DE50015504D1 - Method for producing a printed circuit board and printed circuit board - Google Patents
Method for producing a printed circuit board and printed circuit boardInfo
- Publication number
- DE50015504D1 DE50015504D1 DE50015504T DE50015504T DE50015504D1 DE 50015504 D1 DE50015504 D1 DE 50015504D1 DE 50015504 T DE50015504 T DE 50015504T DE 50015504 T DE50015504 T DE 50015504T DE 50015504 D1 DE50015504 D1 DE 50015504D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- producing
- printed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19944102 | 1999-09-15 | ||
DE19945794A DE19945794C2 (en) | 1999-09-15 | 1999-09-24 | Method for producing a metal-ceramic circuit board with through contacts |
Publications (1)
Publication Number | Publication Date |
---|---|
DE50015504D1 true DE50015504D1 (en) | 2009-02-12 |
Family
ID=7922032
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19945794A Expired - Fee Related DE19945794C2 (en) | 1999-09-15 | 1999-09-24 | Method for producing a metal-ceramic circuit board with through contacts |
DE50015504T Expired - Lifetime DE50015504D1 (en) | 1999-09-15 | 2000-08-24 | Method for producing a printed circuit board and printed circuit board |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19945794A Expired - Fee Related DE19945794C2 (en) | 1999-09-15 | 1999-09-24 | Method for producing a metal-ceramic circuit board with through contacts |
Country Status (1)
Country | Link |
---|---|
DE (2) | DE19945794C2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10007414B4 (en) * | 2000-02-18 | 2006-07-06 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Process for the through-plating of a substrate for power semiconductor modules by solder and substrate produced by the method |
DE10122414A1 (en) * | 2001-05-09 | 2002-11-14 | Giesecke & Devrient Gmbh | Through connection of flexible printed circuit boards |
DE10246576B4 (en) * | 2002-10-05 | 2004-11-04 | Hella Kgaa Hueck & Co. | circuit board |
DE10301682B4 (en) * | 2003-01-17 | 2009-06-10 | Infineon Technologies Ag | Temperature resistant shunt resistor and method of making such a shunt resistor |
DE102012010560B4 (en) * | 2012-05-29 | 2020-07-09 | Mühlbauer Gmbh & Co. Kg | Transponder, method for manufacturing a transponder and device for manufacturing the transponder |
DE102016200062B4 (en) | 2016-01-06 | 2023-08-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for the formation of electrically conductive vias in ceramic circuit carriers |
GB2562770A (en) * | 2017-05-25 | 2018-11-28 | Jaguar Land Rover Ltd | An electrical circuit |
DE102017114891A1 (en) | 2017-07-04 | 2019-01-10 | Rogers Germany Gmbh | Process for producing a via in a carrier layer made of a ceramic and carrier layer with plated through hole |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2889393A (en) * | 1955-08-01 | 1959-06-02 | Hughes Aircraft Co | Connecting means for etched circuitry |
DE1465852A1 (en) * | 1963-07-24 | 1969-03-27 | Licentia Gmbh | Process for the production of metal-clad printed circuit boards |
US3766634A (en) * | 1972-04-20 | 1973-10-23 | Gen Electric | Method of direct bonding metals to non-metallic substrates |
US3744120A (en) * | 1972-04-20 | 1973-07-10 | Gen Electric | Direct bonding of metals with a metal-gas eutectic |
US4319708A (en) * | 1977-02-15 | 1982-03-16 | Lomerson Robert B | Mechanical bonding of surface conductive layers |
DE4318061C2 (en) * | 1993-06-01 | 1998-06-10 | Schulz Harder Juergen | Method of manufacturing a metal-ceramic substrate |
-
1999
- 1999-09-24 DE DE19945794A patent/DE19945794C2/en not_active Expired - Fee Related
-
2000
- 2000-08-24 DE DE50015504T patent/DE50015504D1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE19945794C2 (en) | 2002-12-19 |
DE19945794A1 (en) | 2001-04-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |