DE19719174A1 - Multilayer ceramic electrical component with sintered monolithic body - Google Patents
Multilayer ceramic electrical component with sintered monolithic bodyInfo
- Publication number
- DE19719174A1 DE19719174A1 DE19719174A DE19719174A DE19719174A1 DE 19719174 A1 DE19719174 A1 DE 19719174A1 DE 19719174 A DE19719174 A DE 19719174A DE 19719174 A DE19719174 A DE 19719174A DE 19719174 A1 DE19719174 A1 DE 19719174A1
- Authority
- DE
- Germany
- Prior art keywords
- layers
- contact layers
- electrical component
- multilayer ceramic
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005245 sintering Methods 0.000 abstract description 4
- 239000004411 aluminium Substances 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
Die vorliegende Erfindung betrifft ein elektrisches Viel schichtbauelement nach dem Oberbegriff des Patentanspruchs.The present invention relates to an electrical lot Layer component according to the preamble of the claim.
Aus der US-PS 3 679 950 sind monolithische Kondensatoren be kannt, welche dünne Schichten aus dielektrischem Material und zwischen diesen befindliche Kontaktschichten aus leitendem Material aufweisen. Die Kontaktschichten aus leitendem Mate rial sind so ausgebildet, daß sie alternierend zu sich gegen überliegenden Endflachen des Kondensators verlaufen und durch metallische Elektroden ihre Enden elektrisch miteinander ver bunden sind.Monolithic capacitors are known from US Pat. No. 3,679,950 knows which thin layers of dielectric material and contact layers of conductive between them Have material. The contact layers made of conductive mate rial are designed so that they alternate against each other overlying end faces of the capacitor and through metallic electrodes ver verge their ends together are bound.
Bisher werden als Kontaktschichten insbesondere bei Viel schichtkondensatoren hauptsächlich Ag/Pd-Legierungen verwen det.So far, as contact layers, especially at Viel Layer capacitors mainly use Ag / Pd alloys det.
Die Herstellung von Kaltleitern in Vielschichttechnologie ge staltet sich schwieriger, da Edelmetalle für die Kontakt schichten nicht geeignet sind, da sie keinen ohmschen Kontakt zur Keramik aufbauen können.The production of PTC thermistors in multi-layer technology is more difficult because precious metals for the contact layers are not suitable since they have no ohmic contact can build up to ceramics.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, auch eine Möglichkeit zur Herstellung von Kaltleitern in Viel schichttechnologie zu schaffen.The present invention is based on the object, too a possibility for the production of PTC thermistors in a lot to create layer technology.
Diese Aufgabe wird bei einem elektrischen Vielschichtbauele ment in Form eines Vielschicht-Kaltleiters durch die Maßnahme des kennzeichnenden Teils des Patentanspruchs gelöst. Eine Weiterbildung der Erfindung ist Gegenstand eines Unteran spruchs. This task is done with an electrical multilayer component ment in the form of a multilayer PTC thermistor through the measure of the characterizing part of the claim. A Further development of the invention is the subject of a sub saying.
Die Erfindung wird nachfolgenden anhand eines Ausführungsbei spiels gemäß der einzigen Figur der Zeichnung näher erläu tert, welche eine schematische Darstellung des generellen Aufbaus eines elektrischen Vielschichtbauelementes zeigt.The invention is illustrated below with the aid of an embodiment game according to the single figure of the drawing tert, which is a schematic representation of the general Structure of an electrical multilayer component shows.
Die Figur der Zeichnung zeigt in vergrößertem Maßstab ein mo nolithisches elektrisches Vielschichtwiderstandselement 1 mit Schichten 2 aus keramischem Material und Kontaktschichten 3 aus elektrisch leitendem Material zwischen den Schichten 2 aus keramischem Material. Die leitenden Kontaktschichten 3 sind so ausgebildet, daß sie alternierend zu sich gegenüber liegenden Endflächen des Vielschichtwiderstandselementes 1 verlaufen und an ihren Enden in an sich bekannter Weise durch metallische Elektroden 4 und 5 elektrisch miteinander verbun den sind. Durch die alternierende Anordnung der elektrisch leitenden Kontaktschichten 3 im oben beschriebenen Sinne ent stehen jeweils Bereiche 6 der Schichten 2 aus keramischem Ma terial, welche jeweils jede zweite Kontaktschicht 3 aus lei tendem Material von den metallischen Elektroden 4 und 5 tren nen. Die Herstellung eines derartigen Vielschichtwiderstand selementes kann wie folgt durchgeführt werden. Zunächst wer den durch Folienziehen oder Pressen Grünkörper entsprechend den Schichten 2 aus keramischem Material hergestellt. Sodann wird das Bauelement entsprechend der Figur der Zeichnung mit Aluminiumpaste für die Kontaktschichten hergestellt und der Körper durch Pressen und Schneiden in die gewünschte Form ge bracht. Schließlich wird der so geformte Körper durch Sintern mit entsprechendem Temperaturprofil und in variabler Gasatmo sphäre einer Endbehandlung unterworfen.The figure of the drawing shows on an enlarged scale a monolithic electrical multilayer resistance element 1 with layers 2 of ceramic material and contact layers 3 of electrically conductive material between the layers 2 of ceramic material. The conductive contact layers 3 are formed so that they are alternately extending to opposite end faces of the multilayer resistor element 1 and at its ends in known manner by metallic electrodes 4 and 5 are electrically verbun each other to. Due to the alternating arrangement of the electrically conductive contact layers 3 in the sense described above, areas 6 of the layers 2 made of ceramic material are formed, which separate each second contact layer 3 of conductive material from the metallic electrodes 4 and 5 . The production of such a multilayer resistor element can be carried out as follows. First, who the green body according to the layers 2 made of ceramic material by film or pressing. Then the component is made according to the figure of the drawing with aluminum paste for the contact layers and the body is brought into the desired shape by pressing and cutting. Finally, the body thus shaped is subjected to a final treatment by sintering with a corresponding temperature profile and in a variable gas atmosphere.
Versuche haben gezeigt, daß sich Aluminiumpaste oder alumini umhaltige Paste für die Kontaktschichten 3 besonders gut eig net. An Luft sind dabei Sintertemperaturen vollständiger Bau elemente bis oberhalb von 1200°C möglich. Die Sintertempera tur kann durch Verwendung einer Inertgasatmosphäre wie Stick stoff oder Edelgasen mit Sauerstoffrestgehalten kleiner als 10-5 atm noch gesteigert werden.Experiments have shown that aluminum paste or aluminum-containing paste for the contact layers 3 is particularly suitable. Sintering temperatures of complete components up to above 1200 ° C are possible in air. The sintering temperature can be increased by using an inert gas atmosphere such as nitrogen or noble gases with residual oxygen contents of less than 10 -5 atm.
Mit Aluminium für die Kontaktschichten 3 ist es prinzipiell möglich, Vielschicht-Kaltleiter herzustellen und die Ferti gungskosten für keramische Vielschichtbauelemente wie Viel schicht-Kondensatoren zu senken. Dabei ergibt sich der zu sätzliche Vorteil, daß kostengünstigeres Material für die Kontaktschichten 3 im Vergleich zu herkömmlichen Edelmetallen in Vielschichtbauelementen verwendbar ist.With aluminum for the contact layers 3 , it is in principle possible to produce multilayer PTC thermistors and to reduce the production costs for ceramic multilayer components such as multilayer capacitors. This has the additional advantage that less expensive material for the contact layers 3 can be used in comparison with conventional noble metals in multilayer components.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19719174A DE19719174A1 (en) | 1997-05-06 | 1997-05-06 | Multilayer ceramic electrical component with sintered monolithic body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19719174A DE19719174A1 (en) | 1997-05-06 | 1997-05-06 | Multilayer ceramic electrical component with sintered monolithic body |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19719174A1 true DE19719174A1 (en) | 1998-11-12 |
Family
ID=7828812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19719174A Ceased DE19719174A1 (en) | 1997-05-06 | 1997-05-06 | Multilayer ceramic electrical component with sintered monolithic body |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE19719174A1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19945641A1 (en) * | 1999-09-23 | 2001-04-05 | Abb Research Ltd | Resistance element for an electrical network and/or an electronic component has a resistance body made of a ceramic interspersed with metal |
DE10018377C1 (en) * | 2000-04-13 | 2001-12-06 | Epcos Ag | Ceramic multilayered component used as a PTC resistance element comprises a stack of PTC ceramic layers with tungsten electrodes on both sides connected to a monolithic body |
WO2002089160A2 (en) * | 2001-04-26 | 2002-11-07 | Epcos Ag | Electrical multilayer component and method for the production thereof |
WO2003092019A1 (en) * | 2002-04-23 | 2003-11-06 | Epcos Ag | Positive temperature coefficient (ptc) component and method for the production thereof |
US7154736B2 (en) | 2001-05-08 | 2006-12-26 | Epcos Ag | Ceramic multi-layer element and a method for the production thereof |
EP2306474A1 (en) | 2009-09-30 | 2011-04-06 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic component and method for producing laminated ceramic electronic component |
WO2013026660A1 (en) * | 2011-08-19 | 2013-02-28 | Siemens Aktiengesellschaft | Piezoceramic multilayer component |
WO2013037559A1 (en) | 2011-09-15 | 2013-03-21 | Epcos Ag | Multi-layer component and method for producing same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54149715A (en) * | 1978-05-17 | 1979-11-24 | Tdk Electronics Co Ltd | High dielectric porcelain composition |
EP0734031A2 (en) * | 1995-03-24 | 1996-09-25 | TDK Corporation | Multilayer varistor |
-
1997
- 1997-05-06 DE DE19719174A patent/DE19719174A1/en not_active Ceased
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54149715A (en) * | 1978-05-17 | 1979-11-24 | Tdk Electronics Co Ltd | High dielectric porcelain composition |
EP0734031A2 (en) * | 1995-03-24 | 1996-09-25 | TDK Corporation | Multilayer varistor |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19945641A1 (en) * | 1999-09-23 | 2001-04-05 | Abb Research Ltd | Resistance element for an electrical network and/or an electronic component has a resistance body made of a ceramic interspersed with metal |
DE10018377C1 (en) * | 2000-04-13 | 2001-12-06 | Epcos Ag | Ceramic multilayered component used as a PTC resistance element comprises a stack of PTC ceramic layers with tungsten electrodes on both sides connected to a monolithic body |
WO2002089160A2 (en) * | 2001-04-26 | 2002-11-07 | Epcos Ag | Electrical multilayer component and method for the production thereof |
DE10120517A1 (en) * | 2001-04-26 | 2002-11-21 | Epcos Ag | Electrical multilayer component and method for its production |
WO2002089160A3 (en) * | 2001-04-26 | 2003-07-17 | Epcos Ag | Electrical multilayer component and method for the production thereof |
DE10120517B4 (en) * | 2001-04-26 | 2013-06-06 | Epcos Ag | Electrical multilayer PTC thermistor and method for its production |
US6898071B2 (en) | 2001-04-26 | 2005-05-24 | Epcos Ag | Electrical multilayer component and method for the production thereof |
US7154736B2 (en) | 2001-05-08 | 2006-12-26 | Epcos Ag | Ceramic multi-layer element and a method for the production thereof |
US7633374B2 (en) | 2002-04-23 | 2009-12-15 | Epcos Ag | Positive temperature coefficient (PTC) component and method for the production thereof |
WO2003092019A1 (en) * | 2002-04-23 | 2003-11-06 | Epcos Ag | Positive temperature coefficient (ptc) component and method for the production thereof |
EP2306474A1 (en) | 2009-09-30 | 2011-04-06 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic component and method for producing laminated ceramic electronic component |
EP2500919A1 (en) | 2009-09-30 | 2012-09-19 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic component and method for producing laminated ceramic electronic component |
US9129745B2 (en) | 2009-09-30 | 2015-09-08 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic component and method for producing laminated ceramic electronic component |
WO2013026660A1 (en) * | 2011-08-19 | 2013-02-28 | Siemens Aktiengesellschaft | Piezoceramic multilayer component |
WO2013037559A1 (en) | 2011-09-15 | 2013-03-21 | Epcos Ag | Multi-layer component and method for producing same |
DE102011113496A1 (en) | 2011-09-15 | 2013-03-21 | Epcos Ag | Multi-layer component and method for its production |
US9583262B2 (en) | 2011-09-15 | 2017-02-28 | Epcos Ag | Multi-layer component and method for producing same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: EPCOS AG, 81541 MUENCHEN, DE |
|
8131 | Rejection |