DE19882821T1 - Method and device for modeling a chemical mechanical polishing process - Google Patents
Method and device for modeling a chemical mechanical polishing processInfo
- Publication number
- DE19882821T1 DE19882821T1 DE19882821T DE19882821T DE19882821T1 DE 19882821 T1 DE19882821 T1 DE 19882821T1 DE 19882821 T DE19882821 T DE 19882821T DE 19882821 T DE19882821 T DE 19882821T DE 19882821 T1 DE19882821 T1 DE 19882821T1
- Authority
- DE
- Germany
- Prior art keywords
- modeling
- mechanical polishing
- chemical mechanical
- polishing process
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title 1
- 238000007517 polishing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US97255197A | 1997-11-18 | 1997-11-18 | |
PCT/US1998/024231 WO1999025520A1 (en) | 1997-11-18 | 1998-11-12 | Method and apparatus for modeling a chemical mechanical polishing process |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19882821T1 true DE19882821T1 (en) | 2001-05-10 |
Family
ID=25519800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19882821T Withdrawn DE19882821T1 (en) | 1997-11-18 | 1998-11-12 | Method and device for modeling a chemical mechanical polishing process |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2001523586A (en) |
KR (1) | KR20010032223A (en) |
DE (1) | DE19882821T1 (en) |
GB (1) | GB2346103A (en) |
WO (1) | WO1999025520A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2001249724A1 (en) * | 2000-04-03 | 2001-10-15 | Speed-Fam-Ipec Corporation | System and method for predicting software models using material-centric process instrumentation |
US7097534B1 (en) | 2000-07-10 | 2006-08-29 | Applied Materials, Inc. | Closed-loop control of a chemical mechanical polisher |
DE10065380B4 (en) | 2000-12-27 | 2006-05-18 | Infineon Technologies Ag | Method for characterizing and simulating a chemical-mechanical polishing process |
US20020192966A1 (en) * | 2001-06-19 | 2002-12-19 | Shanmugasundram Arulkumar P. | In situ sensor based control of semiconductor processing procedure |
US7160739B2 (en) * | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
DE10208165C1 (en) * | 2002-02-26 | 2003-10-02 | Advanced Micro Devices Inc | Method, control and device for controlling the chemical mechanical polishing of substrates |
JP4777658B2 (en) | 2002-11-22 | 2011-09-21 | アプライド マテリアルズ インコーポレイテッド | Method and apparatus for polishing control |
JP4266668B2 (en) * | 2003-02-25 | 2009-05-20 | 株式会社ルネサステクノロジ | Simulation device |
US7394554B2 (en) * | 2003-09-15 | 2008-07-01 | Timbre Technologies, Inc. | Selecting a hypothetical profile to use in optical metrology |
DE102005000645B4 (en) * | 2004-01-12 | 2010-08-05 | Samsung Electronics Co., Ltd., Suwon | Apparatus and method for treating substrates |
JP4952155B2 (en) * | 2006-09-12 | 2012-06-13 | 富士通株式会社 | Polishing condition prediction program, recording medium, polishing condition prediction apparatus, and polishing condition prediction method |
US8117568B2 (en) | 2008-09-25 | 2012-02-14 | International Business Machines Corporation | Apparatus, method and computer program product for fast simulation of manufacturing effects during integrated circuit design |
JP6782145B2 (en) * | 2016-10-18 | 2020-11-11 | 株式会社荏原製作所 | Board processing control system, board processing control method, and program |
SG11201902651QA (en) | 2016-10-18 | 2019-05-30 | Ebara Corp | Substrate processing control system, substrate processing control method, and program |
JP6753758B2 (en) * | 2016-10-18 | 2020-09-09 | 株式会社荏原製作所 | Polishing equipment, polishing methods and programs |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5599423A (en) * | 1995-06-30 | 1997-02-04 | Applied Materials, Inc. | Apparatus and method for simulating and optimizing a chemical mechanical polishing system |
US5637031A (en) * | 1996-06-07 | 1997-06-10 | Industrial Technology Research Institute | Electrochemical simulator for chemical-mechanical polishing (CMP) |
-
1998
- 1998-11-12 KR KR1020007005419A patent/KR20010032223A/en not_active Application Discontinuation
- 1998-11-12 DE DE19882821T patent/DE19882821T1/en not_active Withdrawn
- 1998-11-12 GB GB0010451A patent/GB2346103A/en not_active Withdrawn
- 1998-11-12 WO PCT/US1998/024231 patent/WO1999025520A1/en not_active Application Discontinuation
- 1998-11-12 JP JP2000520940A patent/JP2001523586A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO1999025520A1 (en) | 1999-05-27 |
JP2001523586A (en) | 2001-11-27 |
GB2346103A (en) | 2000-08-02 |
GB0010451D0 (en) | 2000-06-14 |
KR20010032223A (en) | 2001-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8139 | Disposal/non-payment of the annual fee |