DE3860768D1 - Verfahren zur herstellung von hochduktilem tantal-halbzeug. - Google Patents
Verfahren zur herstellung von hochduktilem tantal-halbzeug.Info
- Publication number
- DE3860768D1 DE3860768D1 DE8888100151T DE3860768T DE3860768D1 DE 3860768 D1 DE3860768 D1 DE 3860768D1 DE 8888100151 T DE8888100151 T DE 8888100151T DE 3860768 T DE3860768 T DE 3860768T DE 3860768 D1 DE3860768 D1 DE 3860768D1
- Authority
- DE
- Germany
- Prior art keywords
- ductant
- tantale
- semi
- finished products
- producing highly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/15—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting by using vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Forging (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8888100151T DE3860768D1 (de) | 1987-04-10 | 1988-01-08 | Verfahren zur herstellung von hochduktilem tantal-halbzeug. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873712281 DE3712281A1 (de) | 1987-04-10 | 1987-04-10 | Verfahren zur herstellung von hochduktilem tantal-halbzeug |
DE8888100151T DE3860768D1 (de) | 1987-04-10 | 1988-01-08 | Verfahren zur herstellung von hochduktilem tantal-halbzeug. |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3860768D1 true DE3860768D1 (de) | 1990-11-15 |
Family
ID=6325394
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873712281 Granted DE3712281A1 (de) | 1987-04-10 | 1987-04-10 | Verfahren zur herstellung von hochduktilem tantal-halbzeug |
DE8888100151T Expired - Lifetime DE3860768D1 (de) | 1987-04-10 | 1988-01-08 | Verfahren zur herstellung von hochduktilem tantal-halbzeug. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873712281 Granted DE3712281A1 (de) | 1987-04-10 | 1987-04-10 | Verfahren zur herstellung von hochduktilem tantal-halbzeug |
Country Status (3)
Country | Link |
---|---|
US (1) | US4844746A (de) |
EP (1) | EP0285741B1 (de) |
DE (2) | DE3712281A1 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5411611A (en) * | 1993-08-05 | 1995-05-02 | Cabot Corporation | Consumable electrode method for forming micro-alloyed products |
US6323055B1 (en) * | 1998-05-27 | 2001-11-27 | The Alta Group, Inc. | Tantalum sputtering target and method of manufacture |
US6348139B1 (en) * | 1998-06-17 | 2002-02-19 | Honeywell International Inc. | Tantalum-comprising articles |
CN1066367C (zh) * | 1998-11-12 | 2001-05-30 | 北京有色金属研究总院 | 一种制造用于生产钼电极坯和钼流口坯的金属钼棒的方法 |
US6348113B1 (en) * | 1998-11-25 | 2002-02-19 | Cabot Corporation | High purity tantalum, products containing the same, and methods of making the same |
US20040072009A1 (en) * | 1999-12-16 | 2004-04-15 | Segal Vladimir M. | Copper sputtering targets and methods of forming copper sputtering targets |
US6878250B1 (en) * | 1999-12-16 | 2005-04-12 | Honeywell International Inc. | Sputtering targets formed from cast materials |
US7517417B2 (en) * | 2000-02-02 | 2009-04-14 | Honeywell International Inc. | Tantalum PVD component producing methods |
US6331233B1 (en) | 2000-02-02 | 2001-12-18 | Honeywell International Inc. | Tantalum sputtering target with fine grains and uniform texture and method of manufacture |
CN1257998C (zh) | 2001-01-11 | 2006-05-31 | 卡伯特公司 | 钽和铌的坯料及其制造方法 |
US7416697B2 (en) | 2002-06-14 | 2008-08-26 | General Electric Company | Method for preparing a metallic article having an other additive constituent, without any melting |
US7897103B2 (en) * | 2002-12-23 | 2011-03-01 | General Electric Company | Method for making and using a rod assembly |
US7228722B2 (en) * | 2003-06-09 | 2007-06-12 | Cabot Corporation | Method of forming sputtering articles by multidirectional deformation |
EP1639620A2 (de) * | 2003-06-20 | 2006-03-29 | Cabot Corporation | Verfahren und entwurf für die sputter-target-anbringung an eine rückplatte |
US7531021B2 (en) | 2004-11-12 | 2009-05-12 | General Electric Company | Article having a dispersion of ultrafine titanium boride particles in a titanium-base matrix |
US7371022B2 (en) | 2004-12-22 | 2008-05-13 | Sokudo Co., Ltd. | Developer endpoint detection in a track lithography system |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
US7998287B2 (en) * | 2005-02-10 | 2011-08-16 | Cabot Corporation | Tantalum sputtering target and method of fabrication |
US20070084527A1 (en) * | 2005-10-19 | 2007-04-19 | Stephane Ferrasse | High-strength mechanical and structural components, and methods of making high-strength components |
CN101374611B (zh) | 2006-03-07 | 2015-04-08 | 卡伯特公司 | 制备变形金属制品的方法 |
US20070251818A1 (en) * | 2006-05-01 | 2007-11-01 | Wuwen Yi | Copper physical vapor deposition targets and methods of making copper physical vapor deposition targets |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2825641A (en) * | 1955-09-21 | 1958-03-04 | Robert A Beall | Method for melting refractory metals for casting purposes |
NL252366A (de) * | 1958-06-13 | |||
US3285716A (en) * | 1964-07-20 | 1966-11-15 | Kawecki Chemical Company | Etched tantalum foil |
US3497402A (en) * | 1966-02-03 | 1970-02-24 | Nat Res Corp | Stabilized grain-size tantalum alloy |
RO76187A2 (ro) * | 1980-11-14 | 1983-08-03 | Institutul De Cercetare Stiintifica Inginerie Tehnologica Si Proiectare Sectoare Calde,Ro | Procedeu si instalatie pentru topirea si turnarea metalelor greu fuzibile |
JPS6066425A (ja) * | 1983-09-22 | 1985-04-16 | Nippon Telegr & Teleph Corp <Ntt> | Lsi電極用の高純度モリブデンタ−ゲツトならびに高純度モリブデンシリサイドタ−ゲツトおよびその製造方法 |
JPS60124452A (ja) * | 1983-12-07 | 1985-07-03 | Hitachi Ltd | 高純度金属スリ−ブの製造方法 |
US4722756A (en) * | 1987-02-27 | 1988-02-02 | Cabot Corp | Method for deoxidizing tantalum material |
-
1987
- 1987-04-10 DE DE19873712281 patent/DE3712281A1/de active Granted
-
1988
- 1988-01-08 DE DE8888100151T patent/DE3860768D1/de not_active Expired - Lifetime
- 1988-01-08 EP EP88100151A patent/EP0285741B1/de not_active Expired - Lifetime
- 1988-03-23 US US07/172,201 patent/US4844746A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4844746A (en) | 1989-07-04 |
DE3712281C2 (de) | 1989-09-14 |
EP0285741A1 (de) | 1988-10-12 |
DE3712281A1 (de) | 1988-10-27 |
EP0285741B1 (de) | 1990-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |