DE3785226D1 - Kontinuierliches verfahren zur herstellung von leiterplatten. - Google Patents

Kontinuierliches verfahren zur herstellung von leiterplatten.

Info

Publication number
DE3785226D1
DE3785226D1 DE8787100003T DE3785226T DE3785226D1 DE 3785226 D1 DE3785226 D1 DE 3785226D1 DE 8787100003 T DE8787100003 T DE 8787100003T DE 3785226 T DE3785226 T DE 3785226T DE 3785226 D1 DE3785226 D1 DE 3785226D1
Authority
DE
Germany
Prior art keywords
continuous method
producing pcb
pcb
producing
continuous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787100003T
Other languages
English (en)
Other versions
DE3785226T2 (de
Inventor
Eugene A Eggers
William J Summa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE3785226D1 publication Critical patent/DE3785226D1/de
Application granted granted Critical
Publication of DE3785226T2 publication Critical patent/DE3785226T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1027—Pressing using at least one press band
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE87100003T 1986-02-03 1987-01-02 Kontinuierliches verfahren zur herstellung von leiterplatten. Expired - Fee Related DE3785226T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/825,562 US4659425A (en) 1986-02-03 1986-02-03 Continuous process for the manufacture of printed circuit boards

Publications (2)

Publication Number Publication Date
DE3785226D1 true DE3785226D1 (de) 1993-05-13
DE3785226T2 DE3785226T2 (de) 1993-11-04

Family

ID=25244317

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87100003T Expired - Fee Related DE3785226T2 (de) 1986-02-03 1987-01-02 Kontinuierliches verfahren zur herstellung von leiterplatten.

Country Status (4)

Country Link
US (1) US4659425A (de)
EP (1) EP0231737B1 (de)
JP (1) JPS62179931A (de)
DE (1) DE3785226T2 (de)

Families Citing this family (50)

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Publication number Priority date Publication date Assignee Title
US4794855A (en) * 1986-08-05 1989-01-03 Mitsubishi Rayon Engineering Co., Ltd. Continuous press machine
US5201979A (en) * 1987-05-08 1993-04-13 Research Association For New Technology Development Of High Performance Polymer Method of manufacturing a sheet-prepreg reinforced with fibers
US5445701A (en) * 1987-05-08 1995-08-29 Research Association For New Technology Development Of High Performance Polymer Apparatus of manufacturing a sheet-prepreg reinforced with fibers
EP0291629A3 (de) * 1987-05-16 1990-02-28 Aeg Isolier- Und Kunststoff Gmbh Verfahren zum kontinuierlichen Herstellen von bandförmigem Basismaterial
DE3840704A1 (de) * 1987-12-02 1989-07-06 Mitsubishi Gas Chemical Co Verfahren zur erzeugung eines kupferplattierten schichtstoffs
DE3811467A1 (de) * 1988-04-06 1989-10-19 Siempelkamp Gmbh & Co Verfahren und anlage zur kontinuierlichen herstellung von bahnfoermigem basismaterial fuer leiterplatten
US5167997A (en) * 1989-05-05 1992-12-01 Gould Inc. Protected conductive foil assemblage and procedure for preparing same using static electrical forces
JP2733346B2 (ja) * 1989-11-15 1998-03-30 松下電工株式会社 積層板の製造方法
JP2708914B2 (ja) * 1989-11-15 1998-02-04 松下電工株式会社 積層板の製造方法
CA2045987A1 (en) * 1990-08-06 1992-02-07 Haruhiko Maki Continuous production of metal clad laminates
US5269863A (en) * 1990-09-24 1993-12-14 Akzo Nv Continuous process for the manufacture of substrates for printed wire boards
DE4036801A1 (de) * 1990-11-19 1992-05-21 Huels Troisdorf Verfahren zur kontinuierlichen herstellung von kupferkaschierten basismaterialtafeln
TW210422B (de) * 1991-06-04 1993-08-01 Akzo Nv
US5268064A (en) * 1992-02-04 1993-12-07 Trimble Navigation Limited Copper clad epoxy printed circuit board suitable for microwave frequencies encountered in GPS receivers
TW244340B (de) * 1992-07-21 1995-04-01 Akzo Nv
TW259925B (de) * 1994-01-26 1995-10-11 Akzo Nobel Nv
US6016598A (en) * 1995-02-13 2000-01-25 Akzo Nobel N.V. Method of manufacturing a multilayer printed wire board
US5672234A (en) * 1995-04-28 1997-09-30 Park-Air Corporation Zipper fusing machine for attaching zipper material to a plastic web
US5655291A (en) * 1995-06-26 1997-08-12 Ford Motor Company Forming rigid circuit board
JP3901798B2 (ja) * 1997-06-12 2007-04-04 大日本印刷株式会社 プリント配線板の製造装置
US5976391A (en) * 1998-01-13 1999-11-02 Ford Motor Company Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
JP2911445B1 (ja) * 1998-06-26 1999-06-23 忠男 宇野 身分証明用冊子の個人データ記録面に保護フィルムを貼布する装置
SE513341C2 (sv) 1998-10-06 2000-08-28 Ericsson Telefon Ab L M Arrangemang med tryckta kretskort samt metod för tillverkning därav
NL1010620C2 (nl) * 1998-11-20 2000-05-23 Klieverik Heli Bv Laminator.
US6220328B1 (en) * 1999-09-23 2001-04-24 Textile Systems & Supply, Inc. Lamination machine
TW540177B (en) * 2000-07-14 2003-07-01 Mitsubishi Rayon Co Device and method for manufacturing resin-impregnated hard sheet
US6454878B1 (en) * 2000-11-01 2002-09-24 Visteon Global Technologies, Inc. Cladded material construction for etched-tri-metal circuits
JP3963662B2 (ja) * 2001-05-24 2007-08-22 住友ベークライト株式会社 積層板の製造方法
US6506062B1 (en) 2001-08-01 2003-01-14 Visteon Global Technologies, Inc. Circuit board having an integrated circuit board connector and method of making the same
JP4025177B2 (ja) * 2001-11-26 2007-12-19 三井金属鉱業株式会社 絶縁層付銅箔の製造方法
JP4136509B2 (ja) * 2001-12-18 2008-08-20 三井金属鉱業株式会社 プリプレグの製造方法並びにプリプレグの製造装置並びに絶縁層付銅箔の製造方法
KR100468748B1 (ko) * 2002-07-12 2005-01-29 삼성전자주식회사 프리컷 다이싱 테이프와 범용 다이싱 테이프를 웨이퍼에 마운팅할 수 있는 다이싱 테이프 부착 장비 및 이를포함하는 인라인 시스템
US20050028925A1 (en) * 2002-09-04 2005-02-10 Fernandes Karim B. Method for making a prepreg
DE102004058335A1 (de) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. Substrat
US7293355B2 (en) * 2005-04-21 2007-11-13 Endicott Interconnect Technologies, Inc. Apparatus and method for making circuitized substrates in a continuous manner
US7627947B2 (en) 2005-04-21 2009-12-08 Endicott Interconnect Technologies, Inc. Method for making a multilayered circuitized substrate
US7827682B2 (en) * 2005-04-21 2010-11-09 Endicott Interconnect Technologies, Inc. Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
JP4908266B2 (ja) * 2007-03-05 2012-04-04 株式会社ジャムコ 段階状の断面厚さを有する複合材の連続成形方法
CN102347433A (zh) * 2010-07-29 2012-02-08 展晶科技(深圳)有限公司 发光二极管
US20130019470A1 (en) * 2011-07-22 2013-01-24 Ict-Lanto Limited Method of manufacturing three-dimensional circuit
GB2498994B (en) * 2012-02-02 2014-03-19 Trackwise Designs Ltd Method of making a flexible circuit
EP2842880A1 (de) 2013-08-28 2015-03-04 Eurokeg B.V. Behälter für Flüssigkeiten
EP3178638A1 (de) * 2015-12-11 2017-06-14 Voestalpine Stahl GmbH Verfahren zur herstellung eines halbzeugs oder bauteils aus metall und faserverbund
US11059206B2 (en) * 2016-02-05 2021-07-13 Rohr, Inc Method for fabricating composite structures using combined resin film and dry fabric
JP6584444B2 (ja) * 2017-03-22 2019-10-02 アイシン高丘株式会社 複合構造体の製造方法
RS64543B1 (sr) * 2017-12-29 2023-09-29 Xylo Tech Ag Laminat sa sinhronom strukturom
US10785867B2 (en) * 2018-09-25 2020-09-22 International Business Machines Corporation Automatic determination of power plane shape in printed circuit board
KR20200038814A (ko) * 2018-10-04 2020-04-14 주식회사 엘지화학 회로 기판 제조용 연속 시트의 제조 방법 및 이로부터 제조된 회로 기판 제조용 연속 시트
US12006411B1 (en) * 2020-08-19 2024-06-11 Systima Technologies, Inc. Method of making carbonized composites
CN113024792B (zh) * 2021-04-06 2023-03-24 杭州安誉科技有限公司 一种荧光检测用滤光片及其在实时荧光定量pcr仪仪器中的用途

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US4191800A (en) * 1976-05-27 1980-03-04 Bell Telephone Laboratories, Incorporated Devices employing flexible substrates and method for making same
JPS55126418A (en) * 1979-03-26 1980-09-30 Kanegafuchi Chem Ind Co Ltd Method and apparatus for continuous preparation of laminated material
JPS568227A (en) * 1979-06-29 1981-01-28 Kanegafuchi Chem Ind Co Ltd Continuous preparation of laminate covered by metal foil
JPS5951913B2 (ja) * 1979-07-11 1984-12-17 鐘淵化学工業株式会社 積層体の連続製造方法
JPS5698136A (en) * 1980-01-08 1981-08-07 Kanegafuchi Chem Ind Co Ltd Continuous manufacture of laminated substance
US4284753A (en) * 1980-04-14 1981-08-18 Shell Oil Company Heat curable polyepoxide-unsaturated aromatic monomer resin compositions
CA1167364A (en) * 1980-09-22 1984-05-15 Masayuki Oizumi Production of bubble-free electrical laminates
US4420509A (en) * 1981-08-11 1983-12-13 Glasteel Tennessee, Inc. Copper-clad polyester-glass fiber laminates
DE3307057C2 (de) * 1983-03-01 1991-02-14 Held, Kurt, 7218 Trossingen Vorrichtung zur kontinuierlichen Herstellung kupferkaschierter Elektrolaminate

Also Published As

Publication number Publication date
JPH0262385B2 (de) 1990-12-25
EP0231737A2 (de) 1987-08-12
JPS62179931A (ja) 1987-08-07
EP0231737B1 (de) 1993-04-07
EP0231737A3 (en) 1989-03-22
US4659425A (en) 1987-04-21
DE3785226T2 (de) 1993-11-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee