Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
SKW Trostberg AG
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Filing date
Publication date
Application filed by SKW Trostberg AGfiledCriticalSKW Trostberg AG
Priority claimed from EP19840112232external-prioritypatent/EP0177631B1/en
Application grantedgrantedCritical
Publication of DE3471310D1publicationCriticalpatent/DE3471310D1/en
Hardening solvent, based on dicyandiamide, for epoxy resins comprises (a) 50-90 pts. by wt. dimethylformamide (DMF), (b) 5-50 pts. by wt. of a low b.pt. ketone and/or alcohol, (c) 5-30 pts. by wt. dicyandiamide based on the sum of (a)+(b). Pref. the ketone is acetone and/or methyl ethyl ketone and the low-boiling alcohol is methanol and/or ethanol and/or 1-methoxy-2-propanol. 1-10, pref. 2-5,wt.% based on dicyandiamide, of a hardening accelerator is present. Hardening solns. as claimed are used for the prepn. of storage-stable epoxy resin solns. contg. 1-10wt.% dicyandiamide.
DE8484112232T1984-10-111984-10-11Solution of hardeners for epoxy resins
ExpiredDE3471310D1
(en)
Compositions curable at ambient or slightly elevated temperatures comprising a polyhxdroxy compound together with a specified epoxide/carboxylic anhydride crosslinking system