DE59705802D1 - METHOD AND CONNECTING ARRANGEMENT FOR PRODUCING A CHIP CARD - Google Patents

METHOD AND CONNECTING ARRANGEMENT FOR PRODUCING A CHIP CARD

Info

Publication number
DE59705802D1
DE59705802D1 DE59705802T DE59705802T DE59705802D1 DE 59705802 D1 DE59705802 D1 DE 59705802D1 DE 59705802 T DE59705802 T DE 59705802T DE 59705802 T DE59705802 T DE 59705802T DE 59705802 D1 DE59705802 D1 DE 59705802D1
Authority
DE
Germany
Prior art keywords
producing
chip card
connecting arrangement
arrangement
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE59705802T
Other languages
German (de)
Inventor
Robert Wilm
Detlef Houdeau
Robert Reiner
Rainer Rettig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PAV Card GmbH
Siemens AG
Liveo Research GmbH
Original Assignee
EVC Rigid Film GmbH
PAV Card GmbH
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EVC Rigid Film GmbH, PAV Card GmbH, Siemens AG filed Critical EVC Rigid Film GmbH
Priority claimed from PCT/EP1997/005197 external-priority patent/WO1998015916A1/en
Application granted granted Critical
Publication of DE59705802D1 publication Critical patent/DE59705802D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
DE59705802T 1996-10-09 1997-09-22 METHOD AND CONNECTING ARRANGEMENT FOR PRODUCING A CHIP CARD Expired - Lifetime DE59705802D1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19641650 1996-10-09
DE19645067A DE19645067C2 (en) 1996-10-09 1996-10-31 Connection arrangement for producing a chip card
PCT/EP1997/005197 WO1998015916A1 (en) 1996-10-09 1997-09-22 Method and connection arrangement for producing a smart card

Publications (1)

Publication Number Publication Date
DE59705802D1 true DE59705802D1 (en) 2002-01-24

Family

ID=7808288

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19645067A Expired - Lifetime DE19645067C2 (en) 1996-10-09 1996-10-31 Connection arrangement for producing a chip card
DE59705802T Expired - Lifetime DE59705802D1 (en) 1996-10-09 1997-09-22 METHOD AND CONNECTING ARRANGEMENT FOR PRODUCING A CHIP CARD

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19645067A Expired - Lifetime DE19645067C2 (en) 1996-10-09 1996-10-31 Connection arrangement for producing a chip card

Country Status (2)

Country Link
DE (2) DE19645067C2 (en)
EA (1) EA199900275A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19820234A1 (en) * 1998-05-06 1999-11-11 Giesecke & Devrient Gmbh Arrangement for transferring signals between a component of a portable data medium and a lead permanently associated with the component can be produced with a further simplified process
FR2781588B1 (en) * 1998-07-21 2003-04-25 Solaic Sa CONTACTLESS CARD AND METHOD FOR PRODUCING SUCH A CARD
DE10107179C2 (en) * 2001-02-15 2003-02-27 Infineon Technologies Ag Smart card module
DE10221214A1 (en) * 2002-05-13 2003-11-27 Orga Kartensysteme Gmbh Integrated circuit module is embedded into a plastic smart card and has interconnected chips on a common carrier set into protective material
JP4096315B2 (en) 2004-08-04 2008-06-04 セイコーエプソン株式会社 Display system
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
BRPI0702918A2 (en) * 2006-01-19 2011-05-10 Murata Manufacturing Co wireless ic device and component for wireless ic device
DE102006021023A1 (en) * 2006-04-28 2007-10-31 Würth Elektronik Rot am See GmbH & Co. KG modules structure
DE102006032821B4 (en) * 2006-07-14 2008-04-10 Mühlbauer Ag Method and device for producing a plurality of chip cards with an adhesive-free fixation of the chip modules
DE102013102718A1 (en) 2013-03-18 2014-09-18 Infineon Technologies Ag Smart card module arrangement
DE102018112476B4 (en) 2017-06-02 2022-01-27 Ulrich Lang Method and production plant for producing a foil substrate
WO2019224364A1 (en) * 2018-05-24 2019-11-28 Ulrich Lang Method and production installation for producing a film substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9100176A (en) * 1991-02-01 1992-03-02 Nedap Nv Antenna configuration for contactless identification label - forms part of tuned circuit of ID or credit card interrogated via inductive coupling
NL9100347A (en) * 1991-02-26 1992-03-02 Nedap Nv Integrated transformer circuit for ID or credit card - is interrogated via contactless inductive coupling using capacitor to form tuned circuit
DE19500925C2 (en) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Method for producing a contactless chip card
DE19516227C2 (en) * 1995-05-03 2002-02-07 Infineon Technologies Ag Data carrier arrangement, in particular chip card

Also Published As

Publication number Publication date
DE19645067A1 (en) 1998-05-07
DE19645067C2 (en) 2002-01-10
EA199900275A1 (en) 1999-12-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition