DE60030642D1 - Nassbehandlungsdüse, Düsevorrichtung und Nassbehanlungsvorrichtung - Google Patents
Nassbehandlungsdüse, Düsevorrichtung und NassbehanlungsvorrichtungInfo
- Publication number
- DE60030642D1 DE60030642D1 DE60030642T DE60030642T DE60030642D1 DE 60030642 D1 DE60030642 D1 DE 60030642D1 DE 60030642 T DE60030642 T DE 60030642T DE 60030642 T DE60030642 T DE 60030642T DE 60030642 D1 DE60030642 D1 DE 60030642D1
- Authority
- DE
- Germany
- Prior art keywords
- nozzle
- wet treatment
- wet
- treatment device
- nozzle device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22949799 | 1999-08-13 | ||
JP22949799A JP4215900B2 (ja) | 1999-08-13 | 1999-08-13 | ウェット処理用ノズル装置およびウェット処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60030642D1 true DE60030642D1 (de) | 2006-10-26 |
DE60030642T2 DE60030642T2 (de) | 2007-09-13 |
Family
ID=16893107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60030642T Expired - Lifetime DE60030642T2 (de) | 1999-08-13 | 2000-08-11 | Nassbehandlungsdüse, Düsevorrichtung und Nassbehanlungsvorrichtung |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1076356B1 (de) |
JP (1) | JP4215900B2 (de) |
KR (1) | KR100385906B1 (de) |
DE (1) | DE60030642T2 (de) |
TW (1) | TW478973B (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3970567B2 (ja) * | 2001-09-17 | 2007-09-05 | アルプス電気株式会社 | ウェット処理装置 |
US6988326B2 (en) * | 2002-09-30 | 2006-01-24 | Lam Research Corporation | Phobic barrier meniscus separation and containment |
KR20040029578A (ko) * | 2002-10-01 | 2004-04-08 | 주식회사 실트론 | 초음파 세정기를 이용한 웨이퍼 세정 장치 |
US6867844B2 (en) | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
DE102004053337A1 (de) * | 2004-11-04 | 2006-05-11 | Steag Hama Tech Ag | Verfahren und Vorrichtung zum Behandeln von Substraten und Düseneinheit hierfür |
JP5038695B2 (ja) * | 2006-11-30 | 2012-10-03 | 東京応化工業株式会社 | 処理装置および表面処理治具 |
JP4755573B2 (ja) | 2006-11-30 | 2011-08-24 | 東京応化工業株式会社 | 処理装置および処理方法、ならびに表面処理治具 |
JP4171039B2 (ja) | 2006-12-22 | 2008-10-22 | 株式会社コナミデジタルエンタテインメント | ゲーム装置、ゲーム装置の制御方法及びプログラム |
US8141566B2 (en) * | 2007-06-19 | 2012-03-27 | Lam Research Corporation | System, method and apparatus for maintaining separation of liquids in a controlled meniscus |
JP5734705B2 (ja) * | 2011-03-02 | 2015-06-17 | 株式会社Screenホールディングス | 基板処理装置 |
JP5227441B2 (ja) * | 2011-04-18 | 2013-07-03 | 東京応化工業株式会社 | 処理装置 |
US20130052360A1 (en) | 2011-08-30 | 2013-02-28 | Tadashi Maegawa | Substrate processing apparatus, substrate processing method, and nozzle |
JP6558845B2 (ja) * | 2014-10-10 | 2019-08-14 | 株式会社ホロン | 被洗浄体の異物除去装置およびその異物除去方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8703114U1 (de) * | 1987-02-25 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Einrichtung zur Reinigung oder chemischen Behandlung von Werkstücken |
JPH1133506A (ja) * | 1997-07-24 | 1999-02-09 | Tadahiro Omi | 流体処理装置及び洗浄処理システム |
JP3511442B2 (ja) * | 1996-12-18 | 2004-03-29 | 忠弘 大見 | 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、省液型の液体供給ノズル装置及びウエット処理装置 |
-
1999
- 1999-08-13 JP JP22949799A patent/JP4215900B2/ja not_active Expired - Fee Related
-
2000
- 2000-07-18 TW TW089114368A patent/TW478973B/zh not_active IP Right Cessation
- 2000-08-11 KR KR10-2000-0046525A patent/KR100385906B1/ko not_active IP Right Cessation
- 2000-08-11 EP EP00306880A patent/EP1076356B1/de not_active Expired - Lifetime
- 2000-08-11 DE DE60030642T patent/DE60030642T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1076356B1 (de) | 2006-09-13 |
KR20010039809A (ko) | 2001-05-15 |
DE60030642T2 (de) | 2007-09-13 |
EP1076356A2 (de) | 2001-02-14 |
EP1076356A3 (de) | 2003-01-29 |
TW478973B (en) | 2002-03-11 |
KR100385906B1 (ko) | 2003-06-02 |
JP2001053046A (ja) | 2001-02-23 |
JP4215900B2 (ja) | 2009-01-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69924155D1 (de) | Fluoren-copolymere und daraus hergestellte vorrichtungen | |
DE60119356D1 (de) | Textilbehandlungsvorrichtung | |
DE60012680D1 (de) | Düseneinrichtung | |
DE60033055D1 (de) | Bandscheibenbehandlungsvorrichtung | |
DE69933706D1 (de) | Kommunikations vorrichtung und steckeinheit | |
DE60113770D1 (de) | Reinigungsdüse und Reinigungsgerät | |
NO20012170D0 (no) | Selvstendig, transportabel blodbehandlingsinnretning | |
DE50010609D1 (de) | Sport-trainings-vorrichtung sowie sport-trainings-system | |
DE50008281D1 (de) | Spinnvorrichtung | |
DE60017614D1 (de) | Ultraschallreiniger und diesen enthaltende Nassbehandlungsdüse | |
DE60009402D1 (de) | Spinnvorrichtung und Spinnverfahren | |
ATE269391T1 (de) | Wäschebehandlung | |
DE60030642D1 (de) | Nassbehandlungsdüse, Düsevorrichtung und Nassbehanlungsvorrichtung | |
NO20013337L (no) | Ny behandling | |
DE60033602D1 (de) | Druckverfahren und Druckgerät | |
ES1046206Y (es) | Aparato quirurgico. | |
DE60045809D1 (de) | Druckvorrichtung und Druckverfahren | |
DE50005409D1 (de) | Hör-behandlungsgerät | |
DE60003114D1 (de) | Laserbehandlungsvorrichtung | |
IT1310962B1 (it) | Apparecchio asciuga-capelli perfezionato. | |
DE60023003D1 (de) | Haarbehandlungsmittel | |
ATA2099A (de) | Heizeinrichtung | |
ATA2199A (de) | Heizeinrichtung | |
DK1176991T3 (da) | Keramisk sårbehandlingsanordning | |
DE69932577D1 (de) | Stangenbehandlungsgerät und Stangenladegerät |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8381 | Inventor (new situation) |
Inventor name: MITSUMORI, KENICHI, SENDAI-SHI, MIYAGI-KEN, JP Inventor name: HAGA, NOBUAKI, SENDAI-SHI, MIYAGI-KEN, JP Inventor name: KASAMA, YASUHIKO, SENDAI-SHI, MIYAGI-KEN, JP |
|
8364 | No opposition during term of opposition |