DE4211355A1 - Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal - Google Patents

Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal

Info

Publication number
DE4211355A1
DE4211355A1 DE4211355A DE4211355A DE4211355A1 DE 4211355 A1 DE4211355 A1 DE 4211355A1 DE 4211355 A DE4211355 A DE 4211355A DE 4211355 A DE4211355 A DE 4211355A DE 4211355 A1 DE4211355 A1 DE 4211355A1
Authority
DE
Germany
Prior art keywords
circuit board
component
adhesive
circuit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4211355A
Other languages
German (de)
Inventor
John Rowe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deutsche Thomson Brandt GmbH
Original Assignee
Deutsche Thomson Brandt GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Thomson Brandt GmbH filed Critical Deutsche Thomson Brandt GmbH
Priority to DE4211355A priority Critical patent/DE4211355A1/en
Publication of DE4211355A1 publication Critical patent/DE4211355A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The component mounting system uses an adhesive (13) to attach the component (16) to the surface of the board (11). The adhesive is inserted between the underside of the circuit component and a section (12) of the circuit board attached to the remainder via a rupture line allowing its easy removal. The component can be removed for replacement by removing the circuit board section to which the adhesive is attached, with simultaneous separation of the electrical connections. ADVANTAGE - Allows replacement of plastic leaded chip carrier integrated circuit mounted on circuit board.

Description

Das folgende betrifft ein Verfahren zur Montage eines Bauele­ mentes auf eine Platine gemäß dem Oberbegriff des Anspruchs 1 sowie eine geeignete Platine gemäß dem Oberbegriff des ersten Sachanspruchs.The following relates to a method for assembling a component mentes on a circuit board according to the preamble of claim 1 and a suitable board according to the preamble of the first Property claim.

Bei der Montage von Bauelementen, wie beispielsweise inte­ grierten Schaltungen, Transistoren, oder dergleichen, werden bei bekannten Verfahren diese Bauelemente zunächst mittels eines Klebestoffes mit der Platine verbunden. Dieses derart verbundene Bauelement kann weiterhin durch bekannte Lötverfah­ ren, beispielsweise von Hand oder in einem Lötbad, mit der Platine endgültig verbunden werden und so können auch elektri­ sche Verbindungen hergestellt werden.When assembling components such as inte ized circuits, transistors, or the like in known methods, these components are first of all by means of an adhesive bonded to the circuit board. This way connected component can continue by known soldering ren, for example by hand or in a solder bath, with the Circuit board are finally connected and so electri connections are established.

Bei den bekannten Verfahren ist es jedoch schwierig, das einmal montierte Bauelement wieder zu entfernen. Dieses kann beispielsweise notwendig sein während des Fertigungsprozes­ ses, wenn sich beispielsweise herausstellt hat, daß es sich um eine Fehlbestückung handelt, oder aber in einem späteren Reparaturfall.In the known methods, however, it is difficult to once the component has been removed. This can for example, may be necessary during the manufacturing process when, for example, it turns out to be is a misplacement, or in a later one Repair case.

Es ist die Aufgabe der vorliegenden Erfindung, ein Verfahren und eine Platine vorzustellen, die einen einfachen Austausch eines montierten Bauelementes ermöglichen.It is the object of the present invention, a method and introduce a circuit board that is easy to replace enable an assembled component.

Diese Aufgabe wird gelöst durch ein Verfahren gemäß Anspruch 1 sowie durch eine Platine gemäß dem ersten Sachanspruch.This object is achieved by a method according to claim 1 and by a circuit board according to the first claim.

Erfindungsgemäß wird ein Bauelement, wie beispielsweise ein elektrisches Bauelement, das auf eine Platine montiert werden soll, mit einem Kleber derart verbunden, daß der Kleber auf einen Teil der Platine einwirkt, der mittels einer Sollbruch­ stelle mit dem Rest der Platine verbunden ist und daher leicht entfernt werden kann.According to the invention, a component, such as a electrical component to be mounted on a circuit board should be connected with an adhesive such that the adhesive on a part of the board acts by means of a predetermined breaking  place connected to the rest of the board and therefore can be easily removed.

Diese Sollbruchstellen können dabei durch geeignete geometri­ sche Strukturen, beispielsweise in Form von Brücken, oder durch materialtechnische Veränderungen vorgenommen werden.These predetermined breaking points can by suitable geometri cal structures, for example in the form of bridges, or due to changes in the material.

