DE19681566T1 - Copper alloy foils for flexible current paths - Google Patents
Copper alloy foils for flexible current pathsInfo
- Publication number
- DE19681566T1 DE19681566T1 DE1996181566 DE19681566T DE19681566T1 DE 19681566 T1 DE19681566 T1 DE 19681566T1 DE 1996181566 DE1996181566 DE 1996181566 DE 19681566 T DE19681566 T DE 19681566T DE 19681566 T1 DE19681566 T1 DE 19681566T1
- Authority
- DE
- Germany
- Prior art keywords
- copper alloy
- current paths
- flexible current
- alloy foils
- foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0846—Parallel wires, fixed upon a support layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/529,265 US5681662A (en) | 1995-09-15 | 1995-09-15 | Copper alloy foils for flexible circuits |
US529,265 | 1995-09-15 | ||
PCT/US1996/014303 WO1997010689A1 (en) | 1995-09-15 | 1996-09-05 | Copper alloy foils for flexible circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19681566T1 true DE19681566T1 (en) | 1998-08-20 |
DE19681566B3 DE19681566B3 (en) | 2012-11-22 |
Family
ID=24109181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19681566T Expired - Lifetime DE19681566B3 (en) | 1995-09-15 | 1996-09-05 | Copper alloy foils for flexible current paths |
Country Status (8)
Country | Link |
---|---|
US (1) | US5681662A (en) |
JP (1) | JP3544672B2 (en) |
KR (1) | KR100441185B1 (en) |
AU (1) | AU6915896A (en) |
DE (1) | DE19681566B3 (en) |
GB (1) | GB2320978B (en) |
SE (1) | SE519383C2 (en) |
WO (1) | WO1997010689A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014210914A1 (en) * | 2014-06-06 | 2015-12-17 | Conti Temic Microelectronic Gmbh | Flexible printed circuit board structure and the use of the flexible printed circuit board structure in a control unit for a motor vehicle |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6221176B1 (en) * | 1999-03-17 | 2001-04-24 | Gould Electronics, Inc. | Surface treatment of copper to prevent microcracking in flexible circuits |
DE19920593B4 (en) | 1999-05-05 | 2006-07-13 | Assa Abloy Identification Technology Group Ab | Chip carrier for a chip module and method for producing the chip module |
CN1195395C (en) * | 2001-01-30 | 2005-03-30 | 日鉱金属股份有限公司 | Copper alloy foil for integrated board |
KR100491385B1 (en) * | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
JP4391717B2 (en) * | 2002-01-09 | 2009-12-24 | 富士通マイクロエレクトロニクス株式会社 | Contactor, manufacturing method thereof and contact method |
WO2004024964A2 (en) * | 2002-09-13 | 2004-03-25 | Olin Corporation | Age-hardening copper-base alloy and processing |
US7265298B2 (en) * | 2003-05-30 | 2007-09-04 | The Regents Of The University Of California | Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device |
US20060289979A1 (en) * | 2003-08-26 | 2006-12-28 | God Ralf | Bridge modules for smart labels |
US7132158B2 (en) * | 2003-10-22 | 2006-11-07 | Olin Corporation | Support layer for thin copper foil |
TWI339087B (en) * | 2007-04-18 | 2011-03-11 | Ind Tech Res Inst | Stretchable flexible printed circuit (fpc) and fabricating method thereof |
US8357461B1 (en) * | 2008-11-13 | 2013-01-22 | Jackson John R | Earth electromotive force generation method and apparatus |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1750092A (en) * | 1921-11-26 | 1930-03-11 | Crawford Robert Brace Penn | Electroplating process |
US3247082A (en) * | 1962-08-07 | 1966-04-19 | Harshaw Chem Corp | Electrodeposition of a corrosion resistant coating |
US3677828A (en) * | 1970-07-30 | 1972-07-18 | Olin Corp | Tarnish resistant copper and copper alloys |
US3857683A (en) * | 1973-07-27 | 1974-12-31 | Mica Corp | Printed circuit board material incorporating binary alloys |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4441118A (en) * | 1983-01-13 | 1984-04-03 | Olin Corporation | Composite copper nickel alloys with improved solderability shelf life |
US4515671A (en) * | 1983-01-24 | 1985-05-07 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4552627A (en) * | 1984-11-13 | 1985-11-12 | Olin Corporation | Preparation for improving the adhesion properties of metal foils |
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
US4549941A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces |
US4728372A (en) * | 1985-04-26 | 1988-03-01 | Olin Corporation | Multipurpose copper alloys and processing therefor with moderate conductivity and high strength |
US4594221A (en) * | 1985-04-26 | 1986-06-10 | Olin Corporation | Multipurpose copper alloys with moderate conductivity and high strength |
US4888574A (en) * | 1985-05-29 | 1989-12-19 | 501 Ohmega Electronics, Inc. | Circuit board material and method of making |
US4647315A (en) * | 1985-07-01 | 1987-03-03 | Olin Corporation | Copper stainproofing technique |
US4810310A (en) * | 1986-05-27 | 1989-03-07 | Olin Corporation | Composites having improved resistance to stress relaxation |
US4756795A (en) * | 1986-10-31 | 1988-07-12 | International Business Machines Corporation | Raw card fabrication process with nickel overplate |
US4908275A (en) * | 1987-03-04 | 1990-03-13 | Nippon Mining Co., Ltd. | Film carrier and method of manufacturing same |
US4822693A (en) * | 1987-03-23 | 1989-04-18 | Olin Corporation | Copper-iron-nickel composite material for electrical and electronic applications |
US4789438A (en) * | 1987-06-23 | 1988-12-06 | Olin Corporation | Cathode surface treatment for electroforming metallic foil or strip |
DE69005691T2 (en) * | 1989-05-02 | 1994-04-28 | Nikko Gould Foil Co | Treatment of copper foil for printed circuits. |
JPH0818401B2 (en) * | 1989-05-17 | 1996-02-28 | 福田金属箔粉工業株式会社 | Composite foil and its manufacturing method |
US5230932A (en) * | 1989-10-13 | 1993-07-27 | Olin Corporation | Chromium-zinc anti-tarnish coating for copper foil |
US4997517A (en) * | 1990-01-09 | 1991-03-05 | Olin Corporation | Multi-metal layer interconnect tape for tape automated bonding |
US5145553A (en) * | 1991-05-06 | 1992-09-08 | International Business Machines Corporation | Method of making a flexible circuit member |
US5306465A (en) * | 1992-11-04 | 1994-04-26 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
JPH06172895A (en) * | 1992-12-03 | 1994-06-21 | Yamaha Metanikusu Kk | Copper alloy for lead frame |
-
1995
- 1995-09-15 US US08/529,265 patent/US5681662A/en not_active Expired - Lifetime
-
1996
- 1996-09-05 DE DE19681566T patent/DE19681566B3/en not_active Expired - Lifetime
- 1996-09-05 JP JP51200797A patent/JP3544672B2/en not_active Expired - Fee Related
- 1996-09-05 AU AU69158/96A patent/AU6915896A/en not_active Abandoned
- 1996-09-05 WO PCT/US1996/014303 patent/WO1997010689A1/en active IP Right Grant
- 1996-09-05 GB GB9804776A patent/GB2320978B/en not_active Expired - Fee Related
- 1996-09-05 KR KR10-1998-0701917A patent/KR100441185B1/en not_active IP Right Cessation
-
1998
- 1998-03-13 SE SE9800830A patent/SE519383C2/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014210914A1 (en) * | 2014-06-06 | 2015-12-17 | Conti Temic Microelectronic Gmbh | Flexible printed circuit board structure and the use of the flexible printed circuit board structure in a control unit for a motor vehicle |
Also Published As
Publication number | Publication date |
---|---|
SE9800830L (en) | 1998-03-13 |
JP3544672B2 (en) | 2004-07-21 |
US5681662A (en) | 1997-10-28 |
WO1997010689A1 (en) | 1997-03-20 |
DE19681566B3 (en) | 2012-11-22 |
GB9804776D0 (en) | 1998-04-29 |
KR100441185B1 (en) | 2004-11-06 |
SE519383C2 (en) | 2003-04-15 |
KR19990044663A (en) | 1999-06-25 |
SE9800830D0 (en) | 1998-03-13 |
GB2320978A (en) | 1998-07-08 |
JPH11513325A (en) | 1999-11-16 |
AU6915896A (en) | 1997-04-01 |
GB2320978B (en) | 1999-07-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
R018 | Grant decision by examination section/examining division | ||
R020 | Patent grant now final |
Effective date: 20130223 |
|
R071 | Expiry of right |