DE2226378A1 - PLASTIC HOUSING FOR ELECTRICAL AND ELECTRONIC COMPONENTS - Google Patents
PLASTIC HOUSING FOR ELECTRICAL AND ELECTRONIC COMPONENTSInfo
- Publication number
- DE2226378A1 DE2226378A1 DE19722226378 DE2226378A DE2226378A1 DE 2226378 A1 DE2226378 A1 DE 2226378A1 DE 19722226378 DE19722226378 DE 19722226378 DE 2226378 A DE2226378 A DE 2226378A DE 2226378 A1 DE2226378 A1 DE 2226378A1
- Authority
- DE
- Germany
- Prior art keywords
- electrical
- electronic components
- plastic housing
- plastic
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0045—Casings being rigid plastic containers having a coating of shielding material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Casings For Electric Apparatus (AREA)
Description
Gehäuse aus Kunststoff für elektrische und elektronische Bauteile Die Erfindung betrifft ein Gehäuse aus spritzfähigem Kunststoff für elektrische und elektronische Bauteile.Plastic housings for electrical and electronic components The invention relates to a housing made of injectable plastic for electrical and electronic components.
Die Unterbringung solcher Bauteile in Kunststoffgehäusen ist allgemein üblich Kunststoff bietet sich dabei insbesondere aus verarbeitungstechnischen und kostenmäßigen Gründen an, so daß er den früher verwendeten Werkstoff Metall weitgehend verdrängt hat. Dem Einsatz von Kunststoff ist jedoch dort eine Grenze gesetzt, wo es sich um empfindliche Bauteile handelt, deren Funktion durch geringe äußere elektromagnetische Einflüsse beeinträchtigt wird. In diesen Fällen werden deshalb bis heute abschinnende Metallgehäuse verwendet, die nicht unbeträchtliche Kosten mit sich bringen.The accommodation of such components in plastic housings is general Usually plastic is used in particular from processing technology and reasons of cost, so that he largely used the metal material previously used has displaced. However, there is a limit to the use of plastic wherever it is about sensitive components, their function by low external electromagnetic influences are impaired. In these cases it will be That is why riveting metal housings have been used to this day, which are not inconsiderable Bring costs.
Der Erfindung liegt die Aufgabe zugrunde, ein Gehäuse aus Kunststoff zu schaffen, das die Funktion der bisher in solchen Fällen notwendigen Metallgehäuse zu übernehmen verlag.The invention is based on the object of a housing made of plastic to create the function of the metal housing previously necessary in such cases to take over the publishing house.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß in den Kunststoff ein leitendes Metall von körniger bis pulvriger Form bei gleichmäßigem Verteilungsgrad eingebettet ist.This object is achieved according to the invention in that in the plastic a conductive metal from granular to powdery form with a uniform degree of distribution is embedded.
Die Korngröße wird dabei so gewählt, daß sich das Kunststoff-~setall-Gemisch in ineiner herkömmlichen Spritzgießmaschine ohne besondere Vorkehrungen verarbeiten läßt. Die Praxis hat gezeigt, daß bei einem Volumenanteil von 10 bis 40% Metallpulver, z.I3. Kupfer- oder Lisenfeilspäne, eine ausreichende lsbschirttlwirkung erzielt wird. Je nach Empfindlichkeit der in dem Gehäuse unterzubringenden Bauteile und/oder je nach deren Einsatzort kann der IXietallanteil an der oberen oder unteren Grenze gewählt werden. Ein solchermaßen aufgebautes Gehäuse ist einem reinen Metallgehäuse in kostenmäßiger Hinsicht überlegen.The grain size is chosen in such a way that the plastic / metal mixture Process in a conventional injection molding machine without special precautions leaves. Practice has shown that with a volume fraction of 10 to 40% metal powder, z.I3. Copper filings or pilaster filings, a sufficient insulation effect is achieved will. Depending on the sensitivity of the components to be accommodated in the housing and / or Depending on where it is used, the metal content can be at the upper or lower limit to get voted. A housing constructed in this way is a pure metal housing superior in terms of cost.
Es ist zwar in der Technik elektrischer Leiter bekannt, in einen nicht leitenden Werkstoff, z.B. Kunstkautschuk od.While electrical conductors are known in the art, one is not conductive material, e.g. synthetic rubber or
dgl0, ein leitendes Material einzubetten, doch dient dies ausschließlich dem Zweck, einen gegebenenfalls flexiblen elektrischen Leiter zu erhalten. Ifingegen hat diese Werkstoffpaarung noch keinen Eingang in das vorliegende Sachgebiet gefunden, so daß durch die Erfindung eine neue Anwendungsmöglichkeit großen Umfangs erschlossen wird.dgl0 to embed a conductive material, but this is only used the purpose of obtaining a possibly flexible electrical conductor. If on the other hand has this material pairing no entry into the present Subject area found, so that the invention provides a new application is developed on a large scale.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722226378 DE2226378A1 (en) | 1972-05-31 | 1972-05-31 | PLASTIC HOUSING FOR ELECTRICAL AND ELECTRONIC COMPONENTS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722226378 DE2226378A1 (en) | 1972-05-31 | 1972-05-31 | PLASTIC HOUSING FOR ELECTRICAL AND ELECTRONIC COMPONENTS |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2226378A1 true DE2226378A1 (en) | 1973-12-13 |
Family
ID=5846361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19722226378 Pending DE2226378A1 (en) | 1972-05-31 | 1972-05-31 | PLASTIC HOUSING FOR ELECTRICAL AND ELECTRONIC COMPONENTS |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE2226378A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4539433A (en) * | 1982-11-24 | 1985-09-03 | Tdk Corporation | Electromagnetic shield |
-
1972
- 1972-05-31 DE DE19722226378 patent/DE2226378A1/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4539433A (en) * | 1982-11-24 | 1985-09-03 | Tdk Corporation | Electromagnetic shield |
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