DE202012010602U1 - cooler - Google Patents
cooler Download PDFInfo
- Publication number
- DE202012010602U1 DE202012010602U1 DE201220010602 DE202012010602U DE202012010602U1 DE 202012010602 U1 DE202012010602 U1 DE 202012010602U1 DE 201220010602 DE201220010602 DE 201220010602 DE 202012010602 U DE202012010602 U DE 202012010602U DE 202012010602 U1 DE202012010602 U1 DE 202012010602U1
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- grooves
- groove
- fin
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims abstract description 94
- 238000004519 manufacturing process Methods 0.000 description 4
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 210000002023 somite Anatomy 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Kühlvorrichtung, umfassend einen Hauptkörper (11), der Nuten (111) aufweist, die ringförmig an der Außenseite des Hauptkörpers (11) verteilt sind, und mindestens erste Kühlrippen (12), die jeweils einen ersten Kühlteil (121), ein erstes Ende (122) und ein zweites Ende (123) aufweisen, wobei das erste und zweite Ende (122, 123) in die Nuten (111) geschoben werden.Cooling device, comprising a main body (11) having grooves (111) which are distributed annularly on the outside of the main body (11), and at least first cooling fins (12), each having a first cooling part (121), a first end ( 122) and a second end (123), the first and second ends (122, 123) being pushed into the grooves (111).
Description
Technisches GebietTechnical area
Die Erfindung betrifft eine Kühlvorrichtung, die die Montagezeit verkürzen und die Herstellungskosten einsparen kann.The invention relates to a cooling device that can shorten the assembly time and save manufacturing costs.
Stand der TechnikState of the art
Der herkömmliche zylinderförmige Kühlkörper weist einen Zylinder und eine Vielzahl von Kühlrippen um den Zylinder auf. Die Verbindung des Zylinders und der Kühlrippen ist aus den folgenden Schriften bekannt:
- 2. aus dem
taiwanesischen Patent 098105429 - 3. Aus dem
taiwanesischen Patent 097151576
- 2. from the
Taiwanese Patent 098105429 - 3. From the
Taiwanese Patent 097151576
Die obengenannten herkömmlichen Lösungen weisen jedoch folgende Nachteile auf:
- 1. durch die Führungsnuten wird die Anzahl der Nuten für die Kühlrippen reduziert, so dass die Anzahl der Kühlrippen reduziert wird;
- 2. zeitaufwendige Herstellung.
- 1. by the guide grooves, the number of grooves is reduced for the cooling fins, so that the number of cooling fins is reduced;
- 2. time-consuming production.
Aus diesem Grund hat der Erfinder in Anbetracht der Nachteile herkömmlicher Lösungen, basierend auf lang jähriger Erfahrung in diesem Bereich, nach langem Studium, zahlreichen Versuchen und unentwegten Verbesserungen die vorliegende Erfindung entwickelt.For this reason, in view of the disadvantages of conventional solutions based on many years of experience in this field, the inventor has, after much study, numerous trials and constant improvements, developed the present invention.
Aufgabe der ErfindungObject of the invention
Der Erfindung liegt die Aufgabe zugrunde, eine Kühlvorrichtung zu schaffen, die die Montagezeit verkürzen und die Herstellungskosten einsparen kann.The invention has for its object to provide a cooling device that can shorten the assembly time and save manufacturing costs.
Diese Aufgabe wird durch die erfindungsgemäße Kühlvorrichtung gelöst, die umfasst: einen Hauptkörper, der Nuten aufweist, die ringförmig an der Außenseite des Hauptkörpers verteilt sind; und mindestens erste Kühlrippen, die jeweils einen ersten Kühlteil, ein erstes Ende und ein zweites Ende aufweisen, wobei das erste und zweite Ende in die Nuten geschoben werden.This object is achieved by the cooling device according to the invention, comprising: a main body having grooves annularly distributed on the outside of the main body; and at least first cooling fins each having a first cooling part, a first end and a second end, wherein the first and second ends are pushed into the grooves.
Weitere Einzelheiten, Merkmale und Vorteile der Erfindung ergeben sich aus der nachfolgenden detaillierten Beschreibung in Verbindung mit den anliegenden Zeichnungen.Further details, features and advantages of the invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Wege zur Ausführung der ErfindungWays to carry out the invention
Die
Der Hauptkörper
Die ersten Kühlrippen
Im vorliegenden Ausführungsbeispiel enthalten die Nuten
Die
Das erste Ende
Die
Die
Die
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- TW 098105429 [0002] TW 098105429 [0002]
- TW 097151576 [0002] TW 097151576 [0002]
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201220010602 DE202012010602U1 (en) | 2012-10-27 | 2012-10-27 | cooler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201220010602 DE202012010602U1 (en) | 2012-10-27 | 2012-10-27 | cooler |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202012010602U1 true DE202012010602U1 (en) | 2012-12-05 |
Family
ID=47502542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE201220010602 Expired - Lifetime DE202012010602U1 (en) | 2012-10-27 | 2012-10-27 | cooler |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202012010602U1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201024653A (en) | 2008-12-31 | 2010-07-01 | Quan-Pei Chen | Method for tightly fastening heat dissipation device |
TW201031882A (en) | 2009-02-20 | 2010-09-01 | li-hua Qin | Planting and tightening method for cylindrical heat dissipation fins and application device thereof |
-
2012
- 2012-10-27 DE DE201220010602 patent/DE202012010602U1/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201024653A (en) | 2008-12-31 | 2010-07-01 | Quan-Pei Chen | Method for tightly fastening heat dissipation device |
TW201031882A (en) | 2009-02-20 | 2010-09-01 | li-hua Qin | Planting and tightening method for cylindrical heat dissipation fins and application device thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20130124 |
|
R082 | Change of representative |
Representative=s name: MARSCHALL & PARTNER, DE Representative=s name: ELBPATENT - MARSCHALL & PARTNER PARTGMBB, DE |
|
R150 | Term of protection extended to 6 years | ||
R157 | Lapse of ip right after 6 years |