DE4334150A1 - Method for manufacturing complete assemblies - Google Patents

Method for manufacturing complete assemblies

Info

Publication number
DE4334150A1
DE4334150A1 DE4334150A DE4334150A DE4334150A1 DE 4334150 A1 DE4334150 A1 DE 4334150A1 DE 4334150 A DE4334150 A DE 4334150A DE 4334150 A DE4334150 A DE 4334150A DE 4334150 A1 DE4334150 A1 DE 4334150A1
Authority
DE
Germany
Prior art keywords
printed circuit
assembly
complete assemblies
circuit boards
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE4334150A
Other languages
German (de)
Inventor
Dieter Brettschneider
Uwe Siebke
Juergen Staratzke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deutsche Telephonwerke und Kabelindustrie AG
Original Assignee
Deutsche Telephonwerke und Kabelindustrie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Telephonwerke und Kabelindustrie AG filed Critical Deutsche Telephonwerke und Kabelindustrie AG
Priority to DE9321405U priority Critical patent/DE9321405U1/en
Priority to DE4334150A priority patent/DE4334150A1/en
Publication of DE4334150A1 publication Critical patent/DE4334150A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A method for manufacturing complete assemblies in a panel for telecommunications terminals, which consist of printed circuit boards and carrier boards (11), proposes that the printed circuit boards and carrier boards (10, 11) be connected to one another by means of tooth systems (14) and flat ribbon cables (12) (which form a continuous material connection) during the component-placement, soldering and test states. The complete assemblies are separated from the panel, and the printed circuit boards and the carrier boards (10, 11) are subsequently separated at the tooth systems (14), which form material connections, by breaking off, immediately before installation in the terminal. <IMAGE>

Description

Die Erfindung betrifft ein Verfahren zum Fertigen von Komplett- Baugruppen in einem Nutzen für Telekommunikations-Endgeräte.The invention relates to a method for producing complete Modules in one use for telecommunication devices.

Telekommunikations-Endgeräte werden zum großen Teil automatisch zusammengebaut. Hierzu ist eine entsprechende Gestaltung der einzelnen Baugruppen und der Gehäusehälften der Endgeräte erforderlich. Die Baugruppen sind allgemein auf mehreren Leiterplatten angeordnet, die nach dem automatischen Bestücken über ein Schwall-Lötbad geführt werden. Diese Leiterplatten werden in Mehrfachnutzen, vorzugsweise Vierfachnutzen, gefertigt, anschließend geprüft und danach in eine der Gehäusehälften eingesetzt. Hierbei werden die Leiterplatten vorzugsweise in die Gehäusekappe eingebracht. Anschließend wird maschinell die Bodenwanne aufgesetzt und befestigt.Telecommunications end devices are largely automatic assembled. A corresponding design of the individual modules and the housing halves of the end devices required. The assemblies are generally on several Printed circuit boards arranged after automatic assembly over a wave solder bath. These circuit boards will be manufactured in multiple panels, preferably quadruple panels, then checked and then in one of the housing halves used. Here, the circuit boards are preferably in the Housing cap introduced. Then the Floor pan attached and fastened.

Der Erfindung lag die Aufgabe zugrunde, die Fertigung und Prüfung der Telekommunikations-Endgeräte benötigten Baugruppen zu vereinfachen.The object of the invention was to manufacture and test of the telecommunication devices required simplify.

Diese Aufgabe ist durch die Erfindung gelöst, wie sie im Kennzeichnungsteil des ersten Patentanspruches dargelegt ist. Weitere vorteilhafte Maßnahmen sind Gegenstand der Unteransprüche.This object is achieved by the invention, as in Labeling part of the first claim is set out. Further advantageous measures are the subject of the subclaims.

Anhand einer aus zwei Figuren bestehenden Zeichnung wird die Erfindung nachfolgend näher erläutert. Darin zeigen die Using a drawing consisting of two figures, the Invention explained in more detail below. In it show the  

Fig. 1 eine Komplett-Baugruppe eines Gerätes in der Untersicht und die Fig. 1 is a complete assembly of a device in the bottom view and

Fig. 2 die Baugruppe nach Fig. 1 in der Seitensicht. Fig. 2 shows the assembly of FIG. 1 in a side view.

In beiden Figuren tragen dieselben Ausformungen und/oder Bauteile dieselben Bezugszeichen.In both figures, the same formations and / or components are worn the same reference numerals.

Die Komplett-Baugruppe eines Endgerätes gemäß Fig. 1 besteht aus einer Leiterplatte 10 und einer Trägerplatte 11 zur Aufnahme der optischen Anzeigeelemente und eines Freisprechmikrofons. Sie ist Teil eines Vierfachnutzens. Die Leiterplatte 10 und die Trägerplatte 11 sind über ein Flachbandkabel 12 miteinander verknüpft. Beide Platten 10, 11 sind außerdem durch stoffschlüssige Verzahnungen 14 miteinander verbunden.The complete assembly of a terminal according to Fig. 1 consists of a circuit board 10 and a support plate 11 for receiving the optical display elements, and a hands-free microphone. It is part of a quadruple benefit. The printed circuit board 10 and the carrier plate 11 are linked to one another via a ribbon cable 12 . Both plates 10 , 11 are also connected to one another by integral toothings 14 .

Auf die Trägerplatte 11 ist eine Abstands- und Montagehilfe 15 für eine Flüssigkristallanzeige 13 gesetzt. Damit kann die komplette Baugruppe 10, 11 eines Endgerätes über das Schwall-Lötbad geführt werden, ohne Beschädigung der Flüssigkristallanzeige 13.A spacing and assembly aid 15 for a liquid crystal display 13 is placed on the carrier plate 11 . The complete assembly 10 , 11 of a terminal can thus be guided over the wave solder bath without damaging the liquid crystal display 13 .

Nach dem Bestücken und Schwall-Löten werden die Leiter- und die Trägerplatte 10, 11 im Nutzen automatisch geprüft. Anschließend wird die Trägerplatte 11 von der Leiterplatte 10 an den stoffschlüssigen Verzahnungen 14 abgebrochen und die Leiterplatte 10 und zu dieser die Trägerplatte 11 um 90° versetzt in die Gehäusekappe des Endgerätes montiert.After assembly and wave soldering, the printed circuit board and the carrier plate 10 , 11 are automatically checked in use. Subsequently, the carrier plate 11 is broken off from the printed circuit board 10 at the integral toothings 14 and the printed circuit board 10 and to this the carrier plate 11 are mounted offset by 90 ° in the housing cap of the terminal.

Claims (2)

1. Verfahren zum Fertigen von Komplett-Baugruppen in einem Nutzen für Telekommunikations-Endgeräte, dadurch gekennzeichnet, daß die Komplett-Baugruppe aus einer Leiterplatte (10) und einer Trägerplatte (11) besteht, die während des Bestückungs-, Löt- und Prüfzustandes durch stoffschlüssige Verzahnungen (14) und einem Flachbandkabel (12) miteinander verbunden sind, und die unmittelbar vor der Montage im Endgerät aus dem Nutzen und anschließend an der stoffschlüssigen Verzahnung (14) durch Abbrechen getrennt werden.1. A method for manufacturing complete assemblies in a use for telecommunications terminals, characterized in that the complete assembly consists of a printed circuit board ( 10 ) and a carrier plate ( 11 ), which during the assembly, soldering and testing condition integral toothings ( 14 ) and a ribbon cable ( 12 ) are connected to one another, and are separated from the panel immediately before assembly in the terminal and then by breaking off at the integral toothing ( 14 ). 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Trägerplatte (11) Abstands- und Montagehilfen (15) zur Aufnahme einer Flüssigkristallanzeige (13) trägt.2. The method according to claim 1, characterized in that the carrier plate ( 11 ) carries spacing and assembly aids ( 15 ) for receiving a liquid crystal display ( 13 ).
DE4334150A 1993-10-02 1993-10-02 Method for manufacturing complete assemblies Ceased DE4334150A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE9321405U DE9321405U1 (en) 1993-10-02 1993-10-02 Complete assemblies
DE4334150A DE4334150A1 (en) 1993-10-02 1993-10-02 Method for manufacturing complete assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4334150A DE4334150A1 (en) 1993-10-02 1993-10-02 Method for manufacturing complete assemblies

Publications (1)

Publication Number Publication Date
DE4334150A1 true DE4334150A1 (en) 1995-04-06

Family

ID=6499591

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4334150A Ceased DE4334150A1 (en) 1993-10-02 1993-10-02 Method for manufacturing complete assemblies

Country Status (1)

Country Link
DE (1) DE4334150A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0735622A2 (en) * 1995-03-30 1996-10-02 SUMITOMO WIRING SYSTEMS, Ltd. Connecting structure for connecting connector terminal unit with wiring board, and assembling method thereof
EP2416631A1 (en) * 2010-08-05 2012-02-08 Indesit Company S.p.A. Electrical household appliance comprising means for displaying an item of information

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1129194B (en) * 1960-09-29 1962-05-10 Siemens Ag Process for the production of an assembly of several circuit boards lying in different levels for telecommunication, in particular telephone systems, and insulating film for this
DE1880761U (en) * 1963-01-26 1963-10-17 Telefunken Patent DEVICE FOR CONNECTING CABLE TRAINS FROM PRINTED CIRCUIT BOARDS.
DE1907447U (en) * 1963-06-29 1964-12-31 Blaupunkt Werke Gmbh ELECTRIC COMMUNICATION DEVICE WITH A SUPPORT PLATE WITH FLAT CABLE GUARDS.
DE7628366U1 (en) * 1976-09-10 1977-03-24 Norddeutsche Mende Rundfunk Kg, 2800 Bremen CIRCUIT BOARD BASE PLATE
DE3105488A1 (en) * 1981-02-14 1982-12-30 Brown, Boveri & Cie Ag, 6800 Mannheim Electrical multiple connection of a circuit arrangement which is constructed on a plurality of printed-circuit boards located at an angle with respect to one another
US4742183A (en) * 1986-10-24 1988-05-03 Napco Security Systems, Inc. Methods and techniques for fabricating foldable printed circuit boards
DE9109166U1 (en) * 1991-07-25 1991-09-19 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig holländ. Stiftung & Co KG, 8510 Fürth Device for attaching an LC display to a circuit board
FR2663493A1 (en) * 1990-06-19 1991-12-20 Alcatel Business Systems Alphanumeric display support device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1129194B (en) * 1960-09-29 1962-05-10 Siemens Ag Process for the production of an assembly of several circuit boards lying in different levels for telecommunication, in particular telephone systems, and insulating film for this
DE1880761U (en) * 1963-01-26 1963-10-17 Telefunken Patent DEVICE FOR CONNECTING CABLE TRAINS FROM PRINTED CIRCUIT BOARDS.
DE1907447U (en) * 1963-06-29 1964-12-31 Blaupunkt Werke Gmbh ELECTRIC COMMUNICATION DEVICE WITH A SUPPORT PLATE WITH FLAT CABLE GUARDS.
DE7628366U1 (en) * 1976-09-10 1977-03-24 Norddeutsche Mende Rundfunk Kg, 2800 Bremen CIRCUIT BOARD BASE PLATE
DE3105488A1 (en) * 1981-02-14 1982-12-30 Brown, Boveri & Cie Ag, 6800 Mannheim Electrical multiple connection of a circuit arrangement which is constructed on a plurality of printed-circuit boards located at an angle with respect to one another
US4742183A (en) * 1986-10-24 1988-05-03 Napco Security Systems, Inc. Methods and techniques for fabricating foldable printed circuit boards
FR2663493A1 (en) * 1990-06-19 1991-12-20 Alcatel Business Systems Alphanumeric display support device
DE9109166U1 (en) * 1991-07-25 1991-09-19 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig holländ. Stiftung & Co KG, 8510 Fürth Device for attaching an LC display to a circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0735622A2 (en) * 1995-03-30 1996-10-02 SUMITOMO WIRING SYSTEMS, Ltd. Connecting structure for connecting connector terminal unit with wiring board, and assembling method thereof
EP0735622A3 (en) * 1995-03-30 2000-03-08 SUMITOMO WIRING SYSTEMS, Ltd. Connecting structure for connecting connector terminal unit with wiring board, and assembling method thereof
EP2416631A1 (en) * 2010-08-05 2012-02-08 Indesit Company S.p.A. Electrical household appliance comprising means for displaying an item of information
EP3018982A1 (en) * 2010-08-05 2016-05-11 Indesit Company S.p.A. Electrical household appliance comprising means for displaying an item of information

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8110 Request for examination paragraph 44
8131 Rejection