DE3903869C1 - Method of fixing an element in a recess by adhesive bonding - Google Patents

Method of fixing an element in a recess by adhesive bonding

Info

Publication number
DE3903869C1
DE3903869C1 DE19893903869 DE3903869A DE3903869C1 DE 3903869 C1 DE3903869 C1 DE 3903869C1 DE 19893903869 DE19893903869 DE 19893903869 DE 3903869 A DE3903869 A DE 3903869A DE 3903869 C1 DE3903869 C1 DE 3903869C1
Authority
DE
Germany
Prior art keywords
adhesive
recess
bonding
cavities
irradiated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19893903869
Other languages
German (de)
Inventor
Thomas Dipl.-Ing. Spatscheck (Fh), 7173 Mainhardt, De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tenovis GmbH and Co KG
Original Assignee
ANT Nachrichtentechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANT Nachrichtentechnik GmbH filed Critical ANT Nachrichtentechnik GmbH
Priority to DE19893903869 priority Critical patent/DE3903869C1/en
Application granted granted Critical
Publication of DE3903869C1 publication Critical patent/DE3903869C1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)

Abstract

When bonding an element into a recess it should be ensured that certain areas of the element are not wetted by the adhesive. Customary methods utilise the propagation of the adhesive by capillary action and, for example, dispense very precise quantities of adhesive. In the method according to the invention an element (1) is placed in a recess. Cavities (3) are formed. A radiation-curable adhesive (1) is applied and propagates in the cavities (3). Adhesion limits are irradiated in order to prevent propagation of the adhesive (4) beyond these adhesion limits. To cure the adhesive (4) the entire adhesion area is irradiated. For the adhesive bonding of optical components in recesses produced in a silicon board by anisotropic etching. <IMAGE>
DE19893903869 1989-02-10 1989-02-10 Method of fixing an element in a recess by adhesive bonding Expired DE3903869C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19893903869 DE3903869C1 (en) 1989-02-10 1989-02-10 Method of fixing an element in a recess by adhesive bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19893903869 DE3903869C1 (en) 1989-02-10 1989-02-10 Method of fixing an element in a recess by adhesive bonding

Publications (1)

Publication Number Publication Date
DE3903869C1 true DE3903869C1 (en) 1990-03-01

Family

ID=6373727

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19893903869 Expired DE3903869C1 (en) 1989-02-10 1989-02-10 Method of fixing an element in a recess by adhesive bonding

Country Status (1)

Country Link
DE (1) DE3903869C1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005005903A1 (en) * 2005-02-09 2006-08-17 Siemens Ag Method for connecting a scintillator to a photodiode involves connecting parts between which connecting gap is provided with connecting medium supplied by application means whereby front of connecting medium is produced at application means

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2178963A1 (en) * 1972-03-31 1973-11-16 Western Electric Co
DE2646657A1 (en) * 1975-10-22 1977-04-28 Cit Alcatel METHOD AND ARRANGEMENT FOR CONNECTING FIBER OPTIC FIBERS
EP0136201A2 (en) * 1983-08-08 1985-04-03 Alliance Technique Industrielle Process for joining optical fibres, and optical splice obtained

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2178963A1 (en) * 1972-03-31 1973-11-16 Western Electric Co
DE2646657A1 (en) * 1975-10-22 1977-04-28 Cit Alcatel METHOD AND ARRANGEMENT FOR CONNECTING FIBER OPTIC FIBERS
EP0136201A2 (en) * 1983-08-08 1985-04-03 Alliance Technique Industrielle Process for joining optical fibres, and optical splice obtained

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005005903A1 (en) * 2005-02-09 2006-08-17 Siemens Ag Method for connecting a scintillator to a photodiode involves connecting parts between which connecting gap is provided with connecting medium supplied by application means whereby front of connecting medium is produced at application means

Similar Documents

Publication Publication Date Title
US6441402B2 (en) Optical electronic apparatus and method for producing the same
DE69232896D1 (en) Process for anodic bonding with light radiation
HK54295A (en) Support for inclusion into identity cards.
ES2103076T3 (en) MANUFACTURE OF THIN SHEET BOARDS.
WO1990006503A3 (en) Sensor for optical assay
WO1998053351A3 (en) Optical devices and methods of fabrication thereof
KR900008701A (en) Manufacturing Method of Semiconductor Device
BR9713942A (en) Conductively anisotropic thermally reprocessing adhesive composition, and process for bonding a component to a substrate
US6215946B1 (en) V-groove chip with wick-stop trench for improved fiber positioning
DE3903869C1 (en) Method of fixing an element in a recess by adhesive bonding
US5169056A (en) Connecting of semiconductor chips to circuit substrates
SE9000245D0 (en) SEMICONDUCTOR COMPONENT AND PROCEDURE FOR ITS PREPARATION
PT724228E (en) METHOD FOR MOUNTING AN ELECTRONIC MODULE IN THE BODY OF A CARD
ES2164739T3 (en) PROCEDURE AND DEVICE FOR THE MANUFACTURE OF CARDS WITH INTEGRATED MICRO CIRCUIT CHIP AND CARD WITH INTEGRATED MICRO CIRCUIT CHIP.
DE3903871C1 (en) Method of fixing an element in a recess by adhesive bonding
US6665475B2 (en) Precision fiber optic alignment and attachment apparatus
DE69914902D1 (en) METHOD FOR PRODUCING AN IC CARD AND SUCH A PRODUCED CARD
JPS5924816A (en) Connecting method of optical waveguides
ATE19645T1 (en) PROCESS FOR PERMANENTLY STRESS-EQUALIZING JOINING OF CONSTRUCTION PARTS WITH DIFFERENT COEFFICIENTS OF EXPANSION.
WO1998039677A1 (en) Attachment of an optical fibre
EP1202342A3 (en) Semiconductor device and manufacturing method thereof
DE69211214D1 (en) Optical module with optical coupler for splitting or combining light and process for its production
DE59308816D1 (en) Manufacturing process and manufacturing device for carrier elements with IC components in identity cards
NO893972L (en) PROCEDURE FOR SEPARATE APPLICATION OF A FLOATING TWO COMPONENT ADHESIVE SYSTEM ON THE SURFACE OF THIRD PARTS.
RU2168191C1 (en) Process of adjustment of optical fiber, fiber-optical module and technology of its manufacture

Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8327 Change in the person/name/address of the patent owner

Owner name: ROBERT BOSCH GMBH, 70469 STUTTGART, DE

8320 Willingness to grant licenses declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: TENOVIS GMBH & CO. KG, 60326 FRANKFURT, DE

8339 Ceased/non-payment of the annual fee