DE3883584D1 - Verfahren und Vorrichtung zum Formen von Stiften aus extrudierbarem Material in einem Substrat. - Google Patents
Verfahren und Vorrichtung zum Formen von Stiften aus extrudierbarem Material in einem Substrat.Info
- Publication number
- DE3883584D1 DE3883584D1 DE88105085T DE3883584T DE3883584D1 DE 3883584 D1 DE3883584 D1 DE 3883584D1 DE 88105085 T DE88105085 T DE 88105085T DE 3883584 T DE3883584 T DE 3883584T DE 3883584 D1 DE3883584 D1 DE 3883584D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- extrudable material
- forming pins
- pins
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
- Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
- Y10T29/53209—Terminal or connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Extrusion Of Metal (AREA)
- Forging (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/041,399 US4813130A (en) | 1987-04-23 | 1987-04-23 | Automatic extrusion pinning method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3883584D1 true DE3883584D1 (de) | 1993-10-07 |
DE3883584T2 DE3883584T2 (de) | 1994-04-21 |
Family
ID=21916317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88105085T Expired - Fee Related DE3883584T2 (de) | 1987-04-23 | 1988-03-29 | Verfahren und Vorrichtung zum Formen von Stiften aus extrudierbarem Material in einem Substrat. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4813130A (de) |
EP (1) | EP0287859B1 (de) |
JP (1) | JPS63268511A (de) |
DE (1) | DE3883584T2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3822535C1 (de) * | 1988-07-04 | 1990-01-11 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De | |
US4946708A (en) * | 1988-11-18 | 1990-08-07 | International Business Machines Corporation | Pin transfer adhesive application for surface mount component processes |
US5376414A (en) * | 1993-06-01 | 1994-12-27 | Sophia Systems Co., Ltd. | Expansion compensated precision extrusion method |
US5548486A (en) * | 1994-01-21 | 1996-08-20 | International Business Machines Corporation | Pinned module |
US5878483A (en) * | 1995-06-01 | 1999-03-09 | International Business Machines Corporation | Hammer for forming bulges in an array of compliant pin blanks |
TW341171U (en) * | 1998-01-16 | 1998-09-21 | Li-Li Chen | A platform radial dissipation forming mold |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3302272A (en) * | 1963-12-26 | 1967-02-07 | Air Reduction | Forming a resistor with thin, compressed, contact portions |
US3484935A (en) * | 1965-07-28 | 1969-12-23 | Western Electric Co | Method of producing electrical circuit assemblies having through connectors |
US3354260A (en) * | 1966-07-18 | 1967-11-21 | Western Electric Co | Through-connectors for circuit boards and method of applying same |
US3601523A (en) * | 1970-06-19 | 1971-08-24 | Buckbee Mears Co | Through hole connectors |
US3971610A (en) * | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
US4050756A (en) * | 1975-12-22 | 1977-09-27 | International Telephone And Telegraph Corporation | Conductive elastomer connector and method of making same |
EP0051378A2 (de) * | 1980-11-03 | 1982-05-12 | AMP INCORPORATED (a New Jersey corporation) | Leiterplatte mit Gussschaltung und Verfahren zur Herstellung |
KR850700098A (ko) * | 1983-09-21 | 1985-10-21 | 로이 에이취.맷신길 | 인쇄회로판 제조방법 |
US4550493A (en) * | 1984-02-08 | 1985-11-05 | International Business Machines Corporation | Apparatus for connecting contact pins to a substrate |
-
1987
- 1987-04-23 US US07/041,399 patent/US4813130A/en not_active Expired - Fee Related
-
1988
- 1988-02-19 JP JP63035455A patent/JPS63268511A/ja active Granted
- 1988-03-29 EP EP88105085A patent/EP0287859B1/de not_active Expired - Lifetime
- 1988-03-29 DE DE88105085T patent/DE3883584T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0287859A3 (en) | 1990-08-08 |
EP0287859A2 (de) | 1988-10-26 |
JPH0333045B2 (de) | 1991-05-15 |
US4813130A (en) | 1989-03-21 |
JPS63268511A (ja) | 1988-11-07 |
DE3883584T2 (de) | 1994-04-21 |
EP0287859B1 (de) | 1993-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |