DE3526001A1 - High-voltage-resistant optocoupler - Google Patents
High-voltage-resistant optocouplerInfo
- Publication number
- DE3526001A1 DE3526001A1 DE19853526001 DE3526001A DE3526001A1 DE 3526001 A1 DE3526001 A1 DE 3526001A1 DE 19853526001 DE19853526001 DE 19853526001 DE 3526001 A DE3526001 A DE 3526001A DE 3526001 A1 DE3526001 A1 DE 3526001A1
- Authority
- DE
- Germany
- Prior art keywords
- sleeve
- discrete components
- components
- plastic
- spiral spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 239000004033 plastic Substances 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims abstract description 5
- 239000011521 glass Substances 0.000 claims abstract description 5
- 230000005693 optoelectronics Effects 0.000 claims description 5
- 230000008878 coupling Effects 0.000 abstract description 11
- 238000010168 coupling process Methods 0.000 abstract description 11
- 238000005859 coupling reaction Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000037431 insertion Effects 0.000 abstract description 2
- 238000003780 insertion Methods 0.000 abstract description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
- H04B10/802—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections for isolation, e.g. using optocouplers
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Securing Of Glass Panes Or The Like (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
Die Erfindung bezieht sich auf optoelektronische Koppler, die diskret verkappte Sende- und Empfängerbauelemente enthalten.The invention relates to optoelectronic couplers, that contain discretely encapsulated transmitter and receiver components.
Bekannt sind Koppleranordnungen, die diskret verkappte Sende- und Empfangsbauelemente enthalten, Hierzu zählen die Grundtypen geschlossener Koppler, Gabelkoppler, Reflexkoppler. Wichtigstes Merkmal dieser Koppleranordnungen ist die galvanische Trennung von Sender und Empfänger durch deren optische Kopplung. Besonderer Wert wird dabei auf eine galvanische Trennung hoher Potentialdifferenz (Hochspannungsfestigkeit) bei gleichzeitig hohem Koppelfaktor gelegt. Um dieses Ziel zu erreichen, werden international verschiedene Koppelvarianten eingesetzt.Coupler arrangements that are discretely capped are known Transmit and receive components included, These include the basic types of closed couplers, fork couplers, reflex couplers. Most important feature of these coupler arrangements is the galvanic isolation of transmitter and receiver through their optical coupling. Special value will be thereby on a galvanic isolation of high potential difference (High voltage resistance) with high at the same time Coupling factor laid. To achieve this goal, be internationally used coupling variants.
Bekannt ist die Verwendung von Lichtleitern DE 26 18 938 (Japan) und DE 24 43 247 (NL), die oft in direktem Kontakt mit dem Sender bzw. Empfänger stehen DE 25 10 122. In der OS DE 28 06 167 wird ein hochspannungsfester Optokoppler beschrieben, der durch einen zusätzlichen Isolierfilm auf wenigstens einem Leiterband, wobei das Koppelmedium aus dem gleichen Material besteht wie der Isolierfilm, hergestellt wird. Die Verwendung von Kunststoffummantelungen, wobei zwischen Sender und Empfänger ein Luftspalt verbleibt, wird in der Patentschrift DE 26 06 524, DE 26 27 944 und DE 24 31 375 beschrieben. Insbesondere bei diesen Kopplervarianten bestimmt die Größe des verbleibenden Luftspaltes die Größe der Hochspannungsfestigkeit. Der Koppelfaktor kann durch Steigerung des Reflexionsvermögens der Kunststoffummantelung unter Verwendung von Füllmassen aus Titanoxyd, Titandioxyd bzw. Aluminiumbronze beeinflußt werden DE 26 27 944. Die Umhüllungsmedien werden in mehreren komplizierten Fertigungsschritten angebracht. Für diskrete verkappte Sender- und Empfängerbauelemente werden oft zusätzliche Hilfsträgerstreifen (z. B. CNY 21) benötigt.The use of light guides DE 26 18 938 is known (Japan) and DE 24 43 247 (NL), often in direct DE 25 10 122 are in contact with the sender or receiver. In OS DE 28 06 167 a high voltage resistant optocoupler described by an additional insulating film on at least one conductor strip, the coupling medium made of the same material as the insulating film, will be produced. The use of plastic jackets, being between sender and receiver Air gap remains, is described in the patent DE 26 06 524, DE 26 27 944 and DE 24 31 375. In particular with these coupler variants the size of the remaining one determines Air gap the size of the high voltage strength. The coupling factor can be increased by increasing the reflectivity using the plastic sheath of filling compounds made of titanium oxide, titanium dioxide or Aluminum bronze are influenced by DE 26 27 944. The coating media are in several complicated manufacturing steps appropriate. For discrete and capped transmitters Receiver components often become additional subcarrier strips (e.g. CNY 21) is required.
Die international beschriebenen Koppleranordnungen haben den Nachteil einer komplizierten Fertigungstechnologie sowie eines hohen Montageaufwandes. Ein weiterer Nachteil bekannter Koppleranordnungen besteht darin, daß es nur unter großem Aufwand möglich ist, Sender- und Empfängerbauelemente vor der endgültigen Umhüllung paarweise elektrisch zu messen, um bestimmte Koppelfaktoren festzulegen.The internationally described coupler arrangements have the disadvantage of a complicated manufacturing technology as well as a high installation effort. Another disadvantage known coupler arrangements is that it only transmitter and receiver components are possible at great expense before the final wrapping in pairs electrically to measure to determine certain coupling factors.
Ziel der Erfindung ist die Schaffung einer rationellen Technologie zur Herstellung von hochspannungsfesten Optokopplern.The aim of the invention is to create a rational Technology for the production of high voltage resistant Optocouplers.
Der Erfindung liegt die Aufgabe zugrunde, eine hochspannungsfeste Optokoppleranordnung mit niedrigem Montageaufwand bei Erhaltung bzw. Erhöhung des Koppelfaktors zu schaffen.The invention has for its object a high voltage resistant Optocoupler arrangement with low installation costs if the coupling factor is maintained or increased create.
Erfindungsgemäß wird die Aufgabe dadurch gelöst, daß sich die diskret verkappten Sender- und Empfängerbauelemente in einer radial federnden Hülse gegenüberstehen, wobei die Hülse aus Glas, Plast, Keramik oder vorzugsweise aus einem gerollten Metallstreifen besteht. Die Innenseite der Hülse ist eine reflektierende Metallfläche. Die Distanz der diskreten Bauelemente zueinander sowie die Distanz der potentialführenden Bauteile der diskreten Bauelemente zur Hülse ist so zu gestalten, daß sie die Hochspannungsfestigkeit gewährleisten. Die innere Geometrie der Hülse entspricht insbesondere an ihren Enden der äußeren Geometrie der diskreten Bauelemente, so daß diese in der Hülse leicht geklemmt und fixiert werden können. Bei der vorzugsweisen Verwendung von Metallhülsen ist die Hülse so zu gestalten, daß sie die Form einer gewundenen Biegefeder (Spiralfeder) ohne Windungszwischenraum hat und sich die Enden des Metallstreifens überlappen. Bei der Verwendung von Glas-, Plast- oder Keramikhülsen, die ebenfalls die Form einer gewundenen Biegefeder ohne Windungszwischenraum haben, können die diskreten Bauelemente in der Hülse mittels Kleber fixiert werden.According to the invention the object is achieved in that the discretely encapsulated transmitter and receiver components face each other in a radially resilient sleeve, wherein the sleeve made of glass, plastic, ceramic or preferably a rolled metal strip. The inside the sleeve is a reflective metal surface. The distance of the discrete components to each other and the distance of the potential-carrying components of the discrete components Sleeve is to be designed so that it has high voltage resistance guarantee. The inner geometry of the sleeve corresponds especially at their ends of the outer geometry of the discrete components so that they are easy in the sleeve can be clamped and fixed. At preferential Using metal sleeves, the sleeve should be designed so that they have the shape of a spiral spiral spring (spiral spring) has no winding space and the ends of the metal strip overlap. When using glass, plastic or ceramic sleeves, which are also shaped like a winding They can have a spiral spring without a space between the turns discrete components fixed in the sleeve with glue will.
Die Erfindung ist anhand des in der zugehörigen Zeichnung dargestellten Ausführungsbeispiels näher erläutert.The invention is based on that in the accompanying drawing illustrated embodiment explained in more detail.
Dies zeigt inThis shows in
Fig. 1 Längsschnitt durch den Optokoppler Fig. 1 longitudinal section through the optocoupler
Fig. 2 Querschnitt durch den Optokoppler. Fig. 2 cross section through the optocoupler.
Die Infrarotemitterdiode 1 und der Fototransistor 2 werden in einer Glas-, Plast-, Keramik- oder vorzugsweise Metallhülse 3 sich gegenüberstehend angeordnet. Die Innenseite der Hülse 3 ist eine reflektierende Metallfläche. Durch die Anordnung der reflektierenden Metallfläche um die diskreten Bauelemente wird gewährleistet, daß sich der Koppelfaktor wesentlich erhöht. Die Geometrie der radial federnden Hülse 3 ist so gewählt, daß sie an ihren Enden der äußeren Geometrie der diskreten Bauelemente 1 und 2 entspricht.The infrared emitter diode 1 and the photo transistor 2 are arranged opposite one another in a glass, plastic, ceramic or preferably metal sleeve 3 . The inside of the sleeve 3 is a reflective metal surface. The arrangement of the reflective metal surface around the discrete components ensures that the coupling factor increases significantly. The geometry of the radially resilient sleeve 3 is chosen so that it corresponds at its ends to the outer geometry of the discrete components 1 and 2 .
Bei der vorzugsweisen Verwendung einer Metallhülse 3, die die Form einer gewundenen Biegefeder ohne Windungszwischenraum hat und deren Enden sich überlappen, wird es ermöglicht, daß die diskreten Bauelemente 1 und 2 beim Einfügen in die Hülse 3 leicht geklemmt und fixiert werden. Hierdurch wird ebenfalls problemlos die axiale Gegenüberstellung der diskreten Bauelemente 1 und 2 erreicht, wodurch ein guter Koppelfaktor gewährleistet wird.In the preferred use of a metal sleeve 3 , which has the shape of a spiral spiral spring without a winding space and whose ends overlap, it is possible for the discrete components 1 and 2 to be easily clamped and fixed when inserted into the sleeve 3 . As a result, the axial juxtaposition of the discrete components 1 and 2 is also achieved without any problems, thereby ensuring a good coupling factor.
Ein weiterer Vorteil der Anordnung der diskreten Bauelemente in der Metallhülse besteht darin, daß es möglich wird, die diskreten Bauelemente 1 und 2 problemlos in der Hülse 3 paarweise elektrisch zu messen, wodurch vor der endgültigen Umhüllung 4 des Optokopplers bestimmte Koppelfaktoren festgelegt werden können.Another advantage of the arrangement of the discrete components in the metal sleeve is that it becomes possible to measure the discrete components 1 and 2 in pairs in the sleeve 3 without any problems, whereby certain coupling factors can be determined before the final envelope 4 of the optocoupler.
Der gesamte Montageaufwand für den hochspannungsfesten Optokoppler reduziert sich insgesamt auf das Einfügen der diskreten Sender- und Empfängerbauelemente in die radial federnde Hülse und die anschließende Umhüllung.The entire assembly effort for the high voltage resistant The overall optocoupler is reduced to insertion the discrete transmitter and receiver components in the radially resilient sleeve and the subsequent wrapping.
Claims (4)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD27118484 | 1984-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3526001A1 true DE3526001A1 (en) | 1987-02-19 |
Family
ID=5563632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19853526001 Withdrawn DE3526001A1 (en) | 1984-12-20 | 1985-07-20 | High-voltage-resistant optocoupler |
Country Status (3)
| Country | Link |
|---|---|
| CS (1) | CS266241B1 (en) |
| DE (1) | DE3526001A1 (en) |
| HU (1) | HUT41161A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3805522A1 (en) * | 1987-02-27 | 1988-09-08 | Laurel Bank Machine Co | DUST PROTECTION TUBE FOR A LIGHT TRANSMITTER OR LIGHT RECEIVER |
| FR2621708A1 (en) * | 1987-10-13 | 1989-04-14 | Thomson Csf | Photocoupler and method of manufacturing this photocoupler |
| DE102005046921A1 (en) * | 2005-09-30 | 2007-04-12 | Siemens Ag | Circuit arrangement for monitoring a load current using emissions from a semiconductor component |
| DE212015000174U1 (en) | 2014-07-03 | 2017-02-17 | Firecomms Limited | An optocoupler and its components |
| EP3223317B1 (en) * | 2016-03-21 | 2019-01-23 | Pepperl + Fuchs GmbH | Optocoupler |
-
1985
- 1985-07-20 DE DE19853526001 patent/DE3526001A1/en not_active Withdrawn
- 1985-10-14 CS CS857303A patent/CS266241B1/en unknown
- 1985-12-17 HU HU481885A patent/HUT41161A/en unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3805522A1 (en) * | 1987-02-27 | 1988-09-08 | Laurel Bank Machine Co | DUST PROTECTION TUBE FOR A LIGHT TRANSMITTER OR LIGHT RECEIVER |
| FR2621708A1 (en) * | 1987-10-13 | 1989-04-14 | Thomson Csf | Photocoupler and method of manufacturing this photocoupler |
| DE102005046921A1 (en) * | 2005-09-30 | 2007-04-12 | Siemens Ag | Circuit arrangement for monitoring a load current using emissions from a semiconductor component |
| DE212015000174U1 (en) | 2014-07-03 | 2017-02-17 | Firecomms Limited | An optocoupler and its components |
| EP3223317B1 (en) * | 2016-03-21 | 2019-01-23 | Pepperl + Fuchs GmbH | Optocoupler |
Also Published As
| Publication number | Publication date |
|---|---|
| CS730385A1 (en) | 1988-08-16 |
| HUT41161A (en) | 1987-03-30 |
| CS266241B1 (en) | 1989-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |