DE2401613A1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE2401613A1
DE2401613A1 DE19742401613 DE2401613A DE2401613A1 DE 2401613 A1 DE2401613 A1 DE 2401613A1 DE 19742401613 DE19742401613 DE 19742401613 DE 2401613 A DE2401613 A DE 2401613A DE 2401613 A1 DE2401613 A1 DE 2401613A1
Authority
DE
Germany
Prior art keywords
photoresist
protective layer
semiconductor device
cured
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19742401613
Other languages
German (de)
English (en)
Inventor
Erich Dipl Chem Dr Rer Pammer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19742401613 priority Critical patent/DE2401613A1/de
Priority to GB5577174A priority patent/GB1465650A/en
Priority to IT1911175A priority patent/IT1028249B/it
Priority to JP621875A priority patent/JPS50104572A/ja
Priority to FR7500823A priority patent/FR2258002B1/fr
Publication of DE2401613A1 publication Critical patent/DE2401613A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE19742401613 1974-01-14 1974-01-14 Halbleitervorrichtung Pending DE2401613A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19742401613 DE2401613A1 (de) 1974-01-14 1974-01-14 Halbleitervorrichtung
GB5577174A GB1465650A (en) 1974-01-14 1974-12-24 Semiconductor devices
IT1911175A IT1028249B (it) 1974-01-14 1975-01-09 Dispositivo a semiconduttori
JP621875A JPS50104572A (nl) 1974-01-14 1975-01-13
FR7500823A FR2258002B1 (nl) 1974-01-14 1975-01-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742401613 DE2401613A1 (de) 1974-01-14 1974-01-14 Halbleitervorrichtung

Publications (1)

Publication Number Publication Date
DE2401613A1 true DE2401613A1 (de) 1975-07-17

Family

ID=5904759

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19742401613 Pending DE2401613A1 (de) 1974-01-14 1974-01-14 Halbleitervorrichtung

Country Status (5)

Country Link
JP (1) JPS50104572A (nl)
DE (1) DE2401613A1 (nl)
FR (1) FR2258002B1 (nl)
GB (1) GB1465650A (nl)
IT (1) IT1028249B (nl)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2929339A1 (de) * 1978-07-24 1980-02-14 Citizen Watch Co Ltd Halbleiteranordnung
DE3327960A1 (de) * 1983-08-03 1985-02-14 Telefunken electronic GmbH, 7100 Heilbronn Halbleiteranordnung in einem isolierstoffgehaeuse
DE3415817A1 (de) * 1984-04-27 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Verfahren zum abdecken der vorderseite eines mit bauelementstrukturen versehenen substrates
US4618878A (en) * 1983-06-18 1986-10-21 Kabushiki Kaisha Toshiba Semiconductor device having a multilayer wiring structure using a polyimide resin
DE4123900A1 (de) * 1991-07-18 1993-01-21 Siemens Ag Schutzschicht fuer wafer
DE4435120A1 (de) * 1994-09-30 1996-04-04 Siemens Ag Schutzschicht für Wafer und Verfahren zu deren Herstllung

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850417B2 (ja) * 1979-07-31 1983-11-10 富士通株式会社 半導体装置の製造方法
JPS5632731A (en) * 1979-08-27 1981-04-02 Fujitsu Ltd Semiconductor device
JPS5661130A (en) * 1979-10-25 1981-05-26 Fuji Electric Co Ltd Semiconductor device
JPS5736835A (en) * 1980-08-15 1982-02-27 Nec Corp Semiconductor device
JPS5739736U (nl) * 1980-08-18 1982-03-03
JPS5740956A (en) * 1980-08-25 1982-03-06 Fujitsu Ltd Semiconductor device
JPS5975648A (ja) * 1982-10-23 1984-04-28 Nippon Precision Saakitsutsu Kk 半導体装置およびその製造方法
FR2544132B1 (fr) * 1983-04-08 1986-11-21 Telecommunications Sa Detecteur photoconducteur en immersion optique

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2929339A1 (de) * 1978-07-24 1980-02-14 Citizen Watch Co Ltd Halbleiteranordnung
US4618878A (en) * 1983-06-18 1986-10-21 Kabushiki Kaisha Toshiba Semiconductor device having a multilayer wiring structure using a polyimide resin
DE3327960A1 (de) * 1983-08-03 1985-02-14 Telefunken electronic GmbH, 7100 Heilbronn Halbleiteranordnung in einem isolierstoffgehaeuse
DE3415817A1 (de) * 1984-04-27 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Verfahren zum abdecken der vorderseite eines mit bauelementstrukturen versehenen substrates
DE4123900A1 (de) * 1991-07-18 1993-01-21 Siemens Ag Schutzschicht fuer wafer
DE4435120A1 (de) * 1994-09-30 1996-04-04 Siemens Ag Schutzschicht für Wafer und Verfahren zu deren Herstllung
DE4435120C2 (de) * 1994-09-30 2000-08-03 Siemens Ag Schutzschicht für Wafer und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
IT1028249B (it) 1979-01-30
FR2258002A1 (nl) 1975-08-08
FR2258002B1 (nl) 1978-12-08
GB1465650A (en) 1977-02-23
JPS50104572A (nl) 1975-08-18

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Legal Events

Date Code Title Description
OHW Rejection