DE3929701A1 - Pluggable module with circuit board - has cooler with pin(s), orthogonally slidable w.r.t. circuit board, with transverse threshold bore - Google Patents

Pluggable module with circuit board - has cooler with pin(s), orthogonally slidable w.r.t. circuit board, with transverse threshold bore

Info

Publication number
DE3929701A1
DE3929701A1 DE19893929701 DE3929701A DE3929701A1 DE 3929701 A1 DE3929701 A1 DE 3929701A1 DE 19893929701 DE19893929701 DE 19893929701 DE 3929701 A DE3929701 A DE 3929701A DE 3929701 A1 DE3929701 A1 DE 3929701A1
Authority
DE
Germany
Prior art keywords
circuit board
cooler
cooling plate
pin
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19893929701
Other languages
German (de)
Inventor
Felipe Dipl Ing Labucay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Standard Elektrik Lorenz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Elektrik Lorenz AG filed Critical Standard Elektrik Lorenz AG
Priority to DE19893929701 priority Critical patent/DE3929701A1/en
Publication of DE3929701A1 publication Critical patent/DE3929701A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The pluggable component module has at least one electric component on a circuit board, the component generating a heat and in thermal contact with a cooler. The latter is coupled to a cooling plate at its front side. At least one pin (10), slidable vertically w.r.t. the circuit board, is fitted in the cooler (3). The pin has a threaded bore (11), extending transversely to its axis. A screw (9), protruding from outside through the cooling plate (7), engages the threaded bore. The heat generating component (2) is pref. an integrated circuit, and the thermal contact is provided by a member (4) contacting both the circuit: surface and its retainer in the cooler. ADVANTAGE - Adjustable coupling between cooler cooling plate.

Description

Die Erfindung betrifft eine steckbare Baugruppe nach dem Oberbegriff des Anspruchs.The invention relates to a plug-in module according to the Preamble of the claim.

Eine derartige Baugruppe ist aus dem DE-GM 81 08 938 bekannt. Bei dieser Baugruppe sind auf einer Leiterplatte wärmeerzeugende, elektrische Bauelemente angeordnet, deren Oberseiten mit einem Kühlkörper oder Wärmeleitstab in Berührung stehen. Der oder die Wärmeleitstäbe liegen parallel zur Leiterplatte und führen zu einer mit Kühlrippen versehenen Kühlplatte, mit der sie verbunden sind. Diese Kühlplatte schließt die Baugruppe an einer Stirnseite ab, während der übrige Teil von einem abschirmenden Gehäuse umgeben ist.Such an assembly is from DE-GM 81 08 938 known. This assembly is on a circuit board arranged heat-generating, electrical components, their tops with a heat sink or heat sink to be in contact. The or the heat conducting rods are parallel to the circuit board and lead to one Cooling fins provided cooling plate with which they are connected are. This cooling plate connects the assembly to one End face, while the rest of one shielding housing is surrounded.

Eine ähnliche Baugruppe ist auch aus der DE-OS 17 66 395 bekannt, wobei das elektrische Bauelement allerdings direkt an dem Kühlkörper (Kontaktkühler) befestigt ist und nur mit seinen Anschlüssen mit der Leiterplatte in Verbindung steht. Der Kühlkörper ist mit einer stirnseitigen Platte mit Kühlrippen verschraubt.A similar assembly is also from DE-OS 17 66 395 known, but the electrical component is directly attached to the heat sink (contact cooler) and only with its connections with the circuit board in Connection is established. The heat sink is with one front plate screwed with cooling fins.

Der Erfindung liegt die Aufgabe zugrunde, die Verbindung zwischen Kühlkörper und stirnseitiger Kühlplatte verstellbar zu machen, um den Abstand von der Leiterplatte zum Rand der Kühlplatte justieren zu können. Gelöst wird diese Aufgabe durch die im Anspruch angegebenen Merkmale. Die Lösung hat den Vorteil, daß nach Lockern der Schraube(n) in der Kühlplatte die gewünschte Einstellung vorgenommen werden kann, die nach dem Festdrehen der Schraube(n) fixiert ist. Der genannte Abstand ist insofern wichtig, als die Leiterplatte in Führungsschienen beispielsweise eines Baugruppenträgers geführt wird und die Kühlplatte mit benachbarten Steckbaugruppen nicht kollidieren darf.The invention has for its object the connection between the heat sink and the front cooling plate adjustable to make the distance from the To be able to adjust the circuit board to the edge of the cooling plate. This task is solved by the claim specified characteristics. The solution has the advantage that after loosening the screw (s) in the cooling plate desired setting can be made after the screw (s) is tightened. The named Distance is important in that the PCB in Guide rails of a subrack, for example is performed and the cooling plate with neighboring Plug-in modules must not collide.

Die Erfindung wird an einem Ausführungsbeispiel beschrieben, das in der zugehörigen Zeichnung dargestellt ist. Die Figur zeigt einen Teil einer steckbaren Leiterplatten-Baugruppe mit einem Wärme erzeugenden, elektrischen Bauelement und einem Kühlkörper, der mit einer stirnseitigen Kühlplatte verbunden ist, in Draufsicht, teilweise geschnitten.The invention is based on an embodiment described, which is shown in the accompanying drawing is. The figure shows part of a pluggable PCB assembly with a heat-generating, electrical component and a heat sink with an end face cooling plate is connected in Top view, partially cut.

Auf der Leiterplatte 1 der Baugruppe nach der Figur ist ein elektrisches Bauelement 2, z. B. ein integrierter Schaltkreis, aufgelötet, dessen abgegebene Wärme über einen Kühlkörper 3 abgeleitet wird. Der Wärmekontakt erfolgt mittels eines geeigneten Bauteils 4, das einerseits die Oberfläche des Bauelementes 2 berührt und andererseits im Kühlkörper 3 derart gehaltert ist, daß ein guter Wärmeübergang gewährleistet ist. Diesen Zweck erfüllt beispielsweise ein halbkugelförmiges Bauteil 4, das in einer kalottenartigen Vertiefung des Kühlkörpers 3 ruht. On the circuit board 1 of the assembly according to the figure, an electrical component 2 , for. B. an integrated circuit, soldered, the emitted heat is dissipated via a heat sink 3 . The heat contact takes place by means of a suitable component 4 , which on the one hand touches the surface of the component 2 and on the other hand is held in the heat sink 3 in such a way that good heat transfer is ensured. This purpose is fulfilled, for example, by a hemispherical component 4 , which rests in a dome-like recess in the heat sink 3 .

Die Verbindung zwischen dem Kühlkörper 3, der von einer relativ dicken Platte oder einem Block aus gut wärmeleitendem Material gebildet wird, und der Leiterplatte 1 erfolgt mittels Schrauben 5. Zwischen Kühlkörper und Leiterplatte sind entsprechend der Höhe des Bauelementes 2 Distanzstücke 6 eingefügt, die z. B. von Nietmuttern gebildet werden können, die an der Leiterplatte 1 befestigt sind. Die Schrauben 5 sind dann von der Kühlkörperseite eingedreht. Sie können jedoch auch von der Leiterplattenseite eingesetzt werden, sofern die Nietmuttern am Kühlkörper 3 befestigt sind und der Schraubenkopf innerhalb der zulässigen Höhe auf der Lötseite bleibt.The connection between the heat sink 3 , which is formed by a relatively thick plate or a block of good heat-conducting material, and the printed circuit board 1 is made by means of screws 5 . Between the heat sink and circuit board 2 spacers 6 are inserted according to the height of the component, the z. B. can be formed by rivet nuts which are attached to the circuit board 1 . The screws 5 are then screwed in from the heat sink side. However, they can also be used from the circuit board side, provided the rivet nuts are attached to the heat sink 3 and the screw head remains on the soldering side within the permissible height.

Der Kühlkörper 3 ist an einer Seite mit einer Kühlplatte 7 verschraubt, die einen stirnseitigen Abschluß der Baugruppe darstellt. Die Kühlplatte steht rechtwinklig zur Leiterplatte 1 und trägt auf der Außenseite vertikale Kühlrippen 8 zur Wärmeabführung an die umgebende Luft. Auf der Innenseite sind dicht bei den Rändern Nute 13 eingelassen, in die ein nicht dargestelltes Gehäuse eingreifen kann. Die Verbindung mit dem Kühlkörper 3 stellen Schrauben 9 her, die von der Außenseite zwischen den Kühlrippen die Kühlplatte 7 durchsetzen und im Kühlkörper auf einen Stift 10 treffen, der quer zur Schraubenachse in eine Durchgangsbohrung des Kühlkörpers gesteckt ist. Der Stift 10 kann darin verschoben und gedreht werden. Er weist eine quer zu seiner Achse liegende Gewindebohrung 11 auf, in die die Schraube 9 eingedreht wird. Die Durchgangsbohrung 12 von der Außenseite des Kühlkörpers bis zum Stift ist reichlich bemessen, so daß sich Kühlplatte 7, Schraube 9 und Stift 10 in begrenztem Bereich relativ zu Kühlkörper 3 und Leiterplatte 1 verschieben lassen. So ist es möglich, nach Lockern der Schraube 9 das Maß A, d. h. den Abstand der Leiterplatte 1 vom Rand bzw. von der Nut 13 der Kühlplatte, genau einzustellen, und die Teile hernach durch Festdrehen der Schraube zu fixieren. Die Zahl der Verschraubungen zwischen Kühlplatte 7 und Kühlkörper 3 hängt von der Größe der Baugruppe und ihrer Gestaltung ab. Wenn mehrere Bauelemente 2 unter einem größeren Kühlkörper 3 zusammengefaßt sind, so wird es in der Regel ausreichen, diesen durch zwei Schrauben 9 mit der Kühlplatte 7 zu verschrauben. Sind mehrere wärmeerzeugende Bauelemente 2 in relativ großen Abständen voneinander auf der Leiterplatte 1 angebracht, so empfiehlt es sich, für jedes Bauelement eine separate Wärmebrücke mittels eines Kühlkörpers 3 zur Kühlplatte 7 einzurichten. Jeder Kühlkörper ist in der oben beschriebenen Weise mit mindestens einem Befestigungssatz (Stift 10 und Schraube 9) justierbar mit der Kühlplatte verbunden. Meist werden zwei Befestigungssätze dafür verwendet. Durch die individuelle Verstellbarkeit werden Summentoleranzen, die aus unterschiedlichen Dicken der Bauelemente 2, der Unterlegplättchen zwischen Bauelement und Leiterplatte 1, des (Halbkugel-)Bauteils 4, ferner aus Lagetoleranzen der Bohrungen in der Kühlplatte 7 und in dem Kühlkörper, etc. resultieren, sowie auch etwaige lokale Krümmungen der Leiterplatte ausgeglichen. Somit kann auch bei mehreren zu kühlenden Bauelementen ein eindeutiger Parallelabstand A zwischen Leiterplatte 1 und Nut 13 für die Gehäuseteile eingehalten werden.The heat sink 3 is screwed on one side to a cooling plate 7 , which represents a front end of the assembly. The cooling plate is at right angles to the circuit board 1 and has vertical cooling fins 8 on the outside for heat dissipation to the surrounding air. On the inside, grooves 13 are embedded close to the edges, into which a housing, not shown, can engage. The connection to the heat sink 3 is produced by screws 9 which penetrate the cooling plate 7 from the outside between the cooling fins and meet in the heat sink a pin 10 which is inserted transversely to the screw axis into a through hole in the heat sink. The pin 10 can be moved and rotated therein. It has a threaded bore 11 lying transversely to its axis, into which the screw 9 is screwed. The through hole 12 from the outside of the heat sink to the pin is sufficiently large, so that the cooling plate 7 , screw 9 and pin 10 can be moved relative to the heat sink 3 and circuit board 1 in a limited area. It is thus possible, after loosening the screw 9, to set the dimension A precisely, ie the distance of the circuit board 1 from the edge or from the groove 13 of the cooling plate, and then to fix the parts by tightening the screw. The number of screw connections between the cooling plate 7 and the heat sink 3 depends on the size of the assembly and its design. If several components 2 are combined under a larger heat sink 3 , it will generally suffice to screw this to the cooling plate 7 by means of two screws 9 . If several heat-generating components 2 are mounted on the circuit board 1 at relatively large distances from one another, it is advisable to set up a separate thermal bridge for each component by means of a heat sink 3 to the cooling plate 7 . Each heat sink is adjustably connected to the cooling plate in the manner described above with at least one fastening set (pin 10 and screw 9 ). Usually two mounting kits are used for this. Due to the individual adjustability, total tolerances resulting from different thicknesses of the components 2 , the washers between the component and the printed circuit board 1 , the (hemisphere) component 4 , furthermore from positional tolerances of the bores in the cooling plate 7 and in the cooling body, etc., as well also compensated for any local curvature of the circuit board. A clear parallel spacing A between circuit board 1 and groove 13 for the housing parts can thus be maintained even with several components to be cooled.

Claims (1)

Steckbare Baugruppe mit einer Leiterplatte und wenigstens einem auf der Leiterplatte angebrachten, wärmeerzeugenden elektrischen Bauelement, das mit einem Kühlkörper in wärmeleitendem Kontakt steht, wobei der Kühlkörper mit einer stirnseitig angeordneten Kühlplatte verbunden ist, dadurch gekennzeichnet, daß mindestens ein senkrecht zur Leiterplatte (1) verschiebbarer Stift (10) im Kühlkörper (3) angeordnet ist, der eine quer zu seiner Achse verlaufende Gewindebohrung (11) aufweist, in welche eine von außen die Kühlplatte (7) durchsetzende Schraube (9) eingedreht ist.Pluggable assembly with a circuit board and at least one heat-generating electrical component mounted on the circuit board, which is in heat-conducting contact with a heat sink, the heat sink being connected to a cooling plate arranged on the end face, characterized in that at least one displaceable perpendicular to the circuit board ( 1 ) Pin ( 10 ) is arranged in the heat sink ( 3 ), which has a threaded bore ( 11 ) running transversely to its axis, into which a screw ( 9 ) penetrating the cooling plate ( 7 ) from the outside is screwed.
DE19893929701 1989-09-07 1989-09-07 Pluggable module with circuit board - has cooler with pin(s), orthogonally slidable w.r.t. circuit board, with transverse threshold bore Withdrawn DE3929701A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19893929701 DE3929701A1 (en) 1989-09-07 1989-09-07 Pluggable module with circuit board - has cooler with pin(s), orthogonally slidable w.r.t. circuit board, with transverse threshold bore

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19893929701 DE3929701A1 (en) 1989-09-07 1989-09-07 Pluggable module with circuit board - has cooler with pin(s), orthogonally slidable w.r.t. circuit board, with transverse threshold bore

Publications (1)

Publication Number Publication Date
DE3929701A1 true DE3929701A1 (en) 1991-03-14

Family

ID=6388804

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19893929701 Withdrawn DE3929701A1 (en) 1989-09-07 1989-09-07 Pluggable module with circuit board - has cooler with pin(s), orthogonally slidable w.r.t. circuit board, with transverse threshold bore

Country Status (1)

Country Link
DE (1) DE3929701A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4305147A1 (en) * 1993-02-19 1994-08-25 Philips Patentverwaltung Electrical apparatus having a device for the dissipation of heat from electrical components
DE4307000A1 (en) * 1993-03-05 1994-09-08 Siemens Ag Vacuum cleaner with a suction fan
WO2001065899A2 (en) * 2000-02-28 2001-09-07 Epcos Ag Heat sink module and an arrangement of heat sink modules
DE102011085870A1 (en) * 2011-11-07 2013-05-08 Lenze Automation Gmbh frequency converter

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4305147A1 (en) * 1993-02-19 1994-08-25 Philips Patentverwaltung Electrical apparatus having a device for the dissipation of heat from electrical components
DE4305147C2 (en) * 1993-02-19 1998-01-22 Philips Patentverwaltung Electrical device with a device for dissipating heat from electrical components
DE4307000A1 (en) * 1993-03-05 1994-09-08 Siemens Ag Vacuum cleaner with a suction fan
WO2001065899A2 (en) * 2000-02-28 2001-09-07 Epcos Ag Heat sink module and an arrangement of heat sink modules
WO2001065899A3 (en) * 2000-02-28 2001-12-06 Epcos Ag Heat sink module and an arrangement of heat sink modules
US6708757B2 (en) 2000-02-28 2004-03-23 Epcos Ag Heat sink module and an arrangment of heat sink modules
DE102011085870A1 (en) * 2011-11-07 2013-05-08 Lenze Automation Gmbh frequency converter

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: ALCATEL SEL AKTIENGESELLSCHAFT, 7000 STUTTGART, DE

8139 Disposal/non-payment of the annual fee