Bei der Demontage von integrierten Schaltungen (IC), wie den sogenannten Plastic Leaded Chip Carrier ICs (PLCC IC), tritt das Problem auf, daß die mit Klebstoff versehenen Stellen durch elektrische Anschlüsse verdeckt sind. Soll die Klebever­ bindung zwischen dem IC und der Platine gelöst werden, so ist bei herkömmlichen Systemen eine starke thermische und/oder mechanische Beanspruchung für den Baustein und die Platine erforderlich.When disassembling integrated circuits (IC), such as the so-called plastic leaded chip carrier ICs (PLCC IC) the problem that the glued areas are covered by electrical connections. Should the adhesive bond between the IC and the board are loosened in conventional systems a strong thermal and / or mechanical stress for the module and the circuit board required.

Somit hat die Erfindung insbesondere bei der Demontage von integrierten Schaltungen erhebliche Vorteile.Thus, the invention has particular in the disassembly of integrated circuits have significant advantages.

Bei einer Ausgestaltung der Erfindung ist vorgesehen, daß das Bauelement durch den Kleber nicht direkt mit der Platine verbunden ist, sondern mit Mitteln, die mit der Platine ver­ bunden sind. In diesem Fall sind diese Mittel mittels Soll­ bruchstellen mit der Platine verbunden.In one embodiment of the invention it is provided that Component through the adhesive not directly with the circuit board is connected, but with means that ver are bound. In this case, these funds are target breakages connected to the circuit board.

Weitere Merkmale, Vorteile und Einzelheiten der Erfindung werden im Folgenden anhand eines Ausführungsbeispieles erläu­ tert. Dabei zeigen:Further features, advantages and details of the invention are explained below using an exemplary embodiment tert. Show:

Fig. 1 eine Seitenansicht eines auf einer Platine befestig­ ten Bauelementes gemäß einem ersten Ausführungsbei spiel; Fig. 1 is a side view of a befestig th on a board game device according to a first Ausführungsbei;

Fig. 2 eine Draufsicht auf die Platine nach Fig. 1; Fig. 2 is a plan view of the board of Fig. 1;

Fig. 3 ein zweites Ausführungsbeispiel. Fig. 3 shows a second embodiment.

Fig. 1 zeigt ein Bauelement 10, das auf einer Platine 11 montiert ist. Diese weist ein Feld 12 auf, auf dem ein Kleber 13 aufgebracht ist, der das Bauelement 10 mit dem Feld 12 verbindet. Weiterhin sind elektrische Anschlüsse 14 vorgese­ hen, über die das Bauelement 10 elektrisch an Leiterbahnen der Platine 11 angeschlossen ist. Fig. 1 shows a component 10 which is mounted on a board 11. This has a field 12 on which an adhesive 13 is applied, which connects the component 10 to the field 12 . Furthermore, electrical connections 14 are provided, via which the component 10 is electrically connected to conductor tracks of the circuit board 11 .

Fig. 2 zeigt eine Draufsicht auf die Platine 11. Es ist ersichtlich, daß das Feld 12 mittels Sollbruchstellen 15 mit dem Rest der Platine 11 verbunden ist. In diesem Ausführungs­ beispiel sind die Sollbruchstellen 15 durch mechanische Form­ gebung derart gestaltet, daß nur einzelne Brücken ausgebildet sind. Fig. 2 shows a plan view of the board 11. It can be seen that the field 12 is connected to the rest of the circuit board 11 by means of predetermined breaking points 15 . In this embodiment, the predetermined breaking points 15 are designed by mechanical shaping such that only individual bridges are formed.

Denkbar ist weiterhin eine Ausgestaltung der Sollbruchstellen derart, daß zusätzlich oder stattdessenAn embodiment of the predetermined breaking points is also conceivable such that in addition or instead

  • - die Verbindungen zwischen der Platine 11 und dem Feld 12 dünner gestaltet sind als die Platine 11;- The connections between the board 11 and the field 12 are made thinner than the board 11 ;
  • - für die Sollbruchstellen ein derartiges Material verwen­ det wird, daß das Feld 12 von der Platine 11 leicht entfernt werden kann;- For the predetermined breaking points such a material is used that the field 12 can be easily removed from the circuit board 11 ;
  • - das Feld 12 an sich durch geometrische und/oder material­ technische Maßnahmen derart gestaltet ist, daß derjenige Teil, auf den der Kleber 13 einwirkt, leicht entfernt werden kann.- The field 12 is designed by geometric and / or material-technical measures such that the part on which the adhesive 13 acts can be easily removed.

Dadurch ist es möglich, daß zu einem Zeitpunkt, nachdem das elektronische Element 10 durch den Kleber 13 mit dem Feld 12 verbunden wurde, das Bauelement 10 auf einfache Weise von der Platine 11 wieder entfernt werden kann. Während des Ferti­ gungsprozesses, in dem die elektrischen Verbindungen 14 noch nicht hergestellt worden sind, braucht lediglich das Feld 12 von dem Rest der Platine 11 entfernt zu werden, wodurch auch das Bauelement 10 entfernt wird. This makes it possible for the component 10 to be easily removed from the circuit board 11 at a point in time after the electronic element 10 has been connected to the field 12 by the adhesive 13 . During the manufacturing process, in which the electrical connections 14 have not yet been made, only the field 12 needs to be removed from the rest of the circuit board 11 , as a result of which the component 10 is also removed.

Sollte zu einem späteren Zeitpunkt, beispielsweise bei einem Reparaturfall, ein Austausch des Bauelementes 10 erforderlich sein, so ist das Feld 12 von der Platine 11 zu entfernen und die elektrischen Verbindungen 15 zu lösen. Es entfällt damit die Notwendigkeit, sowohl auf den Kleber 13 als auch auf die Lötstellen 15 gleichzeitig Wärme einwirken zu lassen. Dadurch kann die thermische Beanspruchung sowohl des elektrischen Bauelementes 10 als auch der Platine 11 vermindert werden.If replacement of the component 10 is necessary at a later point in time, for example in the event of a repair, the field 12 must be removed from the circuit board 11 and the electrical connections 15 must be disconnected. This eliminates the need to let heat act on both the adhesive 13 and the solder joints 15 at the same time. As a result, the thermal stress on both the electrical component 10 and the circuit board 11 can be reduced.

Ergänzend sei erwähnt, daß die Platine 11 derart gestaltet sein kann, daß mehr als ein Bauelement darauf montiert werden kann. Diese können verschiedener Art sein und beispielsweise ausgebildet sein alsIn addition, it should be mentioned that the circuit board 11 can be designed such that more than one component can be mounted on it. These can be of different types and, for example, be designed as

  • - elektrisches Bauelement, wie integrierte Schaltung, Transistor oder dergleichen,- electrical component, such as integrated circuit, Transistor or the like,
  • - optisches Bauelement, wie Sende- oder Empfangsdiode,- optical component, such as transmitting or receiving diode,
  • - mechanisches Element, wie Sensoren.- mechanical element, such as sensors.

Bei einem weiteren Ausführungsbeispiel gemäß Fig. 3 wird nicht das Bauelement 10 mit der Platine 11 bzw. mit dem Feld 12 verbunden, sondern es sind Mittel 16 vorgesehen, die mit der Platine 11 verbunden sind und in den Seitenbereich des Bauelementes 10 hineinragen. Zwischen den Mitteln 16 und dem Bauelement 10 wird Kleber 13 aufgetragen, wodurch eine Monta­ ge des Bauelementes 10 auf der Platine 11 bewirkt wird. Das Mittel 16 weist eine Sollbruchstelle 15′ auf, wodurch die Klebeverbindung zwischen dem Bauelement 10 und der Platine 11 einfach gelöst werden kann.In a further exemplary embodiment according to FIG. 3, the component 10 is not connected to the circuit board 11 or to the field 12 , but means 16 are provided which are connected to the circuit board 11 and protrude into the side region of the component 10 . Adhesive 13 is applied between the means 16 and the component 10 , whereby a mounting of the component 10 on the circuit board 11 is effected. The means 16 has a predetermined breaking point 15 ', whereby the adhesive connection between the component 10 and the circuit board 11 can be easily released.

Bei weiteren Ausgestaltungen dieses Ausführungsbeispieles kann das Mittel 16 auch in den Bereich der Oberfläche des Bauelementes hineinragen und es kann dort eine entsprechende Klebestelle realisiert werden.In further refinements of this exemplary embodiment, the means 16 can also protrude into the area of the surface of the component and a corresponding adhesive point can be realized there.

Claims (3)

1. Verfahren zur Montage eines Bauelementes auf einer Plati­ ne, wobei es durch einen Kleber mit der Platine befe­ stigt wird, dadurch gekenn­ zeichnet, daß der Kleber auf Mittel einwirkt, die mit der Platine verbunden sind und leicht von ihr ent­ fernt werden können.1. A method for mounting a component on a Plati ne, wherein it is BEFE Stigt by an adhesive with the board, characterized in that the adhesive acts on agents that are connected to the board and can be easily removed by it ent. 2. Platine (11), auf die mindestens ein Bauelement (10) montierbar ist, das durch einen Kleber (13) mit der Platine befestigt wird, dadurch gekennzeichnet, daß
  • - Mittel (12 bzw. 16) vorgesehen sind, die Teil der Platine oder mit dieser verbunden sind und auf die der Kleber derart einwirkt, daß das Bauelement (10) mit Platine verbunden ist und daß
  • - diese Mittel (12 bzw. 16) mittels Sollbruchstellen (15 bzw. 15′) mit der Platine verbunden sind.
2. Circuit board ( 11 ) on which at least one component ( 10 ) can be mounted, which is fastened to the circuit board by an adhesive ( 13 ), characterized in that
  • - Means ( 12 and 16 ) are provided, which are part of the board or connected to it and on which the adhesive acts in such a way that the component ( 10 ) is connected to the board and that
  • - These means ( 12 or 16 ) are connected to the circuit board by means of predetermined breaking points ( 15 or 15 ').
3. Platine nach Anspruch 2, dadurch gekenn­ zeichnet, daß die Sollbruchstellen (15 bzw. 15′) gestaltet sind aufgrund von geometrischen Abmessungen und/oder materialtechnischen Eigenschaften.3. Board according to claim 2, characterized in that the predetermined breaking points ( 15 and 15 ') are designed based on geometric dimensions and / or material properties.
DE4211355A 1992-04-04 1992-04-04 Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal Withdrawn DE4211355A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4211355A DE4211355A1 (en) 1992-04-04 1992-04-04 Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4211355A DE4211355A1 (en) 1992-04-04 1992-04-04 Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal

Publications (1)

Publication Number Publication Date
DE4211355A1 true DE4211355A1 (en) 1993-10-07

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DE4211355A Withdrawn DE4211355A1 (en) 1992-04-04 1992-04-04 Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704515A (en) * 1969-12-10 1972-12-05 Burroughs Corp Method for mounting connectors on printed circuit boards
DE2432812A1 (en) * 1973-07-10 1975-01-30 Lucas Aerospace Ltd METHOD OF FASTENING AN ELECTRONIC COMPONENT TO A SUBSTRATE
GB1419193A (en) * 1972-06-30 1975-12-24 Ibm Hybrid circuit panel
DE3104623A1 (en) * 1981-02-10 1982-08-26 Robert Bosch Gmbh, 7000 Stuttgart METHOD FOR FASTENING COMPONENTS WITH FLAT CONNECTORS AND COMPONENT HERE
DD272956A1 (en) * 1988-06-10 1989-10-25 Robotron Elektronik ARRANGEMENT AND METHOD FOR FASTENING CIRCUITS ACCORDING TO THE HUCKEPACK PRINCIPLE
DE4004997A1 (en) * 1990-02-19 1991-08-22 Robotron Veb K Design and production of armature connectors - using parallel U=shaped elements with etched notch to improve performance

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704515A (en) * 1969-12-10 1972-12-05 Burroughs Corp Method for mounting connectors on printed circuit boards
GB1419193A (en) * 1972-06-30 1975-12-24 Ibm Hybrid circuit panel
DE2432812A1 (en) * 1973-07-10 1975-01-30 Lucas Aerospace Ltd METHOD OF FASTENING AN ELECTRONIC COMPONENT TO A SUBSTRATE
DE3104623A1 (en) * 1981-02-10 1982-08-26 Robert Bosch Gmbh, 7000 Stuttgart METHOD FOR FASTENING COMPONENTS WITH FLAT CONNECTORS AND COMPONENT HERE
DD272956A1 (en) * 1988-06-10 1989-10-25 Robotron Elektronik ARRANGEMENT AND METHOD FOR FASTENING CIRCUITS ACCORDING TO THE HUCKEPACK PRINCIPLE
DE4004997A1 (en) * 1990-02-19 1991-08-22 Robotron Veb K Design and production of armature connectors - using parallel U=shaped elements with etched notch to improve performance

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SCHMITTER, Detlev: MIKROPACK Oberflächenmontage ohne Kompromisse. In: Siemens Components 24, H.6, 1986, S.225-229 *

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