DE60101481D1 - Veränderung von layout-daten einer maske zur verbesserung des erzeugten musters - Google Patents
Veränderung von layout-daten einer maske zur verbesserung des erzeugten mustersInfo
- Publication number
- DE60101481D1 DE60101481D1 DE60101481T DE60101481T DE60101481D1 DE 60101481 D1 DE60101481 D1 DE 60101481D1 DE 60101481 T DE60101481 T DE 60101481T DE 60101481 T DE60101481 T DE 60101481T DE 60101481 D1 DE60101481 D1 DE 60101481D1
- Authority
- DE
- Germany
- Prior art keywords
- modifying
- mask
- improve
- layout data
- generated pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
- G03F7/70441—Optical proximity correction [OPC]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/596,954 US6444373B1 (en) | 2000-06-16 | 2000-06-16 | Modification of mask layout data to improve mask fidelity |
US596954 | 2000-06-16 | ||
PCT/US2001/012853 WO2001098830A2 (en) | 2000-06-16 | 2001-04-19 | Modification of mask layout data to improve mask fidelity |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60101481D1 true DE60101481D1 (de) | 2004-01-22 |
DE60101481T2 DE60101481T2 (de) | 2004-10-14 |
Family
ID=24389425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60101481T Expired - Lifetime DE60101481T2 (de) | 2000-06-16 | 2001-04-19 | Veränderung von layout-daten einer maske zur verbesserung des erzeugten musters |
Country Status (5)
Country | Link |
---|---|
US (2) | US6444373B1 (de) |
EP (1) | EP1290496B1 (de) |
AU (1) | AU2001257130A1 (de) |
DE (1) | DE60101481T2 (de) |
WO (1) | WO2001098830A2 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4580529B2 (ja) * | 2000-09-26 | 2010-11-17 | 大日本印刷株式会社 | 半導体回路の設計パタンデータ補正方法と、補正された設計パタンデータを用いたフォトマスク、該フォトマスクの検査方法およびフォトマスク検査用パタンデータ作製方法 |
US6673638B1 (en) * | 2001-11-14 | 2004-01-06 | Kla-Tencor Corporation | Method and apparatus for the production of process sensitive lithographic features |
US6691052B1 (en) * | 2002-01-30 | 2004-02-10 | Kla-Tencor Corporation | Apparatus and methods for generating an inspection reference pattern |
WO2004008246A2 (en) | 2002-07-12 | 2004-01-22 | Cadence Design Systems, Inc. | Method and system for context-specific mask writing |
US7231628B2 (en) * | 2002-07-12 | 2007-06-12 | Cadence Design Systems, Inc. | Method and system for context-specific mask inspection |
US7302672B2 (en) * | 2002-07-12 | 2007-11-27 | Cadence Design Systems, Inc. | Method and system for context-specific mask writing |
US6792592B2 (en) * | 2002-08-30 | 2004-09-14 | Numerical Technologies, Inc. | Considering mask writer properties during the optical proximity correction process |
JP4040515B2 (ja) * | 2003-03-26 | 2008-01-30 | 株式会社東芝 | マスクのセット、マスクデータ作成方法及びパターン形成方法 |
US6973637B2 (en) * | 2003-05-12 | 2005-12-06 | Agere Systems Inc. | Process for the selective control of feature size in lithographic processing |
US7318214B1 (en) | 2003-06-19 | 2008-01-08 | Invarium, Inc. | System and method for reducing patterning variability in integrated circuit manufacturing through mask layout corrections |
US7024638B2 (en) * | 2003-07-14 | 2006-04-04 | Cadence Design Systems, Inc. | Method for creating patterns for producing integrated circuits |
JP2007521500A (ja) * | 2003-07-14 | 2007-08-02 | カデンス デザイン システムズ, インコーポレイテッド | 集積回路を製造するためのパターンを作成する方法 |
US7261982B2 (en) * | 2003-08-07 | 2007-08-28 | Jds Uniphase Corporation | Planar circuit optimization |
US7266800B2 (en) * | 2004-06-04 | 2007-09-04 | Invarium, Inc. | Method and system for designing manufacturable patterns that account for the pattern- and position-dependent nature of patterning processes |
CN101073084A (zh) * | 2004-10-05 | 2007-11-14 | 凸版光掩膜公司 | 分析光掩模几何图形的***和方法 |
US7588868B2 (en) * | 2004-10-06 | 2009-09-15 | Cadence Design Systems, Inc. | Method and system for reducing the impact of across-wafer variations on critical dimension measurements |
US7345738B2 (en) * | 2004-12-03 | 2008-03-18 | Asml Netherlands B.V. | Certified cells and method of using certified cells for fabricating a device |
US7465525B2 (en) * | 2005-05-10 | 2008-12-16 | Lam Research Corporation | Reticle alignment and overlay for multiple reticle process |
US7539969B2 (en) * | 2005-05-10 | 2009-05-26 | Lam Research Corporation | Computer readable mask shrink control processor |
US7392503B2 (en) * | 2005-07-20 | 2008-06-24 | Winbond Electronics Corp. | Method of correcting mask pattern |
US20070143234A1 (en) * | 2005-12-16 | 2007-06-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for intelligent model-based optical proximity correction (OPC) |
EP2097788A1 (de) * | 2006-12-21 | 2009-09-09 | Nxp B.V. | Verfahren und system zum identifizieren von schwachpunkten in einem integrierten schaltungsentwurf |
US20080241709A1 (en) * | 2007-04-02 | 2008-10-02 | Kent Nakagawa | System And Method For analyzing photomask Geometries |
JP5137444B2 (ja) * | 2007-04-04 | 2013-02-06 | 株式会社日立ハイテクノロジーズ | Opcモデリング構築方法、情報処理装置、及び半導体デバイスのプロセス条件を決定する方法 |
DE102009007770A1 (de) * | 2009-02-05 | 2010-08-12 | Carl Zeiss Sms Gmbh | Verfahren zur Bestimmung von Korrekturen für Elektronenstrahl-Maskenschreiber |
US8103984B1 (en) * | 2009-02-23 | 2012-01-24 | Cadence Design Systems, Inc. | System and method for compressed design phase contour data |
US7944545B2 (en) * | 2009-05-11 | 2011-05-17 | International Business Machines Corporation | High contrast lithographic masks |
CN103309150B (zh) * | 2013-06-26 | 2015-06-17 | 上海华力微电子有限公司 | 版图数据的处理方法 |
US9007719B1 (en) | 2013-10-23 | 2015-04-14 | Western Digital (Fremont), Llc | Systems and methods for using double mask techniques to achieve very small features |
WO2018125115A1 (en) * | 2016-12-29 | 2018-07-05 | Intel Corporation | Accounting for mask manufacturing infidelities in semiconductor devices |
US11435660B2 (en) * | 2017-11-22 | 2022-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photomask and method of fabricating a photomask |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600734A (en) * | 1991-10-04 | 1997-02-04 | Fujitsu Limited | Electron beam tester |
JP3334441B2 (ja) * | 1995-08-01 | 2002-10-15 | ソニー株式会社 | フォトマスク描画用パターンデータ補正方法と補正装置 |
JP3454983B2 (ja) * | 1995-08-25 | 2003-10-06 | 株式会社東芝 | 荷電ビーム描画方法 |
US5723233A (en) | 1996-02-27 | 1998-03-03 | Lsi Logic Corporation | Optical proximity correction method and apparatus |
US5740068A (en) | 1996-05-30 | 1998-04-14 | International Business Machines Corporation | Fidelity enhancement of lithographic and reactive-ion-etched images by optical proximity correction |
JP3551660B2 (ja) * | 1996-10-29 | 2004-08-11 | ソニー株式会社 | 露光パターンの補正方法および露光パターンの補正装置および露光方法 |
US5821014A (en) | 1997-02-28 | 1998-10-13 | Microunity Systems Engineering, Inc. | Optical proximity correction method for intermediate-pitch features using sub-resolution scattering bars on a mask |
US5858591A (en) | 1998-02-02 | 1999-01-12 | Taiwan Semiconductor Manufacturing Company Ltd. | Optical proximity correction during wafer processing through subfile bias modification with subsequent subfile merging |
JP2000020564A (ja) * | 1998-06-29 | 2000-01-21 | Mitsubishi Electric Corp | レイアウトパターンデータ補正装置、レイアウトパターンデータ補正方法、その補正方法を用いた半導体装置の製造方法、および、半導体装置の製造プログラムを記録した記録媒体 |
US6330708B1 (en) * | 1998-09-17 | 2001-12-11 | International Business Machines Corporation | Method for preparing command files for photomask production |
-
2000
- 2000-06-16 US US09/596,954 patent/US6444373B1/en not_active Expired - Lifetime
-
2001
- 2001-04-19 DE DE60101481T patent/DE60101481T2/de not_active Expired - Lifetime
- 2001-04-19 WO PCT/US2001/012853 patent/WO2001098830A2/en active IP Right Grant
- 2001-04-19 EP EP01930611A patent/EP1290496B1/de not_active Expired - Lifetime
- 2001-04-19 AU AU2001257130A patent/AU2001257130A1/en not_active Abandoned
-
2002
- 2002-06-20 US US10/175,923 patent/US6579651B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60101481T2 (de) | 2004-10-14 |
US20020160281A1 (en) | 2002-10-31 |
US6579651B2 (en) | 2003-06-17 |
EP1290496B1 (de) | 2003-12-10 |
US6444373B1 (en) | 2002-09-03 |
WO2001098830A3 (en) | 2002-07-25 |
WO2001098830A2 (en) | 2001-12-27 |
EP1290496A2 (de) | 2003-03-12 |
AU2001257130A1 (en) | 2002-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: GLOBALFOUNDRIES INC. MAPLES CORPORATE SERVICES, KY |