DE2703473C2 - - Google Patents
Info
- Publication number
- DE2703473C2 DE2703473C2 DE19772703473 DE2703473A DE2703473C2 DE 2703473 C2 DE2703473 C2 DE 2703473C2 DE 19772703473 DE19772703473 DE 19772703473 DE 2703473 A DE2703473 A DE 2703473A DE 2703473 C2 DE2703473 C2 DE 2703473C2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- conductive material
- insulating layer
- holes
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/7688—Filling of holes, grooves or trenches, e.g. vias, with conductive material by deposition over sacrificial masking layer, e.g. lift-off
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65581476A | 1976-02-06 | 1976-02-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2703473A1 DE2703473A1 (de) | 1977-08-11 |
DE2703473C2 true DE2703473C2 (fr) | 1991-01-24 |
Family
ID=24630480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19772703473 Granted DE2703473A1 (de) | 1976-02-06 | 1977-01-28 | Schichtstruktur aus isolierendem und leitfaehigem material und verfahren zu ihrer herstellung |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5827664B2 (fr) |
CA (1) | CA1088382A (fr) |
DE (1) | DE2703473A1 (fr) |
FR (1) | FR2340620A1 (fr) |
GB (1) | GB1521431A (fr) |
IT (1) | IT1079545B (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4184909A (en) * | 1978-08-21 | 1980-01-22 | International Business Machines Corporation | Method of forming thin film interconnection systems |
JPS59170692A (ja) * | 1983-03-16 | 1984-09-26 | Ebara Corp | 水封入熱交換器 |
CN108139240B (zh) | 2015-10-27 | 2021-02-26 | 舍弗勒技术股份两合公司 | 具有用于提供多种工作电压的内置电气线路的轴承装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1267738B (de) * | 1962-10-29 | 1968-05-09 | Intellux Inc | Verfahren zur Herstellung von elektrischen Verbindungen zwischen den Stromkreisen von mehrlagigen gedruckten elektrischen Schaltungen |
US3464855A (en) * | 1966-09-06 | 1969-09-02 | North American Rockwell | Process for forming interconnections in a multilayer circuit board |
DE1765013A1 (de) * | 1968-03-21 | 1971-07-01 | Telefunken Patent | Verfahren zur Herstellung von Mehrebenenschaltungen |
DE2059425A1 (de) * | 1970-12-02 | 1972-06-22 | Siemens Ag | Partieller Aufbau von gedruckten Mehrlagenschaltungen |
JPS4960870A (fr) * | 1972-10-16 | 1974-06-13 | ||
US3873361A (en) * | 1973-11-29 | 1975-03-25 | Ibm | Method of depositing thin film utilizing a lift-off mask |
JPS5120681A (en) * | 1974-07-27 | 1976-02-19 | Oki Electric Ind Co Ltd | Handotaisochino seizohoho |
NL7415841A (nl) * | 1974-12-05 | 1976-06-09 | Philips Nv | Werkwijze voor het vervaardigen van een half- geleiderinrichting en halfgeleiderinrichting, vervaardigd volgens de werkwijze. |
JPS5272571A (en) * | 1975-12-15 | 1977-06-17 | Fujitsu Ltd | Production of semiconductor device |
-
1976
- 1976-12-30 FR FR7639828A patent/FR2340620A1/fr active Granted
-
1977
- 1977-01-19 JP JP52004049A patent/JPS5827664B2/ja not_active Expired
- 1977-01-19 GB GB205677A patent/GB1521431A/en not_active Expired
- 1977-01-28 IT IT1972177A patent/IT1079545B/it active
- 1977-01-28 DE DE19772703473 patent/DE2703473A1/de active Granted
- 1977-02-03 CA CA271,002A patent/CA1088382A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
IT1079545B (it) | 1985-05-13 |
FR2340620B1 (fr) | 1979-09-28 |
JPS5295987A (en) | 1977-08-12 |
CA1088382A (fr) | 1980-10-28 |
DE2703473A1 (de) | 1977-08-11 |
FR2340620A1 (fr) | 1977-09-02 |
GB1521431A (en) | 1978-08-16 |
JPS5827664B2 (ja) | 1983-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8125 | Change of the main classification | ||
8126 | Change of the secondary classification | ||
8125 | Change of the main classification |
Ipc: H01L 21/90 |
|
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |