DE60032953D1 - Datenoptimierungsverfahren für Sondenkartenanalyse und Riebmarkanalyse - Google Patents

Datenoptimierungsverfahren für Sondenkartenanalyse und Riebmarkanalyse

Info

Publication number
DE60032953D1
DE60032953D1 DE60032953T DE60032953T DE60032953D1 DE 60032953 D1 DE60032953 D1 DE 60032953D1 DE 60032953 T DE60032953 T DE 60032953T DE 60032953 T DE60032953 T DE 60032953T DE 60032953 D1 DE60032953 D1 DE 60032953D1
Authority
DE
Germany
Prior art keywords
analysis
probe card
reamed
optimization procedure
data optimization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60032953T
Other languages
English (en)
Inventor
John Strom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Global Life Sciences Solutions USA LLC
Original Assignee
Applied Precision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Precision Inc filed Critical Applied Precision Inc
Application granted granted Critical
Publication of DE60032953D1 publication Critical patent/DE60032953D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Tests Of Electronic Circuits (AREA)
DE60032953T 1999-06-07 2000-06-07 Datenoptimierungsverfahren für Sondenkartenanalyse und Riebmarkanalyse Expired - Lifetime DE60032953D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/327,106 US6414477B1 (en) 1999-06-07 1999-06-07 Method for optimizing probe card analysis and scrub mark analysis data

Publications (1)

Publication Number Publication Date
DE60032953D1 true DE60032953D1 (de) 2007-02-22

Family

ID=23275190

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60032953T Expired - Lifetime DE60032953D1 (de) 1999-06-07 2000-06-07 Datenoptimierungsverfahren für Sondenkartenanalyse und Riebmarkanalyse
DE60017016T Expired - Lifetime DE60017016T2 (de) 1999-06-07 2000-06-07 Datenoptimierungsverfahren für Sondenkartenanalyse und Riebmarkanalyse

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60017016T Expired - Lifetime DE60017016T2 (de) 1999-06-07 2000-06-07 Datenoptimierungsverfahren für Sondenkartenanalyse und Riebmarkanalyse

Country Status (5)

Country Link
US (2) US6414477B1 (de)
EP (2) EP1519200B1 (de)
JP (1) JP3800394B2 (de)
AT (1) ATE286261T1 (de)
DE (2) DE60032953D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6414477B1 (en) * 1999-06-07 2002-07-02 Applied Precision, Inc. Method for optimizing probe card analysis and scrub mark analysis data
US20020097062A1 (en) * 2000-10-30 2002-07-25 Strom John Timothy Method and process of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing analysis, and manufacture
US8466703B2 (en) 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
WO2004084124A1 (en) * 2003-03-14 2004-09-30 Applied Precision, Llc System and method of point matching measured positions to template positions
EP1604218A2 (de) 2003-03-14 2005-12-14 Applied Precision, LLC Verfahren zur reduzierung des einflusses der biegung von bauelementen in einem nadelkartenanalysator
US6911814B2 (en) * 2003-07-01 2005-06-28 Formfactor, Inc. Apparatus and method for electromechanical testing and validation of probe cards
KR20070075589A (ko) * 2006-01-13 2007-07-24 삼성전자주식회사 프로브 카드 이상 확인 방법
US8311758B2 (en) 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
JP2007200934A (ja) * 2006-01-23 2007-08-09 Fujitsu Ltd プローブカードのプローブ針の針跡評価方法
WO2009048618A1 (en) * 2007-10-11 2009-04-16 Veraconnex, Llc Probe card test apparatus and method
JP4997127B2 (ja) * 2008-01-23 2012-08-08 東京エレクトロン株式会社 検査方法及びこの検査方法を記録したプログラム記録媒体
JP5433266B2 (ja) * 2009-03-19 2014-03-05 東京エレクトロン株式会社 針跡の判定方法及び針跡判定用プログラム
SG190327A1 (en) 2010-12-14 2013-07-31 Novartis Ag Colored contact lens
US10295591B2 (en) * 2013-01-02 2019-05-21 Texas Instruments Incorporated Method and device for testing wafers
US9768134B2 (en) 2015-01-29 2017-09-19 Micron Technology, Inc. Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects
TWI652484B (zh) 2018-03-06 2019-03-01 均豪精密工業股份有限公司 探針卡線上調針維修系統及其方法
TWI744805B (zh) * 2020-02-24 2021-11-01 頎邦科技股份有限公司 電路板
TWI800084B (zh) * 2020-11-13 2023-04-21 旺矽科技股份有限公司 用於確認探針是否與接觸墊相接觸的半導體檢測方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4583298A (en) * 1984-03-07 1986-04-22 Hewlett-Packard Company Auto calibration method suitable for use in electron beam lithography
US4864227A (en) 1987-02-27 1989-09-05 Canon Kabushiki Kaisha Wafer prober
US4918374A (en) 1988-10-05 1990-04-17 Applied Precision, Inc. Method and apparatus for inspecting integrated circuit probe cards
JP3723232B2 (ja) * 1992-03-10 2005-12-07 シリコン システムズ インコーポレーテッド プローブ針調整ツール及びプローブ針調整法
US5657394A (en) 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
US5644245A (en) 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
JP2632136B2 (ja) * 1994-10-17 1997-07-23 日本電子材料株式会社 高温測定用プローブカード
US6414477B1 (en) * 1999-06-07 2002-07-02 Applied Precision, Inc. Method for optimizing probe card analysis and scrub mark analysis data

Also Published As

Publication number Publication date
EP1061381B1 (de) 2004-12-29
JP2001118890A (ja) 2001-04-27
EP1519200B1 (de) 2007-01-10
EP1061381A2 (de) 2000-12-20
EP1519200A1 (de) 2005-03-30
EP1061381A3 (de) 2001-09-26
JP3800394B2 (ja) 2006-07-26
US6621262B2 (en) 2003-09-16
US6414477B1 (en) 2002-07-02
DE60017016T2 (de) 2005-05-25
US20020171414A1 (en) 2002-11-21
DE60017016D1 (de) 2005-02-03
ATE286261T1 (de) 2005-01-15

Similar Documents

Publication Publication Date Title
DE60032953D1 (de) Datenoptimierungsverfahren für Sondenkartenanalyse und Riebmarkanalyse
ATE385032T1 (de) Mehrfachsonden-messgerät und zugehöriges anwendungsverfahren
ATE520366T1 (de) Vorrichtung zum speichen einer trajektorie eines chirurgischen navigationssystems
DE60239406D1 (de) Verfahren und vorrichtung zur positionsbestimmung unter verwendung einer groben positionsabschätzung
DE69838530D1 (de) Messchip für einen optischen Analysator
DE59907031D1 (de) Verfahren und anordnung zum kalibrieren einer laserbearbeitungsmaschine zum bearbeiten von werkstücken
DE50308806D1 (de) Vermessungseinrichtung für eine vorlage und damit versehene bearbeitungsmaschine
ATE432217T1 (de) Flugzeugwartungsdiagnosesystem sowie flugzeugwartungsdiagnoseverfahren
BR9902790A (pt) Interface de usuário para um sistema analisador biomédico
DE69720200D1 (de) Fehlerdetektionsverfahren für optischen verstärker
DK1328421T3 (da) Fremgangsmåde og apparat til vurdering og forbedring af en førers arbejdspræstation
DE69730123D1 (de) Bewertungsmethode für wegwerfbare absorbierende Artikel
DE60013882D1 (de) Fernüberprüfung von softwarekonfigurationsinformation
EP0887650B8 (de) Robuster Elektrizitätszähler
EP1445664A3 (de) Ausrichtverfahren und System zur seitlichen Versetzung von Abbildungen bei Superposition und auf einem Bildträger
SE9403950D0 (sv) Analysapparat
DE50213775D1 (de) Positionsmesseinrichtung
DK1770006T3 (da) Fremgangsmåde og indretning til inspektion af en genstand
ATE282833T1 (de) Methode und apparat zur lokalen temperaturmessung für hochauflösende in-situ messung
ATE342505T1 (de) Vorrichtung für die entnahme von flüssigen proben
ATE438083T1 (de) Optische positionsmesseinrichtung
EP0155348A3 (en) Method for signal transmission and device for carrying out the method, in particular in a length or angle measurement device
ATE540325T1 (de) Verfahren und vorrichtung zur messung der radioaktivitätsverteilung
ATE417962T1 (de) Verfahren und vorrichtung um schienenwegparametern zu messen
TW373281B (en) A method for detecting operational errors of tester for semiconductor devices

Legal Events

Date Code Title Description
8332 No legal effect for de