DE3068305D1 - A stable aqueous colloid for the activation of non-conductive substrates and the method of activating - Google Patents

A stable aqueous colloid for the activation of non-conductive substrates and the method of activating

Info

Publication number
DE3068305D1
DE3068305D1 DE8080104428T DE3068305T DE3068305D1 DE 3068305 D1 DE3068305 D1 DE 3068305D1 DE 8080104428 T DE8080104428 T DE 8080104428T DE 3068305 T DE3068305 T DE 3068305T DE 3068305 D1 DE3068305 D1 DE 3068305D1
Authority
DE
Germany
Prior art keywords
activating
activation
conductive substrates
stable aqueous
aqueous colloid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080104428T
Other languages
German (de)
Inventor
William Robert Brasch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Application granted granted Critical
Publication of DE3068305D1 publication Critical patent/DE3068305D1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE8080104428T 1980-07-28 1980-07-28 A stable aqueous colloid for the activation of non-conductive substrates and the method of activating Expired DE3068305D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19800104428 EP0044878B1 (en) 1980-07-28 1980-07-28 A stable aqueous colloid for the activation of non-conductive substrates and the method of activating

Publications (1)

Publication Number Publication Date
DE3068305D1 true DE3068305D1 (en) 1984-07-26

Family

ID=8186733

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080104428T Expired DE3068305D1 (en) 1980-07-28 1980-07-28 A stable aqueous colloid for the activation of non-conductive substrates and the method of activating

Country Status (2)

Country Link
EP (1) EP0044878B1 (en)
DE (1) DE3068305D1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520046A (en) * 1983-06-30 1985-05-28 Learonal, Inc. Metal plating on plastics
US4719145A (en) * 1983-09-28 1988-01-12 Rohm And Haas Company Catalytic process and systems
US4847114A (en) * 1984-01-26 1989-07-11 Learonal, Inc. Preparation of printed circuit boards by selective metallization
US4761304A (en) * 1984-01-26 1988-08-02 Learonal, Inc. Process for printed circuit board manufacture
US4759952A (en) * 1984-01-26 1988-07-26 Learonal, Inc. Process for printed circuit board manufacture
DE3417563C2 (en) * 1984-05-11 1986-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Process for the production of metal patterns on insulating substrates, in particular printed circuits
JP4262190B2 (en) * 2003-12-26 2009-05-13 キヤノン株式会社 Resistive film forming method and image display apparatus and television apparatus formed by using the film forming method
JP4561558B2 (en) * 2005-09-22 2010-10-13 巌 菱田 Granular composition containing copper ion generating composition and method for suppressing the growth of harmful bacteria and various bacteria in water using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU422372B1 (en) * 1966-03-16 1972-03-14 Improvements in metallizing flexible substrata
DE2409251C3 (en) * 1974-02-22 1979-03-15 Kollmorgen Corp., Hartford, Conn. (V.St.A.) Process for the catalytic seeding of non-metallic surfaces for a subsequent, electroless metallization and bath solutions for carrying out the process

Also Published As

Publication number Publication date
EP0044878A1 (en) 1982-02-03
EP0044878B1 (en) 1984-06-20

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee