cooling |
DE102006029593A1 (de) * | 2006-05-29 | 2007-12-13 | Pink Gmbh Vakuumtechnik | Verfahren und Vorrichtung zur Herstellung einer Lotverbindung |
US8662374B2 (en) | 2010-12-16 | 2014-03-04 | Air Liquide Industrial U.S. Lp | Method for reduced cycle times in multi-pass welding while providing an inert atmosphere to the welding zone |
DE102011081606B4 (de) * | 2011-08-26 | 2022-08-04 | Infineon Technologies Ag | Kühlvorrichtung und Lötanlage |
CN108112185B (zh) * | 2017-12-12 | 2019-06-07 | 宁波隆锐机械制造有限公司 | 一种电路板冷却装置 |
US10965079B2 (en) * | 2018-10-26 | 2021-03-30 | Schweitzer Engineering Laboratories, Inc. | Comb pattern insert for wave solder pallets |
CN111889835B (zh) * | 2020-07-27 | 2021-09-21 | 中国石油大学(华东) | 一种降低钎焊接头中残余应力的方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3056015A (en) | 1960-09-30 | 1962-09-25 | Bendix Corp | Dip-soldering method and apparatus |
JPS5516726A (en) * | 1978-07-21 | 1980-02-05 | Hitachi Ltd | Soldering device |
US4402448A (en) | 1978-10-12 | 1983-09-06 | Cooper Industries, Inc. | Mass soldering system |
DE2932398C2 (de) * | 1979-08-09 | 1981-10-15 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum Kühlen von Leiterplatten nach dem maschinellen Einlöten von elektrischen Bauteilen |
US4818823A (en) * | 1987-07-06 | 1989-04-04 | Micro-Circuits, Inc. | Adhesive component means for attaching electrical components to conductors |
JPH01289566A (ja) * | 1988-05-12 | 1989-11-21 | Mitsubishi Electric Corp | ベーパーフェイズ・リフロー半田付装置 |
US5236117A (en) * | 1992-06-22 | 1993-08-17 | Staktek Corporation | Impact solder method and apparatus |
US5685475A (en) * | 1995-09-08 | 1997-11-11 | Ford Motor Company | Apparatus for cooling printed circuit boards in wave soldering |
JP3220635B2 (ja) | 1996-02-09 | 2001-10-22 | 松下電器産業株式会社 | はんだ合金及びクリームはんだ |
US5730932A (en) * | 1996-03-06 | 1998-03-24 | International Business Machines Corporation | Lead-free, tin-based multi-component solder alloys |
EP0977900A4 (de) * | 1997-04-22 | 2001-06-13 | Ecosolder Internat Pty Ltd | Bleifreies lot |
JP3414263B2 (ja) * | 1998-06-04 | 2003-06-09 | 株式会社日立製作所 | 電子回路基板の製造方法 |
JP2000188464A (ja) * | 1998-12-21 | 2000-07-04 | Senju Metal Ind Co Ltd | 自動はんだ付け装置 |
JP2000244108A (ja) | 1999-02-22 | 2000-09-08 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置 |
JP3617793B2 (ja) * | 1999-06-30 | 2005-02-09 | 株式会社東芝 | はんだ付け方法およびはんだ付け装置 |
JP2002043734A (ja) * | 2000-07-24 | 2002-02-08 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法およびその装置 |
-
2001
- 2001-08-09 US US09/924,555 patent/US6648216B2/en not_active Expired - Fee Related
- 2001-08-17 DE DE60102115T patent/DE60102115T2/de not_active Expired - Fee Related
- 2001-08-17 EP EP01119888A patent/EP1188506B1/de not_active Expired - Lifetime
-
2003
- 2003-09-24 US US10/668,355 patent/US7150387B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20020038815A1 (en) | 2002-04-04 |
EP1188506B1 (de) | 2004-02-25 |
EP1188506A1 (de) | 2002-03-20 |
DE60102115T2 (de) | 2004-12-23 |
US7150387B2 (en) | 2006-12-19 |
US20040056067A1 (en) | 2004-03-25 |
US6648216B2 (en) | 2003-11-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
8339 | Ceased/non-payment of the annual fee |