DE3885054D1 - Behandlung einer Polyimid-Oberfläche zur Verbesserung der Adhäsion des darauf abgeschiedenen Metalls und nach diesem Verfahren hergestellte Gegenstände. - Google Patents
Behandlung einer Polyimid-Oberfläche zur Verbesserung der Adhäsion des darauf abgeschiedenen Metalls und nach diesem Verfahren hergestellte Gegenstände.Info
- Publication number
- DE3885054D1 DE3885054D1 DE88113776T DE3885054T DE3885054D1 DE 3885054 D1 DE3885054 D1 DE 3885054D1 DE 88113776 T DE88113776 T DE 88113776T DE 3885054 T DE3885054 T DE 3885054T DE 3885054 D1 DE3885054 D1 DE 3885054D1
- Authority
- DE
- Germany
- Prior art keywords
- adhesion
- treatment
- improve
- metal deposited
- articles produced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
- Y10S205/926—Polyamide or polyimide, e.g. nylon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/103,618 US4842946A (en) | 1987-09-28 | 1987-09-28 | Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby |
CA 598048 CA1331541C (en) | 1987-09-28 | 1989-04-27 | Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3885054D1 true DE3885054D1 (de) | 1993-11-25 |
DE3885054T2 DE3885054T2 (de) | 1994-05-11 |
Family
ID=25672655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88113776T Expired - Fee Related DE3885054T2 (de) | 1987-09-28 | 1988-08-24 | Behandlung einer Polyimid-Oberfläche zur Verbesserung der Adhäsion des darauf abgeschiedenen Metalls und nach diesem Verfahren hergestellte Gegenstände. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4842946A (de) |
EP (1) | EP0310803B1 (de) |
JP (1) | JPH0645900B2 (de) |
CA (1) | CA1331541C (de) |
DE (1) | DE3885054T2 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931310A (en) * | 1988-11-25 | 1990-06-05 | International Business Machines Corporation | Process for treating the surface of polyimides to improve properties to receive metal layer |
US5156731A (en) * | 1988-12-13 | 1992-10-20 | Sumitomo Metal Mining Co. Ltd. | Polyimide substrate and method of manufacturing a printed wiring board using the substrate |
JP2678055B2 (ja) * | 1989-03-30 | 1997-11-17 | シャープ株式会社 | 有機化合物薄膜の製法 |
US4999251A (en) * | 1989-04-03 | 1991-03-12 | General Electric Company | Method for treating polyetherimide substrates and articles obtained therefrom |
US5124192A (en) * | 1989-11-15 | 1992-06-23 | General Electric Company | Plastic mold structure and method of making |
US4959121A (en) * | 1990-01-05 | 1990-09-25 | General Electric Company | Method for treating a polyimide surface for subsequent plating thereon |
US5093466A (en) * | 1990-02-20 | 1992-03-03 | Exxon Chemical Patents Inc. | Polyoxamide oxygen barrier |
US5213840A (en) * | 1990-05-01 | 1993-05-25 | Macdermid, Incorporated | Method for improving adhesion to polymide surfaces |
US5133840A (en) * | 1990-05-15 | 1992-07-28 | International Business Machines Corporation | Surface midification of a polyimide |
US5441770A (en) * | 1990-05-18 | 1995-08-15 | Shipley Company Inc. | Conditioning process for electroless plating of polyetherimides |
JP2622016B2 (ja) * | 1990-07-11 | 1997-06-18 | 住友金属鉱山 株式会社 | 銅ポリイミド基板およびこれを用いたプリント配線板の製造方法 |
US5156732A (en) * | 1990-07-11 | 1992-10-20 | Sumitomo Metal Mining Co. Ltd. | Polyimide substrate and method of manufacturing a printed wiring board using the substrate |
JP2574535B2 (ja) * | 1990-11-21 | 1997-01-22 | 住友金属鉱山株式会社 | 銅ポリイミド基板の製造方法 |
US5198096A (en) * | 1990-11-28 | 1993-03-30 | General Electric Company | Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
US5147518A (en) * | 1991-03-07 | 1992-09-15 | E. I. Du Pont De Nemours And Company | Process for adhering metal to polyimide film |
US5461203A (en) * | 1991-05-06 | 1995-10-24 | International Business Machines Corporation | Electronic package including lower water content polyimide film |
US5183692A (en) * | 1991-07-01 | 1993-02-02 | Motorola, Inc. | Polyimide coating having electroless metal plate |
US5290597A (en) * | 1992-04-27 | 1994-03-01 | General Electric Company | Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon |
US5264248A (en) * | 1992-08-03 | 1993-11-23 | General Electric Company | Adhesion of metal coatings of polypyromellitimides |
KR0126792B1 (ko) * | 1994-04-11 | 1998-04-01 | 김광호 | 폴리이미드(Polyimide) 표면 처리방법 |
US5712039A (en) * | 1995-04-11 | 1998-01-27 | Minnesota Mining And Manufacturing Company | Epoxy adhesives with dithiooxamide adhesion promoters |
JPH0948864A (ja) * | 1995-08-03 | 1997-02-18 | Kanegafuchi Chem Ind Co Ltd | ポリイミドフィルムの接着性改善方法及び接着性を改善したポリイミドフィルム |
JP3253921B2 (ja) * | 1998-06-15 | 2002-02-04 | 奥野製薬工業株式会社 | 無電解部分めっき方法 |
SG87814A1 (en) | 1999-06-29 | 2002-04-16 | Univ Singapore | Method for low temperature lamination of metals to polyimides |
JP2003517182A (ja) * | 1999-12-17 | 2003-05-20 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 有機ledデバイスのカプセル封じ |
US7394153B2 (en) * | 1999-12-17 | 2008-07-01 | Osram Opto Semiconductors Gmbh | Encapsulation of electronic devices |
US6906120B1 (en) * | 2000-06-20 | 2005-06-14 | General Electric | Poly(arylene ether) adhesive compositions |
KR20040088555A (ko) * | 2002-02-28 | 2004-10-16 | 니폰 제온 가부시키가이샤 | 부분 도금 방법, 부분 도금 수지 기재, 및 다층 회로기판의 제조방법 |
US7057264B2 (en) * | 2002-10-18 | 2006-06-06 | National Starch And Chemical Investment Holding Corporation | Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates |
WO2004104103A1 (ja) * | 2003-05-20 | 2004-12-02 | Kaneka Corporation | ポリイミド樹脂組成物、ポリイミド樹脂を含む高分子フィルムおよびこれをもちいた積層体並びにプリント配線板の製造方法 |
JP4638690B2 (ja) * | 2003-05-20 | 2011-02-23 | 株式会社カネカ | 積層体およびプリント配線板 |
US7232478B2 (en) * | 2003-07-14 | 2007-06-19 | Enthone Inc. | Adhesion promotion in printed circuit boards |
JP4618488B2 (ja) * | 2004-10-01 | 2011-01-26 | 石原薬品株式会社 | 無電解スズメッキ方法 |
US20100159260A1 (en) * | 2008-12-23 | 2010-06-24 | E. I. Du Pont De Nemours And Company | Chrome-free method of conditioning and etching of a thermoplastic substrate for metal plating |
KR101344065B1 (ko) * | 2012-02-08 | 2013-12-24 | 주식회사 호진플라텍 | 구리 도금용액 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50100121A (de) * | 1974-01-08 | 1975-08-08 | ||
US3954570A (en) * | 1974-11-11 | 1976-05-04 | Amp Incorporated | Sensitized polyimides and circuit elements thereof |
JPS5265576A (en) * | 1975-11-27 | 1977-05-31 | Nitto Electric Ind Co | Method of treating metallized substrate of surface of plastics substrate |
US4089622A (en) * | 1976-06-22 | 1978-05-16 | Borg-Warner Corporation | Vacuum generator |
JPS5437969A (en) * | 1977-08-31 | 1979-03-20 | Toshiba Corp | Centrifugal gas separator |
DE2755374A1 (de) * | 1977-12-12 | 1979-06-13 | Stauffer Chemical Co | Verfahren zum metallisieren von substraten |
JPS54125235A (en) * | 1978-03-23 | 1979-09-28 | Pentel Kk | Polymerization accelerator for adhesive |
DE3149919A1 (de) * | 1981-12-11 | 1983-06-23 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zum haftfesten metallisieren von polyimid |
DE3242162A1 (de) * | 1982-11-13 | 1984-05-17 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von verbundwerkstoffen |
FR2544340A1 (fr) * | 1983-04-15 | 1984-10-19 | Rhone Poulenc Rech | Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus |
US4806395A (en) * | 1987-02-24 | 1989-02-21 | Polyonics Corporation | Textured polyimide film |
-
1987
- 1987-09-28 US US07/103,618 patent/US4842946A/en not_active Expired - Fee Related
-
1988
- 1988-08-24 EP EP88113776A patent/EP0310803B1/de not_active Expired - Lifetime
- 1988-08-24 DE DE88113776T patent/DE3885054T2/de not_active Expired - Fee Related
- 1988-09-28 JP JP63241172A patent/JPH0645900B2/ja not_active Expired - Lifetime
-
1989
- 1989-04-27 CA CA 598048 patent/CA1331541C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0310803B1 (de) | 1993-10-20 |
CA1331541C (en) | 1994-08-23 |
JPH0645900B2 (ja) | 1994-06-15 |
US4842946A (en) | 1989-06-27 |
JPH01132772A (ja) | 1989-05-25 |
EP0310803A1 (de) | 1989-04-12 |
DE3885054T2 (de) | 1994-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |