DE50015504D1 - Method for producing a printed circuit board and printed circuit board - Google Patents

Method for producing a printed circuit board and printed circuit board

Info

Publication number
DE50015504D1
DE50015504D1 DE50015504T DE50015504T DE50015504D1 DE 50015504 D1 DE50015504 D1 DE 50015504D1 DE 50015504 T DE50015504 T DE 50015504T DE 50015504 T DE50015504 T DE 50015504T DE 50015504 D1 DE50015504 D1 DE 50015504D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
producing
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50015504T
Other languages
German (de)
Inventor
Juergen Dr Ing Schulz-Harder
Andreas Meyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Curamik Electronics GmbH
Original Assignee
Curamik Electronics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics GmbH filed Critical Curamik Electronics GmbH
Application granted granted Critical
Publication of DE50015504D1 publication Critical patent/DE50015504D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE50015504T 1999-09-15 2000-08-24 Method for producing a printed circuit board and printed circuit board Expired - Lifetime DE50015504D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19944102 1999-09-15
DE19945794A DE19945794C2 (en) 1999-09-15 1999-09-24 Method for producing a metal-ceramic circuit board with through contacts

Publications (1)

Publication Number Publication Date
DE50015504D1 true DE50015504D1 (en) 2009-02-12

Family

ID=7922032

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19945794A Expired - Fee Related DE19945794C2 (en) 1999-09-15 1999-09-24 Method for producing a metal-ceramic circuit board with through contacts
DE50015504T Expired - Lifetime DE50015504D1 (en) 1999-09-15 2000-08-24 Method for producing a printed circuit board and printed circuit board

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19945794A Expired - Fee Related DE19945794C2 (en) 1999-09-15 1999-09-24 Method for producing a metal-ceramic circuit board with through contacts

Country Status (1)

Country Link
DE (2) DE19945794C2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10007414B4 (en) * 2000-02-18 2006-07-06 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Process for the through-plating of a substrate for power semiconductor modules by solder and substrate produced by the method
DE10122414A1 (en) * 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Through connection of flexible printed circuit boards
DE10246576B4 (en) * 2002-10-05 2004-11-04 Hella Kgaa Hueck & Co. circuit board
DE10301682B4 (en) * 2003-01-17 2009-06-10 Infineon Technologies Ag Temperature resistant shunt resistor and method of making such a shunt resistor
DE102012010560B4 (en) * 2012-05-29 2020-07-09 Mühlbauer Gmbh & Co. Kg Transponder, method for manufacturing a transponder and device for manufacturing the transponder
DE102016200062B4 (en) 2016-01-06 2023-08-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process for the formation of electrically conductive vias in ceramic circuit carriers
GB2562770A (en) * 2017-05-25 2018-11-28 Jaguar Land Rover Ltd An electrical circuit
DE102017114891A1 (en) 2017-07-04 2019-01-10 Rogers Germany Gmbh Process for producing a via in a carrier layer made of a ceramic and carrier layer with plated through hole

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2889393A (en) * 1955-08-01 1959-06-02 Hughes Aircraft Co Connecting means for etched circuitry
DE1465852A1 (en) * 1963-07-24 1969-03-27 Licentia Gmbh Process for the production of metal-clad printed circuit boards
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
US4319708A (en) * 1977-02-15 1982-03-16 Lomerson Robert B Mechanical bonding of surface conductive layers
DE4318061C2 (en) * 1993-06-01 1998-06-10 Schulz Harder Juergen Method of manufacturing a metal-ceramic substrate

Also Published As

Publication number Publication date
DE19945794C2 (en) 2002-12-19
DE19945794A1 (en) 2001-04-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition