DE3730497A1 - Surface mounted device (SMD) - Google Patents
Surface mounted device (SMD)Info
- Publication number
- DE3730497A1 DE3730497A1 DE19873730497 DE3730497A DE3730497A1 DE 3730497 A1 DE3730497 A1 DE 3730497A1 DE 19873730497 DE19873730497 DE 19873730497 DE 3730497 A DE3730497 A DE 3730497A DE 3730497 A1 DE3730497 A1 DE 3730497A1
- Authority
- DE
- Germany
- Prior art keywords
- solder
- component according
- solder paste
- coating
- surface mounted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Die Erfindung betrifft ein oberflächenmontierbares Bau element mit leitenden Anschlußflächen zur Bestückung von Leiterplatten.The invention relates to a surface-mountable construction element with conductive connection surfaces for the assembly of Circuit boards.
Oberflächenmontierbare Bauelemente sind elektronische Bauelemente von z.B. quaderförmiger (sog. Chip-Bauelemen te) oder zylindrischer Form (sog. MELF-Bauelemente). Als Anschlüsse weisen die oberflächenmontierbaren Bauelemente an Außenflächen leitende Anschlußflächen auf. Die MELF- Bauelemente tragen die Anschlußflächen an ihren Stirnsei ten. Andere Bauformen, z.B. die unter der Kurzbezeichnung SO bekannte Bauform, tragen Anschlußfahnen, welche mit einer Fläche auf einer Anschlußfläche auf einer Leiter platte aufliegen.Surface mount components are electronic Components from e.g. cuboid (so-called chip components te) or cylindrical shape (so-called MELF components). As The surface-mountable components have connections conductive pads on outer surfaces. The MELF Components carry the connection surfaces on their forehead Other designs, e.g. the one under the short name SO known design, carry connection lugs, which with a surface on a pad on a ladder lie on the plate.
Vor der Bestückung mit derartigen Bauelementen wird übli cherweise auf die Anschlußflächen auf der Leiterplatte Lot aufgetragen, z.B. in Form von Lötpaste. Diese besteht aus einem Gemisch aus Lotgranulat sowie Fluß- und Binde mitteln. Das Aufbringen erfolgt üblicherweise in einem Siebdruckverfahren oder mittels eines sog. Dispensers, einer Dosiereinrichtung. Die Lötpaste ist in der Lage, in Folge ihrer Klebrigkeit das auf die Leiterplatte aufge brachte Bauelement in der gewünschten Position zu fixie ren. Durch den Lötprozeß wird üblicherweise im Reflow- Lötverfahren eine hochwertige Lötverbindung erzielt.Before equipping with such components, übli usually on the pads on the circuit board Solder applied, e.g. in the form of solder paste. This exists made from a mixture of solder granules as well as river and bandage average. The application is usually done in one Screen printing process or by means of a so-called dispenser, a dosing device. The solder paste is able to As a result of their stickiness this is applied to the circuit board brought component to fixie in the desired position Ren. The soldering process is usually in the reflow Soldering process achieved a high quality solder joint.
Abhängig von der Gestaltung und der Größe des oberflä chenmontierbaren Bauelements bzw. seiner Anschlußflächen ist jeweils eine bestimmte Mindestmenge Lot für eine zu verlässige Lötverbindung erforderlich. Andererseits darf nicht zuviel Lot vorhanden sein, damit nicht ungewollt Schlüsse zwischen benachbarten Anschlußflächen entste hen. Da eine Leiterplatte meist mit einer Vielzahl unter schiedlicher oberflächenmontierbarer Bauelemente bestückt wird, erfordert das Aufbringen der Lötpaste für jedes dieser Bauelemente mit Dispenser einen sehr hohen zeit lichen Aufwand, da das Aufbringen für jeden Lötpunkt zeitlich nacheinander erfolgt und darüberhinaus die For derung besteht, eine individuell für jedes Bauelement exakt angepaßte Menge von Lötpaste aufzubringen. Das ge genwärtig am häufigsten angewandte Verfahren, die Löt paste für alle Anschlußflächen im Sieb- oder Schablonen druck aufzutragen, ist zwar erheblich schneller. Es wirft aber ebenfalls Probleme auf. So muß die Korngröße des Lotgranulats den Sieböffnungen angepaßt sein und die Vis kosität der Lötpaste muß in einem engen Toleranzbereich konstant gehalten werden. Außerdem ist der Verarbeitungs zeitraum zwischen dem Drucken der Lötpaste und dem Be stücken der Leiterplatte mit oberflächenmontierbaren Bau elementen auf wenige Stunden beschränkt, da sonst die Klebewirkung der Lötpaste verloren geht.Depending on the design and size of the surface Chenmontbaren component or its pads is a certain minimum amount of solder for one each reliable solder connection required. On the other hand, may not too much solder, so that it is not unwanted Conclusions arise between adjacent pads hen. Since a circuit board usually has a variety of under various surface-mountable components requires the application of solder paste for each these components with dispensers have a very high time effort because the application for each soldering point takes place one after the other and also the For there is a requirement for each component apply exactly adjusted amount of solder paste. The ge The most commonly used processes at present are soldering paste for all pads in the screen or stencil Applying pressure is much faster. It throws up but also problems. So the grain size of the Solder granules adapted to the sieve openings and the Vis The viscosity of the solder paste must be within a narrow tolerance range be kept constant. In addition, the processing Period between printing the solder paste and the loading pieces of the circuit board with surface mountable construction elements limited to a few hours, otherwise the Adhesive effect of the solder paste is lost.
Der Erfindung liegt die Aufgabe zugrunde, eine Möglich keit aufzuzeigen, wodurch die genannten Nachteile vermie den werden und die Lotmenge für jedes oberflächenmontier bare Bauelement individuell dosiert ist.The invention has for its object one possible speed, which avoids the disadvantages mentioned the and the amount of solder for each surface mount bare component is individually dosed.
Diese Aufgabe wird gemäß der Erfindung dadurch gelöst, daß wenigstens Teile der leitenden Anschlußflächen der oberflächenmontierbaren Bauelemente mit einer Beschich tung aus Lotmaterial zu versehen sind.According to the invention, this object is achieved by that at least parts of the conductive pads surface mountable components with a coating device made of solder material.
Vorteilhafte Ausgestaltungen der Erfindung sind in Unter ansprüchen angegeben.Advantageous embodiments of the invention are in Unter claims specified.
Im folgenden soll die Erfindung anhand der in den Fig. 1 und 2 gezeigten Ausführungsbeispiele beschrieben werden.The invention will be described below with reference to the exemplary embodiments shown in FIGS. 1 and 2.
Die Fig. 1 und 2 zeigen jeweils ein mit Lotmaterial versehenes oberflächenmontierbares Bauelement von der Seite. Figs. 1 and 2 each show a solder material provided with surface-mountable component from the side.
Das mit 1 bezeichnete oberflächenmontierbare Bauelement trägt an zwei gegenüberliegenden Schmalseiten leitende Anschlußflächen, welche als Metallisierungen ausgeführt sind. Das Bauelement kann z.B. ein Widerstand oder ein Kondensator sein. Die Metallisierung 2 ist mittels einer Lötpaste mit einer aus Lotmaterial gebildeten Schicht 3 überzogen. Diese erstreckt sich in diesem Ausführungsbei spiel nicht nur über die seitliche Randfläche, sondern zusätzlich über die Unterseite der Metalliserung. Es ist von besonderem Vorteil, die Beschichtung mit Lotmaterial bereits bei der Herstellung des Bauelements vorzunehmen.The surface-mountable component identified by 1 has conductive connection surfaces on two opposite narrow sides, which are embodied as metallizations. The component can be a resistor or a capacitor, for example. The metallization 2 is coated with a layer 3 formed from solder material by means of a solder paste. This extends in this exemplary embodiment not only over the lateral edge surface, but also over the underside of the metallization. It is particularly advantageous to carry out the coating with solder material already during the manufacture of the component.
Zur Beschichtung besonders geeignete Materialien sind Ge mische aus Zinn und Blei sowie Silber und Palladium. Die auf der Metallisierung 2 aufgebrachte Beschichtung 3 mit Lötpaste erfolgt in bekannter Weise durch Tauch-, Druck-, Wirbelsinter oder elektrostatische Verfahren.Materials particularly suitable for coating are mixtures of tin and lead as well as silver and palladium. The coating 3 with solder paste applied to the metallization 2 is carried out in a known manner by immersion, pressure, whirl sintering or electrostatic processes.
Durch geeignete Zusätze oder Vorbehandlung wird dafür ge sorgt, daß die Lötpaste nach dem Beschichten bei Raumtem peratur eine feste Konsistenz aufweist und durch kurzzei tige Erwärmung unmittelbar vor dem Bestückungsvorgang in klebeaktiven Zustand versetzt wird. Die kurzzeitige Er wärmung kann am Bestückungsautomaten selbst oder an Hand bestückungsplätzen entweder an der Abholposition oder auf dem Weg zur Absetzposition erfolgen. Als Wärmequellen kommen wahlweise Infrarotstrahler, Heißgasdüsen oder Laser zur Anwendung. Appropriate additives or pretreatment are used ensures that the solder paste after coating at room temperature temperature has a firm consistency and briefly heating immediately before the assembly process in adhesive active state is offset. The short-term he Heating can be done on the pick and place machine itself or by hand assembly places either at the pick-up position or on the way to the drop position. As heat sources come either infrared heaters, hot gas nozzles or Lasers for use.
Die Weiterverarbeitung erfolgt mit den bekannten Reflow- Lötverfahren.Further processing takes place with the known reflow Soldering process.
Bei dem in Fig. 2 gezeigten Ausführungsbeispiel ist lediglich die Unterseite der Metallisierung 2 mit Löt paste 3 versehen. Dies hat den Vorteil, daß die mecha nische Zentrierung des Bauelements bei Montage mit einem Bestückungsautomaten nicht durch die Nachgiebigkeit der Lötpastenbeschichtung beeinflußt wird.In the embodiment shown in Fig. 2, only the bottom of the metallization 2 is provided with solder paste 3 . This has the advantage that the mechanical centering of the component during assembly with an automatic placement machine is not influenced by the flexibility of the solder paste coating.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873730497 DE3730497A1 (en) | 1987-09-11 | 1987-09-11 | Surface mounted device (SMD) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873730497 DE3730497A1 (en) | 1987-09-11 | 1987-09-11 | Surface mounted device (SMD) |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3730497A1 true DE3730497A1 (en) | 1989-03-30 |
Family
ID=6335761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873730497 Withdrawn DE3730497A1 (en) | 1987-09-11 | 1987-09-11 | Surface mounted device (SMD) |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3730497A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2671933A1 (en) * | 1991-01-18 | 1992-07-24 | Ramy Jean Pierre | Method of integrating solder material into the fabrication of circuits and housings for electronics |
DE19934054C1 (en) * | 1999-07-19 | 2001-01-11 | Siemens Ag | Reflow soldering procedure for joining of contact pads of electrical components to printed circuit board (PCB) pads |
US6722029B2 (en) | 2000-09-02 | 2004-04-20 | Stmicroelectronics Ltd. | Method of mounting an electrical component to a support |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0139431A2 (en) * | 1983-09-16 | 1985-05-02 | LUCAS INDUSTRIES public limited company | Method of mounting a carrier for a microelectronic silicon chip |
DE2852753C3 (en) * | 1978-12-06 | 1985-06-20 | Württembergische Metallwarenfabrik, 7340 Geislingen | Method for fastening components with flat connection contacts on a printed circuit board and template for carrying out the method |
-
1987
- 1987-09-11 DE DE19873730497 patent/DE3730497A1/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2852753C3 (en) * | 1978-12-06 | 1985-06-20 | Württembergische Metallwarenfabrik, 7340 Geislingen | Method for fastening components with flat connection contacts on a printed circuit board and template for carrying out the method |
EP0139431A2 (en) * | 1983-09-16 | 1985-05-02 | LUCAS INDUSTRIES public limited company | Method of mounting a carrier for a microelectronic silicon chip |
Non-Patent Citations (1)
Title |
---|
R.J. Klein Wassink: Wichlöten in der Elektronik, Lenze-Verlag, 1986, S. 342-349 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2671933A1 (en) * | 1991-01-18 | 1992-07-24 | Ramy Jean Pierre | Method of integrating solder material into the fabrication of circuits and housings for electronics |
DE19934054C1 (en) * | 1999-07-19 | 2001-01-11 | Siemens Ag | Reflow soldering procedure for joining of contact pads of electrical components to printed circuit board (PCB) pads |
US6722029B2 (en) | 2000-09-02 | 2004-04-20 | Stmicroelectronics Ltd. | Method of mounting an electrical component to a support |
US7063797B2 (en) | 2000-09-02 | 2006-06-20 | Stmicroelectronics Ltd. | Mounting electronic components |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8130 | Withdrawal |