DE29919245U1 - Ball grid arrangement IC packing frame - Google Patents

Ball grid arrangement IC packing frame

Info

Publication number
DE29919245U1
DE29919245U1 DE29919245U DE29919245U DE29919245U1 DE 29919245 U1 DE29919245 U1 DE 29919245U1 DE 29919245 U DE29919245 U DE 29919245U DE 29919245 U DE29919245 U DE 29919245U DE 29919245 U1 DE29919245 U1 DE 29919245U1
Authority
DE
Germany
Prior art keywords
ball grid
grid array
frame according
package
package frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29919245U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Technologies Inc
Original Assignee
Via Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Technologies Inc filed Critical Via Technologies Inc
Priority to DE29919245U priority Critical patent/DE29919245U1/en
Publication of DE29919245U1 publication Critical patent/DE29919245U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (22)

1. Kugelgitter-Anordnungs-IC-Packungsrahmen umfassend
mehrere, in einem Kugelgitter angeordnete Zinnkügelchen, die auf der hinteren Oberfläche einer Kugelgitter-Anordungs-IC-ausbildet sind und
mehrere Stützpads, die in der Umgebung der hinteren Oberfläche der Kugelgitter- Anordnungs-IC-Packung ausgebildet sind.1. Including ball grid array IC package frame
a plurality of tin balls arranged in a ball grid, which are IC-formed on the rear surface of a ball grid arrangement, and
a plurality of support pads formed in the vicinity of the rear surface of the ball grid array IC package. 2. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin die Höhe jedes Stützpads etwa der halbe Durchmesser eines Zinnkügelchen in der Kugelgitter- Anordnung ist.2. Ball grid array IC package frame according to claim 1, wherein the height of each Support pads about half the diameter of a tin ball in the ball grid Arrangement is. 3. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin die Anzahl der Stützpads, die an den vier Ecken der hinteren Oberfläche der Kugelgitter-Anordnungs-IC Packung ausgebildet sind, vier beträgt3. Ball grid array IC package frame according to claim 1, wherein the number of Support pads attached to the four corners of the rear surface of the ball grid array IC Pack are formed, is four 4. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 3, worin jedes Stützpad L-förmig sein kann.4. Ball grid array IC package frame according to claim 3, wherein each support pad Can be L-shaped. 5. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, wobei die Anzahl der Stützpads drei beträgt, und diese im gleichen Abstand voneinander und konzentrisch zur hinteren Oberfläche der Kugelgitter-IC-Packung angeordnet sind.5. Ball grid array IC package frame according to claim 1, wherein the number of Support pads is three, and the same distance from each other and concentric to rear surface of the ball grid IC package are arranged. 6. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin die Stützpads zwischen den Zinnkügelchen in Kugelgitter-Anordnung und dem Umfang der hinteren Oberfläche der Kugelgitter-Anordnungs-IC-Packung ausgebildet werden.The ball grid array IC package frame according to claim 1, wherein the support pads between the tin balls in a ball grid arrangement and the circumference of the rear Surface of the ball grid array IC package are formed. 7. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin der Schmelzpunkt der Stützpads höher ist, als der der Zinnkügelchen in Kugelgitter-Anordnungs. The ball grid array IC package frame according to claim 1, wherein the melting point the support pad is higher than that of the tin balls in a ball grid arrangement.   8. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin die Stützpads aus Harz bestehen können.The ball grid array IC package frame according to claim 1, wherein the support pads are made of Resin can exist. 9. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin die Stützpads aus Aluminium mit einem hohen Schmelzpunkt und einer guten Wärmefähigkeit bestehen können.The ball grid array IC package frame according to claim 1, wherein the support pads are made of Aluminum with a high melting point and good heat resistance can. 10. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin das Material der Stützpads gleich dem der Kugelgitter-Anordnungs-IC-Packung ist.10. Ball grid assembly IC package frame according to claim 1, wherein the material of the Support pads are the same as that of the ball grid array IC package. 11. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin die Stützpads gleichzeitig während der Kugelgitter-Anordnungs-IC-Packung gebildet werden können.11. Ball grid array IC package frame according to claim 1, wherein the support pads can be formed simultaneously during the ball grid array IC package. 12. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin die Stützpads rund sein können.12. Ball grid array IC package frame according to claim 1, wherein the support pads are round could be. 13. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 1, worin die Stützpads quadratisch sein können.The ball grid array IC package frame according to claim 1, wherein the support pads can be square. 14. Kugelgitter-Anordnungs-IC-Packungsrahmen umfassend:
Eine Kugelgitter-Anordnungs-IC-Packung
mehrere in einem Kugelgitter angeordnete Zinnkügelchen, die auf der hinteren Oberfläche der Kugelgitter-Anordnungs-IC-Packung angeordnet sind, und
ein Stützelement, das zwischen dem Umfang der hinteren Oberfläche und den Kugelgitter-Anordnungs-Zinnkügelchen ausgebildet ist, um die Kugelgitter- Anordnung-IC-Packung zu stützen und zu verhindern, daß diese bei der An­ bringung zu stark geneigt ist.14. Ball grid array IC package frame comprising:
A ball grid array IC package
a plurality of tin balls arranged in a ball grid, which are arranged on the rear surface of the ball grid arrangement IC package, and
a support member formed between the periphery of the rear surface and the ball grid assembly tin balls to support the ball grid assembly IC pack and prevent it from being inclined too much when attached. 15. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 14, worin die Höhe des Stützelements etwa die Hälfte des Durchmessers eines jeden Zinnküglechen in der Kugelgitter-Anordnung beträgt.15. Ball grid array IC package frame according to claim 14, wherein the height of the  Support element about half the diameter of each tin ball in the Ball grid arrangement is. 16. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 14, worin das Stützelement einen höheren Schmelzpunkt besitzt, als die Zinnkügelchen in Kugelgitter-Anordnung.16. Ball grid array IC package frame according to claim 14, wherein the support member has a higher melting point than the tin balls in a ball grid arrangement. 17. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 14, worin das Stützelement aus Harz bestehen kann.17. Ball grid array IC package frame according to claim 14, wherein the support member can consist of resin. 18. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 14, worin das Stützelement aus Aluminium mit hohem Schmelzpunkt und guter Wärmeleitfähigkeit bestehen kann.The ball grid array IC package frame according to claim 14, wherein the support member can consist of aluminum with a high melting point and good thermal conductivity. 19. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 14, wobei das Stützelement aus den selben Materialien besteht, wie die Kugelgitter-Anordnungs-IC-Packung.19. Ball grid array IC package frame according to claim 14, wherein the support member made of the same materials as the ball grid array IC package. 20. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 14, worin das Stützelement gleichzeitig während der Kugelgitter-Anordnungs-IC-Packung, gebildet werden kann.20. Ball grid array IC package frame according to claim 14, wherein the support member can be formed simultaneously during the ball grid array IC package. 21. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 14, worin das Stützelement rund sein kann.21. The ball grid array IC package frame according to claim 14, wherein the support member can be round. 22. Kugelgitter-Anordnungs-IC-Packungsrahmen nach Anspruch 14, worin das Stützelement quadratisch sein kann.22. Ball grid array IC package frame according to claim 14, wherein the support member can be square.
DE29919245U 1999-11-02 1999-11-02 Ball grid arrangement IC packing frame Expired - Lifetime DE29919245U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29919245U DE29919245U1 (en) 1999-11-02 1999-11-02 Ball grid arrangement IC packing frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29919245U DE29919245U1 (en) 1999-11-02 1999-11-02 Ball grid arrangement IC packing frame

Publications (1)

Publication Number Publication Date
DE29919245U1 true DE29919245U1 (en) 2000-03-30

Family

ID=8081071

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29919245U Expired - Lifetime DE29919245U1 (en) 1999-11-02 1999-11-02 Ball grid arrangement IC packing frame

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Country Link
DE (1) DE29919245U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1202349A2 (en) * 2000-10-26 2002-05-02 Sanyo Electric Co., Ltd. Semiconductor module and method of manufacturing the same
EP2492959A1 (en) * 2011-02-22 2012-08-29 Micro Systems Engineering GmbH Electrical component having an electrical connection arrangement and method for the manufacture thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1202349A2 (en) * 2000-10-26 2002-05-02 Sanyo Electric Co., Ltd. Semiconductor module and method of manufacturing the same
EP1202349A3 (en) * 2000-10-26 2005-03-16 Sanyo Electric Co., Ltd. Semiconductor module and method of manufacturing the same
CN100409434C (en) * 2000-10-26 2008-08-06 三洋电机株式会社 Semiconductor modules and manufacture thereof
EP2492959A1 (en) * 2011-02-22 2012-08-29 Micro Systems Engineering GmbH Electrical component having an electrical connection arrangement and method for the manufacture thereof
US8923005B2 (en) 2011-02-22 2014-12-30 Micro Systems Engineering Gmbh Electrical component having an electrical connection arrangement and method for the manufacture thereof

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20000504

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20030108

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20051125

R152 Utility model maintained after payment of third maintenance fee after eight years

Effective date: 20080116

R071 Expiry of right